# BQ296230DSGR

**Texas Instruments** · Battery Management · WSON-8-EP(2x2)

BQ296230DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply input with recommended operating range of 3V to 20V when REG output enabled and absolute maximum rating of 30V. |
| 2 | V4 | input | Fourth cell voltage sensing input with recommended range of 0V to 5V (V4-V3 differential) and absolute maximum rating of 30V; typical input current ±0.1µA. |
| 3 | V3 | input | Third cell voltage sensing input with recommended range of 0V to 5V (V3-V2 differential) and absolute maximum rating of 30V; typical input current ±0.1µA. |
| 4 | V2 | input | Second cell voltage sensing input with recommended range of 0V to 5V (V2-V1 differential) and absolute maximum rating of 30V; typical input current ±0.1µA. |
| 5 | V1 | input | First cell voltage sensing input with recommended range of 0V to 5V (V1-VSS differential) and absolute maximum rating of 30V; typical input current ±0.1µA. |
| 6 | VSS | power_in | Ground reference connected to IC ground and battery pack negative terminal; must be connected first during power-up sequence. |
| 7 | OUT | output | Overvoltage fault signal output driver with CMOS high-level active output (6V-8V at VOV condition) and 100µA typical source current. |
| 8 | REG | output | Regulated 3.0V power supply output with maximum 2mA output current, 4mA short-circuit limit, and requires 0.47-1.0µF ceramic bypass capacitor to VSS for stability. |
| 9 | PWPD | power_in | Exposed thermal pad connecting to ground providing thermal management path and electrical grounding to VSS on PCB. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `BQ296230DSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `bq296230dsgr-etched.step` / `bq296230dsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq296230dsgr.step` / `bq296230dsgr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/bq2962) (32 pp, sha256 `e6a927461563434f`, retrieved 2026-10-01, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bq296230dsgr-datasheet.pdf)