component

BR24T16FJ-WE2

Public Made by Adom

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ROHM Semicon EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentmemorybr24t16fj-we2factory-2.0.0extractor-text

Verified BR24T16FJ-WE2

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BR24T16FJ-WE2 · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 41-page datasheet
  • ✓distributor: lcsc C2061201, digikey BR24T16FJ-WE2TR-ND, mouser 755-BR24T16FJ-WE2
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-jia_w53c/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ br24t16fj-we2.kicad_sym✓ br24t16fj-we2.kicad_mod✓ br24t16fj-we2.step
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Ray Publish 0.1.0 ee25671 11d ago

BR24T16FJ-WE2

ROHM Semicon · EEPROM · SOIC-8

BR24T16FJ-WE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Not used as a device address pin (datasheet says don't use); may be set to H, L or Hi-Z.
2 A1 input Not used as a device address pin (datasheet says don't use); may be set to H, L or Hi-Z.
3 A2 input Not used as a device address pin (datasheet says don't use); may be set to H, L or Hi-Z.
4 GND power_in Reference voltage of all inputs and outputs, 0V.
5 SDA bidirectional Serial data input and serial data output.
6 SCL input Serial clock input.
7 WP input Write protect terminal.
8 VCC power_in Power source connection, 1.6V to 5.5V operating range.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 6.5 V Ta=25°C 2
Power Dissipation (SOP-J8) Pd 450 mW Derate by 4.5mW/°C above Ta=25°C; mounted on 114.5×101.5×1.6mm glass epoxy 2
Storage Temperature Tstg -65 150 °C 2
Operating Temperature Topr -40 85 °C 2
Input/Output Voltage -0.3 6.5 V -0.3 to Vcc+1.0, max not over 6.5V; min -1.0V for pulse width 50ns or less 2
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition 2
ESD voltage (human body model) VESD -4000 4000 V 2
Power Source Voltage Vcc 1.6 5.5 V 2
Input Voltage VIN 0 V 0 to Vcc 2
Write Cycles 1e+06 Times Ta=25°C, Vcc=1.6V to 5.5V; Not 100% tested 2
Data Retention 40 Years Ta=25°C, Vcc=1.6V to 5.5V; Not 100% tested 2
Input High Voltage1 VIH1 0.7 V 1.7V≤Vcc≤5.5V; min 0.7Vcc, max Vcc+1.0 2
Input Low Voltage1 VIL1 -0.3 V 1.7V≤Vcc≤5.5V; max +0.3Vcc; min -1.0V if pulse width 50ns or less 2
Input High Voltage2 VIH2 0.8 V 1.6V≤Vcc<1.7V; min 0.8Vcc, max Vcc+1.0 2
Input Low Voltage2 VIL2 -0.3 V 1.6V≤Vcc<1.7V; max +0.2Vcc; min -1.0V if pulse width 50ns or less 2
Output Low Voltage1 VOL1 0.4 V IOL=3.0mA, 2.5V≤Vcc≤5.5V (SDA) 2
Output Low Voltage2 VOL2 0.2 V IOL=0.7mA, 1.6V≤Vcc<2.5V (SDA) 2
Input Leakage Current ILI -1 1 µA VIN=0 to Vcc 2
Output Leakage Current ILO -1 1 µA VOUT=0 to Vcc (SDA) 2
Supply Current (Write) ICC1 2 mA Vcc=5.5V, fSCL=400kHz, tWR=5ms, Byte write, Page write 2
Supply Current (Read) ICC2 0.5 mA Vcc=5.5V, fSCL=400kHz, Random read, current read, sequential read 2
Standby Current ISB 2 µA Vcc=5.5V, SDA,SCL=Vcc, A0,A1,A2=GND, WP=GND 2
Clock Frequency fSCL 400 kHz 3
Data Clock High Period tHIGH 0.6 µs 3
Data Clock Low Period tLOW 1.2 µs 3
SDA,SCL (INPUT) Rise Time tR 1 µs Not 100% tested 3
SDA,SCL (INPUT) Fall Time tF1 1 µs Not 100% tested 3
SDA (OUTPUT) Fall Time tF2 0.3 µs Not 100% tested 3
Start Condition Hold Time tHD:STA 0.6 µs 3
Start Condition Setup Time tSU:STA 0.6 µs 3
Input Data Hold Time tHD:DAT 0 ns 3
Input Data Setup Time tSU:DAT 100 ns 3
Output Data Delay Time tPD 0.1 0.9 µs 3
Output Data Hold Time tDH 0.1 µs 3
Stop Condition Setup Time tSU:STO 0.6 µs 3
Bus Free Time tBUF 1.2 µs 3
Write Cycle Time tWR 5 ms 3
Noise Spike Width (SDA and SCL) tI 0.1 µs 3
WP Hold Time tHD:WP 1 µs 3
WP Setup Time tSU:WP 0.1 µs 3
WP High Period tHIGH:WP 1 µs 3
LVCC voltage 1.2 V At LVCC voltage or below, data rewrite is prevented 21

CAD (KiCad official)

  • Symbol: BR24T16FJ-WE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: br24t16fj-we2-etched.step / br24t16fj-we2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br24t16fj-we2.step / br24t16fj-we2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (41 pp, sha256 9d58a99dc13e9032, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF