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BR93A46RFJ-WME2
Public Made by Adomby adom
ROHM Semicon Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBR93A46RFJ-WME2
ROHM Semicon · Pre-ordered Chips · SOIC-8
BR93A46RFJ-WME2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip select input. |
| 2 | SK | input | Serial clock input; DI is taken on the rise of SK, with a maximum frequency of 2MHz. |
| 3 | DI | input | Start bit, op code, address and serial data input. |
| 4 | DO | tri_state | Serial data output and READY/BUSY internal condition display output; High-Z while CS is low. |
| 5 | GND | power_in | All input/output reference voltage, 0V. |
| 6 | NC | unconnected | Non connected terminal; may be connected to Vcc, GND or left open. |
| 7 | NC | unconnected | Non connected terminal; may be connected to Vcc, GND or left open. |
| 8 | Vcc | power_in | Power source, 2.5V to 5.5V single supply operation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| L input voltage 1 | VIL1 | -0.3 | 0.8 | V | 4.0V≦VCC≦5.5V | 2 | |
| L input voltage 2 (lower limit only; max is 0.2 x VCC) | VIL2 | -0.3 | V | VCC≦4.0V | 2 | ||
| H input voltage 1 (min only; max is VCC+0.3) | VIH1 | 2 | V | 4.0V≦VCC≦5.5V | 2 | ||
| L output voltage 1 | VOL1 | 0 | 0.4 | V | IOL=2.1mA, 4.0V≦VCC≦5.5V | 2 | |
| L output voltage 2 | VOL2 | 0 | 0.2 | V | IOL=100μA | 2 | |
| H output voltage 1 (min only; max is VCC) | VOH1 | 2.4 | V | IOH=-0.4mA, 4.0V≦VCC≦5.5V | 2 | ||
| Input leak current | ILI | -1 | 1 | µA | VIN=0V to VCC | 2 | |
| Output leak current | ILO | -1 | 1 | µA | VOUT=0V to VCC, CS=0V | 2 | |
| Current consumption (WRITE) | ICC1 | 3 | mA | fSK=2MHz, tE/W=5ms (WRITE) | 2 | ||
| Current consumption (READ) | ICC2 | 1.5 | mA | fSK=2MHz (READ) | 2 | ||
| Current consumption (WRAL, ERAL) | ICC3 | 4.5 | mA | fSK=2MHz, tE/W=5ms (WRAL, ERAL) | 2 | ||
| Standby current | ISB | 2 | µA | CS=0V, DO=OPEN | 2 | ||
| SK frequency | fSK | 2 | MHz | 2.5V≦VCC≦5.5V | 3 | ||
| SK H time | tSKH | 230 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| SK L time | tSKL | 230 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| CS L time | tCS | 200 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| CS setup time | tCSS | 50 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| DI setup time | tDIS | 100 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| CS hold time | tCSH | 0 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| DI hold time | tDIH | 100 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| Data 1 output delay time | tPD1 | 200 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| Data 0 output delay time | tPD0 | 200 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| Time from CS to output establishment | tSV | 150 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| Time from CS to High-Z | tDF | 150 | ns | 2.5V≦VCC≦5.5V | 3 | ||
| Write cycle time | tE/W | 5 | ms | 2.5V≦VCC≦5.5V | 3 | ||
| Supply voltage | VCC | -0.3 | 6.5 | V | Ta=25℃ | 2 | |
| Permissible dissipation (SOP-J8) | Pd | 0.45 | W | SOP-J8; at Ta=25℃ or higher, 4.5mW to be reduced per 1℃ | 2 | ||
| Storage temperature range | Tstg | -65 | 125 | ℃ | 2 | ||
| Operating temperature range | Topr | -40 | 105 | ℃ | 2 | ||
| Terminal voltage (lower limit only; max is VCC+0.3) | -0.3 | V | 2 | ||||
| Power source voltage | VCC | 2.5 | 5.5 | V | 2 | ||
| Input voltage (min only; max is VCC) | VIN | 0 | V | 2 | |||
| Endurance | 1e+06 | Times | Ta≦25℃; not 100% tested | 2 | |||
| Endurance | 100000 | Times | Ta≦105℃; not 100% tested | 2 | |||
| Data retention | 40 | Years | Ta≦25℃; not 100% tested | 2 | |||
| Data retention | 10 | Years | Ta≦105℃; not 100% tested | 2 |
CAD (KiCad official)
- Symbol:
BR93A46RFJ-WME2 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
br93a46rfj-wme2-etched.step/br93a46rfj-wme2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);br93a46rfj-wme2.step/br93a46rfj-wme2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (32 pp, sha256
4638eaade499151d, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).