# BR25A1MFJ-3MGE2

**ROHM Semicon** · EEPROM · SOIC-8

BR25A1MFJ-3MGE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CSB | input | Chip select input for the SPI bus. |
| 2 | SO | output | Serial data output. |
| 3 | WPB | input | Write protect input; the write status register command is prohibited while this input is active. |
| 4 | GND | power_in | All input/output reference voltage, 0V. |
| 5 | SI | input | Operation code, address, and serial data input. |
| 6 | SCK | input | Serial clock input. |
| 7 | HOLDB | input | Hold input; command communications may be suspended temporarily (HOLD status). |
| 8 | Vcc | power_in | Power source to be connected. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `BR25A1MFJ-3MGE2`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `br25a1mfj-3mge2-etched.step` / `br25a1mfj-3mge2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `br25a1mfj-3mge2.step` / `br25a1mfj-3mge2.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](docs/br25a1mfj-3mge2-datasheet.pdf) (30 pp, sha256 `0d7ba7026ddf7b2f`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/br25a1mfj-3mge2-datasheet.pdf)