component
BQ25601RTWR
Public Made by Adomby adom
Texas Instruments Battery Management ICs, QFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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BQ25601RTWR
Texas Instruments · Battery Management ICs · QFN-24-EP(4x4)
BQ25601RTWR from Texas Instruments, in a QFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VAC | input | Charge input voltage sense pin that must be connected to the VBUS pin. |
| 2 | PSEL | input | Power source selection input: pulled high sets a 500 mA input current limit and pulled low sets a 2.4 A limit, until the host programs the IINDPM register. |
| 3 | PG | output | Open-drain active-low power-good indicator, pulled up through a 10-kΩ resistor; LOW indicates a good input source between UVLO and ACOV with current limit above 30 mA. |
| 4 | STAT | output | Open-drain charge status output pulled up through 10 kΩ: LOW while charging, HIGH when charge is complete or in SLEEP, and 1-Hz pulses on charge suspend (fault). |
| 5 | SCL | input | I2C interface clock, connected to the logic rail through a 10-kΩ resistor. |
| 6 | SDA | bidirectional | I2C interface data, open drain, connected to the logic rail through a 10-kΩ resistor. |
| 7 | INT | output | Open-drain interrupt output connected to a logic rail through 10 kΩ, sending an active-low 256-µs pulse to report charger status and faults. |
| 8 | NC | unconnected | No connect; keep the pin floating. |
| 9 | CE | input | Charge enable pin; battery charging is enabled when this pin is driven low. |
| 10 | NC | unconnected | No connect; keep the pin floating. |
| 11 | TS | input | Temperature qualification voltage input for the JEITA profile using an NTC thermistor in a divider from REGN to GND (103AT-2 recommended); charge suspends when out of range. |
| 12 | QON | input | BATFET enable/reset control input with an internal 200-kΩ pull-up; a low of tSHIPMODE exits ship mode and a low of at least 8 s (tQON_RST) resets the system when VBUS is absent. |
| 13 | BAT | bidirectional | Battery connection to the positive terminal of the battery pack, with the internal BATFET and current sensing between SYS and BAT; connect a 10 µF capacitor close to the pin. |
| 14 | BAT | bidirectional | Battery connection to the positive terminal of the battery pack, with the internal BATFET and current sensing between SYS and BAT; connect a 10 µF capacitor close to the pin. |
| 15 | SYS | power_out | Converter output connection point with the current sensing network between SYS and BAT; connect a 20 µF capacitor close to the pin. |
| 16 | SYS | power_out | Converter output connection point with the current sensing network between SYS and BAT; connect a 20 µF capacitor close to the pin. |
| 17 | GND | power_in | Ground. |
| 18 | GND | power_in | Ground. |
| 19 | SW | power_out | Switching node output connected to the output inductor, with a 0.047-µF bootstrap capacitor from SW to BTST. |
| 20 | SW | power_out | Switching node output connected to the output inductor, with a 0.047-µF bootstrap capacitor from SW to BTST. |
| 21 | BTST | passive | PWM high-side driver positive supply, internally connected to the bootstrap diode cathode; connect a 0.047-µF capacitor from SW to BTST. |
| 22 | REGN | power_out | LSFET driver and internal supply output; connect a 4.7-µF (10-V rating) ceramic capacitor from REGN to GND close to the IC. |
| 23 | PMID | passive | Connected to the drain of the reverse blocking MOSFET (RBFET) and the HSFET drain; place a 10 µF ceramic capacitor from PMID to GND. |
| 24 | VBUS | power_in | Charger input with the internal reverse-blocking MOSFET between VBUS and PMID; place a 1-µF ceramic capacitor from VBUS to GND close to the device. |
| 25 | Thermal Pad | power_in | Ground reference and thermal pad that conducts heat from the device, to be tied externally to a ground plane through PCB vias. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-24-EP(4x4) |
| Category | Power Management ICs |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VBUS operating input voltage | VBUS | 3.9 | 13.5 | V | 7 | ||
| Operating ambient temperature | TA | -40 | 85 | °C | 8 | ||
| Battery voltage | VBATOP | 4.624 | V | 7 | |||
| Fast charging current | IBATOP | 3 | A | 7 | |||
| Input current (VBUS) | Iin | 3.25 | A | 7 | |||
| Abs max VAC, VBUS | VAC, VBUS | -2 | 22 | V | converter not switching | 7 | |
| Abs max BTST, PMID | BTST, PMID | -0.3 | 22 | V | converter not switching | 7 | |
| Abs max SW | SW | -2 | 16 | V | 7 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 7 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 7 | ||
| Junction-to-ambient thermal resistance | RθJA | 35.6 | °C/W | RTW (WQFN) 24 pins | 8 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 22.7 | °C/W | 8 | |||
| Junction-to-board thermal resistance | RθJB | 11.9 | °C/W | 8 | |||
| Battery discharge current | IBAT | 17 | 33 | µA | VBAT = 4.5 V, HIZ Mode or No VBUS, I2C disabled, BATFET Disabled. TJ < 85°C | 8 | |
| Battery discharge current | IBAT | 58 | 85 | µA | VBAT = 4.5 V, HIZ Mode or No VBUS, I2C Disabled, BATFET Enabled. TJ < 85°C | 8 | |
| Input supply current HIZ | IVBUS_HIZ | 37 | 50 | µA | VVBUS = 5 V, High-Z Mode, No battery | 8 | |
| Input supply current HIZ | IVBUS_HIZ | 68 | 90 | µA | VVBUS = 12 V, High-Z Mode, No battery | 8 | |
| VBUS operating range | VBUS_OP | 3.9 | 13.5 | V | VVBUS rising | 8 | |
| VBUS for active I2C, no battery | VVAC_UVLOZ | 3.3 | 3.6 | V | VVAC rising | 8 | |
| VAC present | VVAC_PRESENT | 3.65 | 3.9 | V | VVAC rising | 8 | |
| Sleep mode falling threshold | VSLEEP | 15 | 60 | 110 | mV | VBUSMIN_FALL ≤ VBAT ≤ VREG, VAC falling | 9 |
| VAC 6.5-V OV rising threshold | VVAC_OV_RISE | 6.1 | 6.4 | 6.7 | V | VAC rising; OVP (REG06[7:6]) = '01' | 9 |
| VAC 10.5-V OV rising threshold | VVAC_OV_RISE | 10.35 | 10.9 | 11.5 | V | VAC rising, OVP (REG06[7:6]) = '10' | 9 |
| VAC 14-V OV rising threshold | VVAC_OV_RISE | 13.5 | 14.2 | 14.85 | V | VAC rising, OVP (REG06[7:6]) = '11' | 9 |
| Battery depletion threshold falling | VBAT_DPL_FALL | 2.2 | 2.6 | V | VBAT falling | 9 | |
| Bad adapter detection falling threshold | VBUSMIN_FALL | 3.75 | 3.9 | 4 | V | VBUS falling | 9 |
| Maximum DC system voltage output | VSYSMAX | 4.4 | 4.45 | 4.48 | V | ISYS = 0 A, , Q4 off, VVBAT≤ 4.400 V, VVBAT > VSYS_MIN = 3.5V | 9 |
| RBFET on-resistance | RON(RBFET) | 45 | mΩ | -40°C≤ TA ≤ 125°C | 9 | ||
| SYS-BAT MOSFET on-resistance | RON(BAT-SYS) | 19.5 | 24 | mΩ | QFN package, Measured from BAT to SYS, VBAT = 4.2V, TJ = 25°C | 9 | |
| SYS-BAT MOSFET on-resistance | RON(BAT-SYS) | 19.5 | 30 | mΩ | QFN package, Measured from BAT to SYS, VBAT = 4.2V, TJ = -40 - 125°C | 10 | |
| Charge voltage setting 4.208 V | VBATREG | 4.187 | 4.208 | 4.229 | V | VREG (REG04[7:3]) = 4.208 V (01011), V, -40 ≤ TJ ≤ 85°C | 10 |
| Charge voltage setting 4.352 V | VBATREG | 4.33 | 4.352 | 4.374 | V | VREG (REG04[7:3]) = 4.352 V (01111), V, -40 ≤ TJ ≤ 85°C | 10 |
| Charge voltage setting accuracy | VBATREG_ACC | -0.5 | 0.5 | % | VBAT = 4.208 V or VBAT = 4.352 V, -40 ≤ TJ ≤ 85°C | 10 | |
| Charge current regulation 240 mA | ICHG_REG | 0.216 | 0.24 | 0.264 | A | ICHG = 240 mA, VVBAT = 3.1V or VVBAT = 3.8 V | 10 |
| Charge current regulation 720 mA | ICHG_REG | 0.685 | 0.72 | 0.755 | A | ICHG = 720 mA, VVBAT = 3.1V or VVBAT = 3.8 V | 10 |
| Charge current regulation 1.38 A | ICHG_REG | 1.311 | 1.38 | 1.449 | A | ICHG = 1.38 A, VVBAT = 3.1 V or VVBAT = 3.8 V | 10 |
| Precharge current regulation | IPRECHG | 153 | 171 | 189 | mA | IPRECHG[3:0] = '0010' = 180 mA | 10 |
| Battery LOWV falling threshold | VBATLOWV_FALL | 2.7 | 2.8 | 2.9 | V | ICHG = 240 mA | 10 |
| Battery LOWV rising threshold | VBATLOWV_RISE | 3 | 3.12 | 3.24 | V | Pre-charge to fast charge | 10 |
| Termination current | ITERM | 150 | 180 | 216 | mA | ICHG > 780 mA, ITERM[3:0] = '0010' = 180 mA, VVBAT = 4.208 V | 10 |
| Termination current | ITERM | 162 | 180 | 192 | mA | ICHG ≤ 780 mA, , ITERM[3:0] = '0010' = 180 mA | 10 |
| Battery short voltage falling | VSHORT | 1.85 | 2 | 2.15 | V | VBAT falling | 10 |
| Battery short current | ISHORT | 70 | 90 | 110 | mA | VBAT < VSHORTZ | 10 |
| Recharge threshold below VBAT_REG | VRECHG | 90 | 120 | 150 | mV | VBAT falling, REG04[0] = 0 | 10 |
| Input voltage regulation limit 3.9 V | VINDPM | 3.78 | 3.95 | 4.1 | V | VINDPM (REG06[3:0] = 0000) = 3.9 V | 11 |
| Input voltage regulation limit 4.4 V | VINDPM | 4.268 | 4.4 | 4.532 | V | VINDPM (REG06[3:0] = 0110) = 4.4 V | 11 |
| USB input current regulation limit 500 mA | IINDPM | 450 | 500 | mA | VVBUS = 5 V, current pulled from SW, IINDPM (REG[4:0] = 00100) = 500 mA, -40 ≤ TJ ≤ 85°C | 11 | |
| USB input current regulation limit 1.5 A | IINDPM | 1.3 | 1.5 | A | VVBUS = 5 V, current pulled from SW, IINDPM (REG[4:0] = 01110) = 1.5 A, -40 ≤ TJ ≤ 85°C | 11 | |
| Battery OVP rising threshold | VBATOVP_RISE | 103 | 104 | 105 | % | VBAT rising, as percentage of VBAT_REG | 11 |
| Thermal shutdown rising temperature | TSHUT | 160 | °C | Temperature Increasing | 11 | ||
| HSFET cycle-by-cycle overcurrent threshold | IHSFET_OCP | 5.2 | 8 | A | 12 | ||
| PWM switching frequency buck | fSW | 1320 | 1500 | 1680 | kHz | Oscillator frequency, buck mode | 12 |
| PWM switching frequency boost | fSW | 1150 | 1412 | 1660 | kHz | Oscillator frequency, boost mode | 12 |
| Boost mode regulation voltage | VOTG_REG | 4.972 | 5.126 | 5.28 | V | VBAT = 3.8 V, I(PMID) = 0 A, BOOSTV[1:0] = '10' = 5.15 V | 12 |
| OTG mode output current | IOTG | 1.2 | 1.4 | 1.6 | A | BOOST_LIM (REG02[7]) = 1 | 12 |
| OTG overvoltage threshold | VOTG_OVP | 5.55 | 5.8 | 6.15 | V | Rising threshold | 12 |
| REGN LDO output voltage | VREGN | 5.6 | 6 | V | VVBUS = 9V, IREGN = 40mA | 13 | |
| REGN LDO output voltage | VREGN | 4.6 | 4.7 | V | VVBUS = 5V, IREGN = 20mA | 13 | |
| Charge safety timer range | tSAFETY | 8 | 10 | 12 | hr | CHG_TIMER = 1 | 13 |
| Digital low power clock | fLPDIG | 18 | 30 | 45 | kHz | REGN LDO disabled | 13 |
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human body model, all pins | 7 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 1. Place input capacitor as close as possible to PMID pin and GND pin connections and use shortest copper | 53 |
CAD (KiCad official)
- Symbol:
BQ25601RTWR - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: QFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
bq25601rtwr-etched.step/bq25601rtwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq25601rtwr.step/bq25601rtwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (65 pp, sha256
1da39d8af8789279, retrieved 2026-10-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).