component
BR24G02NUX-3TTR
Public Made by Adomby adom
ROHM Semicon EEPROM, VSON-8(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBR24G02NUX-3TTR
ROHM Semicon · EEPROM · VSON-8(2x3)
BR24G02NUX-3TTR from ROHM Semicon, in a VSON-8(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Slave address setting input; must not be left open. |
| 2 | A1 | input | Slave address setting input; must not be left open. |
| 3 | A2 | input | Slave address setting input; must not be left open. |
| 4 | GND | power_in | Reference voltage for all inputs and outputs, 0 V. |
| 5 | SDA | bidirectional | Serial data input and output; NMOS open-drain, so it requires a pull-up resistor. |
| 6 | SCL | input | Serial clock input. |
| 7 | WP | input | Write protect: tied to VCC (H) prohibits rewrite of all addresses, tied to GND (L) enables it; must not be left open. |
| 8 | VCC | power_in | Power supply connection, 1.6 V to 5.5 V operating range. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | VSON-8(2x3) |
| Category | Memory |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.3 | 6.5 | V | 2 | ||
| Power Dissipation (VSON008X2030) | Pd | 0.3 | W | Derate by 3.0mW/°C when operating above Ta=25°C | 2 | ||
| Input Voltage / Output Voltage | VIN, VOUT | -0.3 | V | Max printed as VCC+1.0 V; not over 6.5 V. Min -0.8 V when pulse width is 50 ns or less | 2 | ||
| Electrostatic discharge voltage (human body model) | VESD | -4000 | 4000 | V | Human body model | 2 | |
| Junction Temperature | Tjmax | 150 | °C | Junction temperature at the storage condition | 2 | ||
| Storage Temperature | Tstg | -65 | 150 | °C | 2 | ||
| Operating Temperature | Topr | -40 | 85 | °C | 2 | ||
| Power Source Voltage | VCC | 1.6 | 5.5 | V | 2 | ||
| Input Voltage | VIN | 0 | V | Printed as 0 to VCC | 2 | ||
| Write Cycles | 1e+06 | Times | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 | |||
| Data Retention | 40 | Years | Ta=25°C, VCC=1.6V to 5.5V; not 100% tested | 2 | |||
| Input High Voltage1 | VIH1 | 0.7 | ×VCC | 1.7V≤VCC≤5.5V | 2 | ||
| Input Low Voltage1 | VIL1 | -0.3 | 0.3 | ×VCC | 1.7V≤VCC≤5.5V | 2 | |
| Input High Voltage2 | VIH2 | 0.8 | ×VCC | 1.6V≤VCC<1.7V | 2 | ||
| Input Low Voltage2 | VIL2 | -0.3 | 0.2 | ×VCC | 1.6V≤VCC<1.7V | 2 | |
| Output Low Voltage1 (SDA) | VOL1 | 0.4 | V | IOL=3.0mA, 2.5V≤VCC≤5.5V | 2 | ||
| Output Low Voltage2 (SDA) | VOL2 | 0.2 | V | IOL=0.7mA, 1.6V≤VCC<2.5V | 2 | ||
| Input Leakage Current | ILI | -1 | 1 | µA | VIN=0 to VCC | 2 | |
| Output Leakage Current (SDA) | ILO | -1 | 1 | µA | VOUT=0 to VCC | 2 | |
| Supply Current (Write) | ICC1 | 2 | mA | VCC=5.5V, fSCL=400kHz, tWR=5ms, Byte write, Page write | 2 | ||
| Supply Current (Read) | ICC2 | 0.5 | mA | VCC=5.5V, fSCL=400kHz, Random read, current read, sequential read | 2 | ||
| Standby Current | ISB | 2 | µA | VCC=5.5V, SDA, SCL=VCC, A0, A1, A2=GND, WP=GND | 2 | ||
| Clock Frequency | fSCL | 400 | kHz | 3 | |||
| Data Clock High Period | tHIGH | 0.6 | µs | 3 | |||
| Data Clock Low Period | tLOW | 1.2 | µs | 3 | |||
| SDA, SCL (INPUT) Rise Time | tR | 1 | µs | Not 100% tested | 3 | ||
| SDA, SCL (INPUT) Fall Time | tF1 | 1 | µs | Not 100% tested | 3 | ||
| SDA (OUTPUT) Fall Time | tF2 | 0.3 | µs | Not 100% tested | 3 | ||
| Start Condition Hold Time | tHD:STA | 0.6 | µs | 3 | |||
| Start Condition Setup Time | tSU:STA | 0.6 | µs | 3 | |||
| Input Data Hold Time | tHD:DAT | 0 | ns | 3 | |||
| Input Data Setup Time | tSU:DAT | 100 | ns | 3 | |||
| Output Data Delay Time | tPD | 0.1 | 0.9 | µs | 3 | ||
| Output Data Hold Time | tDH | 0.1 | µs | 3 | |||
| Stop Condition Setup Time | tSU:STO | 0.6 | µs | 3 | |||
| Bus Free Time | tBUF | 1.2 | µs | 3 | |||
| Write Cycle Time | tWR | 5 | ms | 3 | |||
| Noise Spike Width (SDA and SCL) | tI | 0.1 | µs | 3 | |||
| WP Hold Time | tHD:WP | 1 | µs | 3 | |||
| WP Setup Time | tSU:WP | 0.1 | µs | 3 | |||
| WP High Period | tHIGH:WP | 1 | µs | 3 | |||
| Rise time of tR (power-up recommended condition) | tR | 10 | ms | tOFF 10ms or larger; Vbot 0.3V or below | 21 | ||
| Power-off time (power-up recommended condition) | tOFF | 10 | ms | tR 10ms or below; Vbot 0.3V or below | 21 | ||
| Power-down voltage Vbot (power-up recommended condition) | Vbot | 0.3 | V | tR 10ms or below; tOFF 10ms or larger | 21 |
CAD (KiCad official)
- Symbol:
BR24G02NUX-3TTR - Footprint:
Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm - 3D model: VSON-8(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
br24g02nux-3ttr-etched.step/br24g02nux-3ttr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);br24g02nux-3ttr.step/br24g02nux-3ttr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (39 pp, sha256
7596750f30648dad, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).