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BQ4802LYDW

Public Made by Adom

by adom

Texas Instruments Real Time Clocks, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BQ4802LYDW

Texas Instruments · Real Time Clocks · SOIC-28-300mil

BQ4802LYDW from Texas Instruments, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Provides the higher of VCC or VBC, switched internally, to supply external RAM.
2 X1 passive Crystal connection for the 32.768-kHz quartz crystal.
3 X2 passive Crystal connection for the 32.768-kHz quartz crystal.
4 WDO output Goes low if WDI remains high or low longer than the watchdog time-out period, returns high on the next WDI transition, and remains high if WDI is unconnected.
5 INT output Goes low when a power-fail, periodic, or alarm condition occurs; INT is an open-drain output.
6 RST bidirectional Goes low when VCC falls below the power-fail threshold and stays low for 200 ms (typical) after VCC crosses the threshold on power-up; also accepts a push-button override and re-enters the reset cycle when released from being pulled low for more than 1 µs.
7 A3 input Address input that, together with A0-A2, allows access to the 16 bytes of real-time clock and control registers.
8 A2 input Address input that, together with A0, A1 and A3, allows access to the 16 bytes of real-time clock and control registers.
9 A1 input Address input that, together with A0, A2 and A3, allows access to the 16 bytes of real-time clock and control registers.
10 A0 input Address input that, together with A1-A3, allows access to the 16 bytes of real-time clock and control registers.
11 DQ0 bidirectional x8 data bus bit 0 for real-time clock information, connected to the memory data bus.
12 DQ1 bidirectional x8 data bus bit 1 for real-time clock information, connected to the memory data bus.
13 DQ2 bidirectional x8 data bus bit 2 for real-time clock information, connected to the memory data bus.
14 VSS power_in Ground reference for the device.
15 DQ3 bidirectional x8 data bus bit 3 for real-time clock information, connected to the memory data bus.
16 DQ4 bidirectional x8 data bus bit 4 for real-time clock information, connected to the memory data bus.
17 DQ5 bidirectional x8 data bus bit 5 for real-time clock information, connected to the memory data bus.
18 DQ6 bidirectional x8 data bus bit 6 for real-time clock information, connected to the memory data bus.
19 DQ7 bidirectional x8 data bus bit 7 for real-time clock information, connected to the memory data bus.
20 VSS power_in Ground reference for the device (second VSS pin; leave unconnected only in the SNAPHAT DSH package).
21 CS input Chip-select input for the device.
22 OE input Provides the read control for the real-time clock memory locations.
23 WDI input Three-level watchdog input; if held high or low longer than the 1.5-s default time-out, WDO goes low, and leaving it unconnected disables the watchdog (sets mid-supply internally).
24 BC power_in Connect to a 3-V backup cell; a voltage within the VBC range must be present at power-up for proper oscillator start-up.
25 CEOUT output Goes low only when CEIN is low and VCC is above the power-fail threshold; if power fails while CEIN is low, it stays low for 100 µs or until CEIN goes high, whichever occurs first.
26 CEIN input Input to the chip-enable gating circuit that controls CEOUT.
27 WE input Provides the write control for the real-time clock memory locations.
28 VCC power_in 5-V or 3.3-V supply input; the bq4802LY is specified for 2.7 V to 3.6 V in recommended operating conditions.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-28-300mil
Category Clock/Timing
Pins 28

CAD (KiCad official)

  • Symbol: BQ4802LYDW
  • Footprint: Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm
  • 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
  • 3D model files: bq4802lydw-etched.step / bq4802lydw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq4802lydw.step / bq4802lydw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 56b33867dd7e9d2c, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF