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Ray Publish 0.1.0 1e0ab65 2d ago

BR210-AU_R1_000A1

PANJIT International · Schottky Barrier Diodes (SBD) · SMA(DO-214AC)

BR210-AU_R1_000A1 from PANJIT International, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer PANJIT International
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 100 V TA = 25 °C 1
Maximum RMS Voltage VRMS 70 V TA = 25 °C 1
Maximum DC Blocking Voltage VDC 100 V TA = 25 °C 1
Maximum Average Forward Rectified Current IF(AV) 2 A TA = 25 °C 1
Peak Forward Surge Current IFSM 50 A 8.3 ms single half sine-wave superimposed on rated load per diode 1
Operating Junction Temperature Range TJ -55 175 °C 1
Storage Temperature Range TSTG -55 175 °C 1
Instantaneous forward voltage VF 0.8 V IF = 2 A, TJ = 25 °C 2
Reverse current IR 50 uA VR = 100 V, TJ = 25 °C 2
Reverse current IR 20 mA VR = 100 V, TJ = 100 °C 2
Instantaneous forward voltage VF 0.6 V IF = 0.5 A, TJ = 25 °C 2
Instantaneous forward voltage VF 0.49 V IF = 0.5 A, TJ = 125 °C 2
Instantaneous forward voltage VF 0.62 V IF = 2 A, TJ = 125 °C 2
Reverse current IR 0.1 uA VR = 80 V, TJ = 25 °C 2
Typical Junction Capacitance CJ 75 pF Measured at 1 MHz And Applied VR = 4V 1
Typical Thermal Resistance junction to ambient RθJA 150 oC/W Mounted on FR4 PCB, single-sided copper, mini pad 1
Typical Thermal Resistance junction to case RθJC 15 oC/W Mounted on FR4 PCB, single-sided copper, with 100 cm2 copper pad area 1
Typical Thermal Resistance junction to lead RθJL 25 oC/W Mounted on FR4 PCB, single-sided copper, with 100 cm2 copper pad area 1

CAD (KiCad official)

  • Symbol: BR210-AU_R1_000A1
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: br210-au-r1-000a1-etched.step / br210-au-r1-000a1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); br210-au-r1-000a1.step / br210-au-r1-000a1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PANJIT International datasheet (5 pp, sha256 1a4a2f5e0a98d673, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF