component
BR24G32FVM-3AGTTR
Public Made by Adomby adom
ROHM Semicon EEPROM, MSOP-8-2.8mm. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BR24G32FVM-3AGTTR
ROHM Semicon · EEPROM · MSOP-8-2.8mm
BR24G32FVM-3AGTTR from ROHM Semicon, in a MSOP-8-2.8mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 2 | A1 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 3 | A2 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 4 | GND | power_in | Reference voltage for all inputs and outputs, 0 V. |
| 5 | SDA | bidirectional | Serial data input and serial data output of the I2C bus. |
| 6 | SCL | input | Serial clock input of the I2C bus; input is read on the rising edge of SCL. |
| 7 | WP | input | Write protect terminal; controls write inhibition of the EEPROM. |
| 8 | VCC | power_in | Power supply connection; the datasheet specifies single supply operation from 1.6 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | MSOP-8-2.8mm |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Source Voltage | VCC | 1.6 | 5.5 | V | 2 | ||
| Input Voltage | VIN | 0 | V | 2 | |||
| Supply Voltage | VCC | -0.3 | 6.5 | V | 2 | ||
| Input / Output Voltage | -0.3 | V | Max is VCC+1.0 and not over 6.5V; min -1.0V when pulse width is 50ns or less | 2 | |||
| Permissible Dissipation (MSOP8) | Pd | 0.31 | W | Derate by 3.1mW/°C when operating above Ta=25°C | 2 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 2 | ||
| Operating Temperature | Topr | -40 | 85 | °C | 2 | ||
| Junction Temperature | Tjmax | 150 | °C | Junction temperature at the storage condition | 2 | ||
| Electrostatic discharge voltage (human body model) | VESD | -4000 | 4000 | V | Human body model | 2 | |
| Input Low Voltage 1 | VIL1 | -0.3 | V | 1.7V≤VCC≤5.5V; min -1.0V when pulse width is 50ns or less | 2 | ||
| Input Low Voltage 2 | VIL2 | -0.3 | V | 1.6V≤VCC<1.7V; min -1.0V when pulse width is 50ns or less | 2 | ||
| Output Low Voltage 1 | VOL1 | 0.4 | V | IOL=3.0mA, 2.5V≤VCC≤5.5V (SDA) | 2 | ||
| Output Low Voltage 2 | VOL2 | 0.2 | V | IOL=0.7mA, 1.6V≤VCC<2.5V (SDA) | 2 | ||
| Input Leakage Current | ILI | -1 | 1 | µA | VIN=0 to VCC | 2 | |
| Output Leakage Current | ILO | -1 | 1 | µA | VOUT=0 to VCC (SDA) | 2 | |
| Supply Current (Write) | ICC1 | 2 | mA | VCC=5.5V, fSCL=1MHz, tWR=5ms, Byte write, Page write | 2 | ||
| Supply Current (Read) | ICC2 | 2 | mA | VCC=5.5V, fSCL=1MHz, Random read, current read, sequential read | 2 | ||
| Standby Current | ISB | 2 | µA | VCC=5.5V, SDA, SCL=VCC, A0, A1, A2=GND, WP=GND | 2 | ||
| Write Cycles | 1e+06 | Times | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 | |||
| Data Retention | 40 | Years | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 | |||
| Clock Frequency | fSCL | 400 | kHz | Limits (1.6V≤VCC≤5.5V), Ta=-40°C to +85°C | 3 | ||
| Data Clock High Period | tHIGH | 0.6 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Data Clock Low Period | tLOW | 1.2 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| SDA, SCL (INPUT) Rise Time | tR | 1 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 | ||
| SDA, SCL (INPUT) Fall Time | tF1 | 1 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 | ||
| SDA (OUTPUT) Fall Time | tF2 | 0.3 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 | ||
| Start Condition Hold Time | tHD:STA | 0.6 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Start Condition Setup Time | tSU:STA | 0.6 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Input Data Hold Time | tHD:DAT | 0 | ns | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Input Data Setup Time | tSU:DAT | 100 | ns | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Output Data Delay Time | tPD | 0.1 | 0.9 | µs | 1.6V≤VCC<1.7V (Note2) | 3 | |
| Output Data Delay Time | tPD | 0.05 | 0.9 | µs | 1.7V≤VCC≤5.5V (Note3) | 3 | |
| Output Data Hold Time | tDH | 0.1 | µs | 1.6V≤VCC<1.7V (Note2) | 3 | ||
| Output Data Hold Time | tDH | 0.05 | µs | 1.7V≤VCC≤5.5V (Note3) | 3 | ||
| Stop Condition Setup Time | tSU:STO | 0.6 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Bus Free Time | tBUF | 1.2 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Write Cycle Time | tWR | 5 | ms | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| Noise Spike Width (SDA, SCL) | tI | 0.05 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 | ||
| WP Hold Time | tHD:WP | 1 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| WP Setup Time | tSU:WP | 0.1 | µs | Limits (1.6V≤VCC≤5.5V) | 3 | ||
| WP High Period | tHIGH:WP | 1 | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
CAD (KiCad official)
- Symbol:
BR24G32FVM-3AGTTR - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8-2.8mm (KiCad packages3D, STEP)
- 3D model files:
br24g32fvm-3agttr-etched.step/br24g32fvm-3agttr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);br24g32fvm-3agttr.step/br24g32fvm-3agttr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (37 pp, sha256
96ba7c619be7f6b1, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BR24G32FVM-3AGTTR
**ROHM Semicon** · EEPROM · MSOP-8-2.8mm
BR24G32FVM-3AGTTR from ROHM Semicon, in a MSOP-8-2.8mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 2 | A1 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 3 | A2 | input | Slave address setting input; must not be left open (Note 1 on page 5). |
| 4 | GND | power_in | Reference voltage for all inputs and outputs, 0 V. |
| 5 | SDA | bidirectional | Serial data input and serial data output of the I2C bus. |
| 6 | SCL | input | Serial clock input of the I2C bus; input is read on the rising edge of SCL. |
| 7 | WP | input | Write protect terminal; controls write inhibition of the EEPROM. |
| 8 | VCC | power_in | Power supply connection; the datasheet specifies single supply operation from 1.6 V to 5.5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | MSOP-8-2.8mm |
| Category | Memory |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Source Voltage | VCC | 1.6 | | 5.5 | V | | 2 |
| Input Voltage | VIN | 0 | | | V | | 2 |
| Supply Voltage | VCC | -0.3 | | 6.5 | V | | 2 |
| Input / Output Voltage | | -0.3 | | | V | Max is VCC+1.0 and not over 6.5V; min -1.0V when pulse width is 50ns or less | 2 |
| Permissible Dissipation (MSOP8) | Pd | | | 0.31 | W | Derate by 3.1mW/°C when operating above Ta=25°C | 2 |
| Storage Temperature | Tstg | -65 | | 150 | °C | | 2 |
| Operating Temperature | Topr | -40 | | 85 | °C | | 2 |
| Junction Temperature | Tjmax | | | 150 | °C | Junction temperature at the storage condition | 2 |
| Electrostatic discharge voltage (human body model) | VESD | -4000 | | 4000 | V | Human body model | 2 |
| Input Low Voltage 1 | VIL1 | -0.3 | | | V | 1.7V≤VCC≤5.5V; min -1.0V when pulse width is 50ns or less | 2 |
| Input Low Voltage 2 | VIL2 | -0.3 | | | V | 1.6V≤VCC<1.7V; min -1.0V when pulse width is 50ns or less | 2 |
| Output Low Voltage 1 | VOL1 | | | 0.4 | V | IOL=3.0mA, 2.5V≤VCC≤5.5V (SDA) | 2 |
| Output Low Voltage 2 | VOL2 | | | 0.2 | V | IOL=0.7mA, 1.6V≤VCC<2.5V (SDA) | 2 |
| Input Leakage Current | ILI | -1 | | 1 | µA | VIN=0 to VCC | 2 |
| Output Leakage Current | ILO | -1 | | 1 | µA | VOUT=0 to VCC (SDA) | 2 |
| Supply Current (Write) | ICC1 | | | 2 | mA | VCC=5.5V, fSCL=1MHz, tWR=5ms, Byte write, Page write | 2 |
| Supply Current (Read) | ICC2 | | | 2 | mA | VCC=5.5V, fSCL=1MHz, Random read, current read, sequential read | 2 |
| Standby Current | ISB | | | 2 | µA | VCC=5.5V, SDA, SCL=VCC, A0, A1, A2=GND, WP=GND | 2 |
| Write Cycles | | 1e+06 | | | Times | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 |
| Data Retention | | 40 | | | Years | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 |
| Clock Frequency | fSCL | | | 400 | kHz | Limits (1.6V≤VCC≤5.5V), Ta=-40°C to +85°C | 3 |
| Data Clock High Period | tHIGH | 0.6 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| Data Clock Low Period | tLOW | 1.2 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| SDA, SCL (INPUT) Rise Time | tR | | | 1 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 |
| SDA, SCL (INPUT) Fall Time | tF1 | | | 1 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 |
| SDA (OUTPUT) Fall Time | tF2 | | | 0.3 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 |
| Start Condition Hold Time | tHD:STA | 0.6 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| Start Condition Setup Time | tSU:STA | 0.6 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| Input Data Hold Time | tHD:DAT | 0 | | | ns | Limits (1.6V≤VCC≤5.5V) | 3 |
| Input Data Setup Time | tSU:DAT | 100 | | | ns | Limits (1.6V≤VCC≤5.5V) | 3 |
| Output Data Delay Time | tPD | 0.1 | | 0.9 | µs | 1.6V≤VCC<1.7V (Note2) | 3 |
| Output Data Delay Time | tPD | 0.05 | | 0.9 | µs | 1.7V≤VCC≤5.5V (Note3) | 3 |
| Output Data Hold Time | tDH | 0.1 | | | µs | 1.6V≤VCC<1.7V (Note2) | 3 |
| Output Data Hold Time | tDH | 0.05 | | | µs | 1.7V≤VCC≤5.5V (Note3) | 3 |
| Stop Condition Setup Time | tSU:STO | 0.6 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| Bus Free Time | tBUF | 1.2 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| Write Cycle Time | tWR | | | 5 | ms | Limits (1.6V≤VCC≤5.5V) | 3 |
| Noise Spike Width (SDA, SCL) | tI | | | 0.05 | µs | Limits (1.6V≤VCC≤5.5V); not 100% tested | 3 |
| WP Hold Time | tHD:WP | 1 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| WP Setup Time | tSU:WP | 0.1 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
| WP High Period | tHIGH:WP | 1 | | | µs | Limits (1.6V≤VCC≤5.5V) | 3 |
## CAD (KiCad official)
- Symbol: `BR24G32FVM-3AGTTR`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8-2.8mm (KiCad packages3D, STEP)
- 3D model files: `br24g32fvm-3agttr-etched.step` / `br24g32fvm-3agttr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `br24g32fvm-3agttr.step` / `br24g32fvm-3agttr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [ROHM Semicon datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589802761660227584) (37 pp, sha256 `96ba7c619be7f6b1`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/br24g32fvm-3agttr-datasheet.pdf)