main
Ray Publish 0.1.0 a9a171a 10d ago

BR93G66NUX-3TTR

ROHM Semicon · Pre-ordered Chips · VSON-8(2x3)

BR93G66NUX-3TTR from ROHM Semicon, in a VSON-8(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip select input; must be held low at power ON/OFF, and when low all inputs are cancelled and the device is in standby.
2 SK input Serial clock input; DI is sampled on the rising edge of SK, and the built-in Schmitt trigger has about 0.2V hysteresis.
3 DI input Start bit, ope code, address, and serial data input.
4 DO output Serial data output and READY/BUSY STATUS output; High-Z except during READY/BUSY status and read data output.
5 GND power_in Ground, the 0V reference voltage for all inputs and outputs.
6 ORG input Pin 6 is ORG for the blank pin-assignment code (no 'A') in the part numbering table; the datasheet gives no function or pin description for ORG.
7 DU passive Don't-use terminal; may be set to high, low, or left open.
8 VCC power_in Supply voltage, 1.7V to 5.5V recommended operating range (absolute maximum -0.3 to +6.5V).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package VSON-8(2x3)
Category Interface ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6.5 V 2
Permissible Dissipation (VSON008X2030) Pd 300 mW Derate by 3.0mW/°C when operating above Ta=25°C 2
Storage Temperature Tstg -65 150 °C 2
Operating Temperature Topr -40 85 °C 2
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition 2
Write Cycles 1e+06 Times Ta=25°C 2
Data Retention 40 Years Ta=25°C 2
Supply Voltage (recommended) VCC 1.7 5.5 V 2
Input Low Voltage VIL -0.3 V 1.7V≤VCC≤5.5V 3
Output Low Voltage 1 VOL1 0 0.4 V IOL=2.1mA, 2.7V≤VCC≤5.5V 3
Output Low Voltage 2 VOL2 0 0.2 V IOL=100μA 3
Output High Voltage 1 VOH1 2.4 V IOH=-0.4mA, 2.7V≤VCC≤5.5V 3
Input Leakage Current 1 ILI1 -1 1 µA VIN=0V to VCC(CS,SK,DI) 3
Output Leakage Current ILO -1 1 µA VOUT=0V to VCC, CS=0V 3
Supply Current (WRITE) ICC1 1 mA VCC=1.7V, fSK=1MHz, tE/W=5ms (WRITE) 3
Supply Current (WRITE) ICC1 2 mA VCC=5.5V, fSK=3MHz, tE/W=5ms (WRITE) 3
Supply Current (READ) ICC2 0.5 mA fSK=1MHz (READ) 3
Supply Current (READ) ICC2 1 mA fSK=3MHz (READ) 3
Supply Current (WRAL, ERAL) ICC3 2 mA VCC=2.5V, fSK=1MHz, tE/W=5ms (WRAL, ERAL) 3
Supply Current (WRAL, ERAL) ICC3 3 mA VCC=5.5V, fSK=3MHz, tE/W=5ms (WRAL, ERAL) 3
Standby Current ISB1 2 µA CS=0V 3
SK Frequency fSK 1 MHz VCC=1.7V to 2.5V 4
SK High Time tSKH 250 ns VCC=1.7V to 2.5V 4
SK Low Time tSKL 250 ns VCC=1.7V to 2.5V 4
CS Low Time tCS 250 ns VCC=1.7V to 2.5V 4
CS Setup Time tCSS 200 ns VCC=1.7V to 2.5V 4
DI Setup Time tDIS 100 ns VCC=1.7V to 2.5V 4
CS Hold Time tCSH 0 ns VCC=1.7V to 2.5V 4
DI Hold Time tDIH 100 ns VCC=1.7V to 2.5V 4
Data “1” Output Delay tPD1 400 ns VCC=1.7V to 2.5V 4
Data “0” Output Delay tPD0 400 ns VCC=1.7V to 2.5V 4
Time from CS to Output Establishment tSV 400 ns VCC=1.7V to 2.5V 4
Time from CS to High-Z tDF 200 ns VCC=1.7V to 2.5V 4
Write Cycle Time tE/W 5 ms VCC=1.7V to 2.5V 4
SK Frequency fSK 2 MHz VCC=2.5V to 4.5V 4
SK High Time tSKH 230 ns VCC=2.5V to 4.5V 4
SK Low Time tSKL 200 ns VCC=2.5V to 4.5V 4
CS Low Time tCS 200 ns VCC=2.5V to 4.5V 4
CS Setup Time tCSS 50 ns VCC=2.5V to 4.5V 4
Data “1” Output Delay tPD1 200 ns VCC=2.5V to 4.5V 4
Data “0” Output Delay tPD0 200 ns VCC=2.5V to 4.5V 4
Time from CS to Output Establishment tSV 150 ns VCC=2.5V to 4.5V 4
Time from CS to High-Z tDF 100 ns VCC=2.5V to 4.5V 4
SK Frequency fSK 3 MHz VCC=4.5V to 5.5V 4
SK High Time tSKH 100 ns VCC=4.5V to 5.5V 4
SK Low Time tSKL 100 ns VCC=4.5V to 5.5V 4
DI Setup Time tDIS 50 ns VCC=4.5V to 5.5V 4
DI Hold Time tDIH 50 ns VCC=4.5V to 5.5V 4

CAD (KiCad official)

  • Symbol: BR93G66NUX-3TTR
  • Footprint: Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
  • 3D model: VSON-8(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: br93g66nux-3ttr-etched.step / br93g66nux-3ttr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br93g66nux-3ttr.step / br93g66nux-3ttr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (39 pp, sha256 be98e6b452dc691c, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF