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BR24G02FJ-3AGTE2

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ROHM Semicon EEPROM, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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BR24G02FJ-3AGTE2

ROHM Semicon · EEPROM · SOIC-8

BR24G02FJ-3AGTE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Slave address input bit A0. Combined with A1/A2, selects one of up to 8 devices sharing the I2C bus (device code fixed '1010'). Do not leave open; tie to Vcc or GND.
2 A1 input Slave address input bit A1. Combined with A0/A2 to set device address on shared I2C bus. Must be tied to Vcc or GND - not allowed to float.
3 A2 input Slave address input bit A2. Combined with A0/A1 to set device address on shared I2C bus. Must be tied to Vcc or GND - not allowed to float.
4 GND power_in Ground reference (0 V) for all inputs and outputs. Must be the lowest potential under all operating conditions.
5 SDA bidirectional I2C serial data input/output. NMOS open-drain - requires external pull-up resistor (typ. a few kΩ to tens of kΩ). Input high >= 0.7 Vcc; output low <= 0.4 V at IOL=3 mA (Vcc >= 2.5 V). Built-in noise filter.
6 SCL input I2C serial clock input. Supports up to 400 kHz at Vcc 1.6-1.7 V and up to 1 MHz at Vcc 1.7-5.5 V. Data latched on rising edge; output changes on falling edge. Built-in noise filter.
7 WP input Write-protect input. WP = Vcc (H) inhibits data rewrite of all addresses; WP = GND (L) enables writes. Must not be left open. Pull to Vcc when used as ROM to prevent accidental writes at low supply voltages.
8 VCC power_in Positive supply input. Operating range 1.6 V to 5.5 V (1 MHz operation requires >= 1.7 V). Absolute max 6.5 V. A 0.1 µF bypass capacitor between VCC and GND is recommended, placed as close to the IC as possible.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • BR24G02FJ-3AGTE2
  • BR24G02FJ-3AGTE2F-3AGTE2
  • BR24G02FJ-3AGTE2FVT-3AGE2
  • BR24G02FJ-3AGTE2FVJ-3AGTE2
  • BR24G02FJ-3AGTE2FVM-3AGTTR
  • BR24G02FJ-3AGTE2NUX-3ATTR

CAD (KiCad official)

  • Symbol: BR24G02FJ-3AGTE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: br24g02fj-3agte2-etched.step / br24g02fj-3agte2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br24g02fj-3agte2.step / br24g02fj-3agte2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (None pp, sha256 ad6a23289c33c85d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF