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Ray Publish 0.1.0 cabd46b 3h ago

BR24G32FVM-3AGTTR

ROHM Semicon · EEPROM · MSOP-8-2.8mm

BR24G32FVM-3AGTTR from ROHM Semicon, in a MSOP-8-2.8mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Slave address setting input; must not be left open (Note 1 on page 5).
2 A1 input Slave address setting input; must not be left open (Note 1 on page 5).
3 A2 input Slave address setting input; must not be left open (Note 1 on page 5).
4 GND power_in Reference voltage for all inputs and outputs, 0 V.
5 SDA bidirectional Serial data input and serial data output of the I2C bus.
6 SCL input Serial clock input of the I2C bus; input is read on the rising edge of SCL.
7 WP input Write protect terminal; controls write inhibition of the EEPROM.
8 VCC power_in Power supply connection; the datasheet specifies single supply operation from 1.6 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package MSOP-8-2.8mm
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Source Voltage VCC 1.6 5.5 V 2
Input Voltage VIN 0 V 2
Supply Voltage VCC -0.3 6.5 V 2
Input / Output Voltage -0.3 V Max is VCC+1.0 and not over 6.5V; min -1.0V when pulse width is 50ns or less 2
Permissible Dissipation (MSOP8) Pd 0.31 W Derate by 3.1mW/°C when operating above Ta=25°C 2
Storage Temperature Tstg -65 150 °C 2
Operating Temperature Topr -40 85 °C 2
Junction Temperature Tjmax 150 °C Junction temperature at the storage condition 2
Electrostatic discharge voltage (human body model) VESD -4000 4000 V Human body model 2
Input Low Voltage 1 VIL1 -0.3 V 1.7V≤VCC≤5.5V; min -1.0V when pulse width is 50ns or less 2
Input Low Voltage 2 VIL2 -0.3 V 1.6V≤VCC<1.7V; min -1.0V when pulse width is 50ns or less 2
Output Low Voltage 1 VOL1 0.4 V IOL=3.0mA, 2.5V≤VCC≤5.5V (SDA) 2
Output Low Voltage 2 VOL2 0.2 V IOL=0.7mA, 1.6V≤VCC<2.5V (SDA) 2
Input Leakage Current ILI -1 1 µA VIN=0 to VCC 2
Output Leakage Current ILO -1 1 µA VOUT=0 to VCC (SDA) 2
Supply Current (Write) ICC1 2 mA VCC=5.5V, fSCL=1MHz, tWR=5ms, Byte write, Page write 2
Supply Current (Read) ICC2 2 mA VCC=5.5V, fSCL=1MHz, Random read, current read, sequential read 2
Standby Current ISB 2 µA VCC=5.5V, SDA, SCL=VCC, A0, A1, A2=GND, WP=GND 2
Write Cycles 1e+06 Times Ta=25°C, VCC=1.6V to 5.5V; not 100% tested 2
Data Retention 40 Years Ta=25°C, VCC=1.6V to 5.5V; not 100% tested 2
Clock Frequency fSCL 400 kHz Limits (1.6V≤VCC≤5.5V), Ta=-40°C to +85°C 3
Data Clock High Period tHIGH 0.6 µs Limits (1.6V≤VCC≤5.5V) 3
Data Clock Low Period tLOW 1.2 µs Limits (1.6V≤VCC≤5.5V) 3
SDA, SCL (INPUT) Rise Time tR 1 µs Limits (1.6V≤VCC≤5.5V); not 100% tested 3
SDA, SCL (INPUT) Fall Time tF1 1 µs Limits (1.6V≤VCC≤5.5V); not 100% tested 3
SDA (OUTPUT) Fall Time tF2 0.3 µs Limits (1.6V≤VCC≤5.5V); not 100% tested 3
Start Condition Hold Time tHD:STA 0.6 µs Limits (1.6V≤VCC≤5.5V) 3
Start Condition Setup Time tSU:STA 0.6 µs Limits (1.6V≤VCC≤5.5V) 3
Input Data Hold Time tHD:DAT 0 ns Limits (1.6V≤VCC≤5.5V) 3
Input Data Setup Time tSU:DAT 100 ns Limits (1.6V≤VCC≤5.5V) 3
Output Data Delay Time tPD 0.1 0.9 µs 1.6V≤VCC<1.7V (Note2) 3
Output Data Delay Time tPD 0.05 0.9 µs 1.7V≤VCC≤5.5V (Note3) 3
Output Data Hold Time tDH 0.1 µs 1.6V≤VCC<1.7V (Note2) 3
Output Data Hold Time tDH 0.05 µs 1.7V≤VCC≤5.5V (Note3) 3
Stop Condition Setup Time tSU:STO 0.6 µs Limits (1.6V≤VCC≤5.5V) 3
Bus Free Time tBUF 1.2 µs Limits (1.6V≤VCC≤5.5V) 3
Write Cycle Time tWR 5 ms Limits (1.6V≤VCC≤5.5V) 3
Noise Spike Width (SDA, SCL) tI 0.05 µs Limits (1.6V≤VCC≤5.5V); not 100% tested 3
WP Hold Time tHD:WP 1 µs Limits (1.6V≤VCC≤5.5V) 3
WP Setup Time tSU:WP 0.1 µs Limits (1.6V≤VCC≤5.5V) 3
WP High Period tHIGH:WP 1 µs Limits (1.6V≤VCC≤5.5V) 3

CAD (KiCad official)

  • Symbol: BR24G32FVM-3AGTTR
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8-2.8mm (KiCad packages3D, STEP)
  • 3D model files: br24g32fvm-3agttr-etched.step / br24g32fvm-3agttr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br24g32fvm-3agttr.step / br24g32fvm-3agttr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (37 pp, sha256 96ba7c619be7f6b1, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF