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Ray Publish 0.1.0 acb4627 12d ago

BR24L16FJ-WE2

ROHM Semicon · Pre-ordered Chips · SOIC-8

BR24L16FJ-WE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Slave address setting pin, but for the BR24L16-W it is not connected (N.C.).
2 A1 input Slave address setting pin, but for the BR24L16-W it is not connected (N.C.).
3 A2 input Slave address setting pin, but for the BR24L16-W it is marked Don't Use in the pin configuration footnote.
4 GND power_in Reference voltage for all inputs and outputs, 0V.
5 SDA bidirectional Serial data terminal carrying the slave and word address and serial data input and output.
6 SCL input Serial clock input; inputs are read on the SCL rising edge and data is output in sync with the SCL falling edge.
7 WP input Write protect input: set LOW from the first data bit D0 clock rise until tWR to execute a write, and set HIGH to cancel the write (a write in progress is forcibly ended and the addressed data is not guaranteed).
8 Vcc power_in Power supply input; the datasheet specifies 1.7V to 5.5V for the BR24L16-W.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
HIGH input voltage 1 (min 0.7Vcc; max Vcc+1.0) VIH1 0.7 1 V 2.5≦Vcc≦5.5V; bounds printed relative to Vcc (min 0.7Vcc, max Vcc+1.0); *2 BR24L16/32-W 2
LOW input voltage 1 (max 0.3Vcc) VIL1 -0.3 0.3 V 2.5≦Vcc≦5.5V; max printed as 0.3Vcc; *2 BR24L16/32-W 2
HIGH input voltage 2 (min 0.8Vcc; max Vcc+1.0) VIH2 0.8 1 V 1.8≦Vcc<2.5V; bounds printed relative to Vcc (min 0.8Vcc, max Vcc+1.0); *2 BR24L16/32-W 2
LOW input voltage 2 (max 0.2Vcc) VIL2 -0.3 0.2 V 1.8≦Vcc<2.5V; max printed as 0.2Vcc; *2 BR24L16/32-W 2
HIGH input voltage 3 (*3 BR24L02/16-W; min 0.8Vcc; max Vcc+1.0) VIH3 0.8 1 V 1.7≦Vcc<1.8V; bounds printed relative to Vcc (min 0.8Vcc, max Vcc+1.0) 2
LOW input voltage 3 (*2 BR24L16/32-W; max 0.1Vcc) VIL3 -0.3 0.1 V 1.7≦Vcc<1.8V; max printed as 0.1Vcc 2
LOW output voltage 1 (SDA) VOL1 0.4 V IOL=3.0mA, 2.5V≦Vcc≦5.5V, (SDA) 2
LOW output voltage 2 (SDA) VOL2 0.2 V IOL=0.7mA, 1.7V≦Vcc<2.5V, (SDA) 2
Input leak current ILI -1 1 μA VIN=0V to Vcc 2
Output leak current (SDA) ILO -1 1 μA VOUT=0V to Vcc, (SDA) 2
Current consumption at byte write, page write action (*5 BR24L01A/02/04/08/16-W) ICC1 2 mA Vcc=5.5V,fSCL=400kHz, tWR=5ms 2
Current consumption at random read, current read, sequential read ICC2 0.5 mA Vcc=5.5V,fSCL=400kHz 2
Standby current ISB 2 μA Vcc=5.5V, SDA・SCL=Vcc, A0, A1, A2=GND, WP=GND 2
Supply voltage (absolute maximum) VCC -0.3 6.5 V 2
Power dissipation, SOP-J8 package Pd 450 mW SOP-J8; when using at Ta=25℃ or higher, 4.5mW to be reduced per 1℃ 2
Storage temperature Tstg -65 125 ℃ 2
Operating temperature Topr -40 85 ℃ 2
Terminal voltage (max printed as Vcc+1.0) -0.3 1 V max printed as Vcc+1.0 (relative to Vcc) 2
Power source voltage (recommended; footnote *1 BR24L02/16/32-W: 1.7V to 5.5V) Vcc 1.7 5.5 V BR24L02/16/32-W per footnote *1; series table prints 1.8 to 5.5 2
Input voltage (upper limit printed as Vcc) VIN 0 V upper limit printed as Vcc 2
Number of data rewrite times 1e+06 Times Ta=25℃, Vcc=1.8V to 5.5V (*1 BR24L02/16/32-W: 1.7V to 5.5V); *2 not 100% tested 2
Data hold years 40 Years Ta=25℃, Vcc=1.8V to 5.5V (*1 BR24L02/16/32-W: 1.7V to 5.5V); *2 not 100% tested 2
SCL frequency (FAST-MODE) fSCL 400 kHz FAST-MODE 2.5V≦Vcc≦5.5V 3
SCL frequency (STANDARD-MODE) fSCL 100 kHz STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Data clock HIGH time (FAST-MODE) tHIGH 0.6 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Data clock HIGH time (STANDARD-MODE) tHIGH 4 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Data clock LOW time (FAST-MODE) tLOW 1.2 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Data clock LOW time (STANDARD-MODE) tLOW 4.7 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
SDA, SCL rise time (FAST-MODE; *2 not 100% tested) tR 0.3 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
SDA, SCL rise time (STANDARD-MODE; *2 not 100% tested) tR 1 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
SDA, SCL fall time (FAST-MODE; *2 not 100% tested) tF 0.3 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
SDA, SCL fall time (STANDARD-MODE; *2 not 100% tested) tF 0.3 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Start condition hold time (FAST-MODE) tHD:STA 0.6 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Start condition hold time (STANDARD-MODE) tHD:STA 4 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Start condition setup time (FAST-MODE) tSU:STA 0.6 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Start condition setup time (STANDARD-MODE) tSU:STA 4.7 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Input data hold time (FAST-MODE) tHD:DAT 0 ns FAST-MODE 2.5V≦Vcc≦5.5V 3
Input data hold time (STANDARD-MODE) tHD:DAT 0 ns STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Input data setup time (FAST-MODE) tSU:DAT 100 ns FAST-MODE 2.5V≦Vcc≦5.5V 3
Input data setup time (STANDARD-MODE) tSU:DAT 250 ns STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Output data delay time (FAST-MODE) tPD 0.1 0.9 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Output data delay time (STANDARD-MODE) tPD 0.2 3.5 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Output data hold time (FAST-MODE) tDH 0.1 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Output data hold time (STANDARD-MODE) tDH 0.2 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Stop condition setup time (FAST-MODE) tSU:STO 0.6 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Stop condition setup time (STANDARD-MODE) tSU:STO 4.7 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Bus release time before transfer start (FAST-MODE) tBUF 1.2 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Bus release time before transfer start (STANDARD-MODE) tBUF 4.7 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Internal write cycle time (FAST-MODE) tWR 5 ms FAST-MODE 2.5V≦Vcc≦5.5V 3
Internal write cycle time (STANDARD-MODE) tWR 5 ms STANDARD-MODE 1.8V≦Vcc≦5.5V 3
Noise removal valid period, SDA and SCL terminal (FAST-MODE) tI 0.1 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
Noise removal valid period, SDA and SCL terminal (STANDARD-MODE) tI 0.1 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
WP hold time (FAST-MODE) tHD:WP 0 ns FAST-MODE 2.5V≦Vcc≦5.5V 3
WP hold time (STANDARD-MODE) tHD:WP 0 ns STANDARD-MODE 1.8V≦Vcc≦5.5V 3
WP setup time (FAST-MODE) tSU:WP 0.1 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
WP setup time (STANDARD-MODE) tSU:WP 0.1 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3
WP valid time (FAST-MODE) tHIGH:WP 1 μs FAST-MODE 2.5V≦Vcc≦5.5V 3
WP valid time (STANDARD-MODE) tHIGH:WP 1 μs STANDARD-MODE 1.8V≦Vcc≦5.5V 3

CAD (KiCad official)

  • Symbol: BR24L16FJ-WE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: br24l16fj-we2-etched.step / br24l16fj-we2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br24l16fj-we2.step / br24l16fj-we2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (39 pp, sha256 7f7d69eca6c5c3aa, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF