Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

BQ25601DRTWR

Texas Instruments · Battery Management ICs · WQFN-24-EP(4x4)

BQ25601DRTWR from Texas Instruments, in a WQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBUS power_in Charger input; the internal n-channel reverse blocking MOSFET (RBFET) is connected between VBUS and PMID, with a 1-uF ceramic capacitor placed from VBUS to GND close to the device.
2 D+ bidirectional Positive line of the USB data pair used for D+/D- based USB host/charging port detection, including data contact detection, BC1.2 primary and secondary detection and nonstandard adaptors.
3 D- bidirectional Negative line of the USB data pair used for D+/D- based USB host/charging port detection, including data contact detection, BC1.2 primary and secondary detection and nonstandard adaptors.
4 STAT output Open-drain charge status output (low while charging, high when charge complete or in sleep, 1-Hz pulses on charge suspend), connected to a logic rail via 10 kΩ and disabled via EN_ICHG_MON[1:0] bits.
5 SCL input I2C interface clock; connect to the logic rail through a 10-kΩ resistor.
6 SDA bidirectional I2C interface data; connect to the logic rail through a 10-kΩ resistor.
7 INT output Open-drain interrupt output that sends an active-low 256-µs pulse to the host to report charger status and faults, connected to a logic rail through a 10-kΩ resistor.
8 NC unconnected No connect; keep the pin floating.
9 CE input Charge enable pin; battery charging is enabled when this pin is driven low.
10 NC unconnected No connect; keep the pin floating.
11 TS input Temperature qualification voltage input supporting the JEITA profile with an NTC thermistor (103AT-2 recommended); charge suspends when out of range, and if unused connect 10 kΩ from REGN to TS and 10 kΩ from TS to GND.
12 QON input BATFET enable/reset control input with internal pull-up; a low of tSHIPMODE exits ship mode, and a low of tQON_RST (minimum 8 s) with VBUS absent resets SYS by turning BATFET off for at least 250 ms.
13 BAT bidirectional Battery connection point to the positive terminal of the battery pack, with the internal BATFET and current sensing between SYS and BAT; connect 10 µF close to the pin.
14 BAT bidirectional Battery connection point to the positive terminal of the battery pack, with the internal BATFET and current sensing between SYS and BAT; connect 10 µF close to the pin.
15 SYS power_out Converter output connection point with internal current sensing network between SYS and BAT; connect a 20 µF capacitor close to the pin.
16 SYS power_out Converter output connection point with internal current sensing network between SYS and BAT; connect a 20 µF capacitor close to the pin.
17 GND power_in Ground pin.
18 GND power_in Ground pin.
19 SW power_out Switching node output connected to the output inductor; connect the 0.047-µF bootstrap capacitor from SW to BTST.
20 SW power_out Switching node output connected to the output inductor; connect the 0.047-µF bootstrap capacitor from SW to BTST.
21 BTST passive PWM high-side driver positive supply, internally connected to the bootstrap diode cathode; connect a 0.047-µF bootstrap capacitor from SW to BTST.
22 REGN power_out LSFET driver and internal supply output, connected internally to the bootstrap diode anode; connect a 4.7-µF (10-V rating) ceramic capacitor to GND close to the IC.
23 PMID passive Connected to the drain of the reverse blocking MOSFET (RBFET) and the drain of HSFET; place a 10-µF ceramic capacitor from PMID to GND.
24 VAC input Charge input voltage sense; this pin must be connected to the VBUS pin.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-24-EP(4x4)
Category Power Supply Chip
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage range VAC, VBUS (converter not switching) -2 22 V with respect to GND 7
Voltage range BTST, PMID (converter not switching) -0.3 22 V with respect to GND 7
Voltage range SW -2 16 V with respect to GND 7
Voltage range BTST to SW -0.3 7 V 7
Voltage range D+, D- -0.3 7 V with respect to GND 7
Voltage range REGN, TS, CE, BAT, SYS (converter not switching) -0.3 7 V with respect to GND 7
Voltage range SDA, SCL, INT, /QON, STAT -0.3 7 V with respect to GND 7
Voltage range PGND to GND -0.3 0.3 V QFN package only 7
Output sink current STAT 6 mA 7
Output sink current INT 6 mA 7
Operating junction temperature TJ -40 150 °C 7
Storage temperature Tstg -65 150 °C 7
ESD HBM V(ESD) -2000 2000 V HBM, all pins 7
ESD CDM V(ESD) -250 250 V CDM, all pins 7
VBUS input voltage VBUS 3.9 13.5 V 7
Input current (VBUS) Iin 3.25 A 7
Output current (SW) ISWOP 3.25 A 7
Battery voltage VBATOP 4.615 V 7
Fast charging current IBATOP 3 A 7
Discharging current (continuous) IBATOP 6 A 7
Operating ambient temperature TA -40 85 °C 7
Junction-to-ambient thermal resistance RθJA 35.6 °C/W RTW (WQFN) 24 pins 8
Junction-to-case (top) thermal resistance RθJC(top) 22.7 °C/W 8
Junction-to-board thermal resistance RθJB 11.9 °C/W 8
Junction-to-top characterization parameter ΨJT 0.2 °C/W 8
Junction-to-board characterization parameter ΨJB 12 °C/W 8
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.6 °C/W 8
Battery discharge current, HIZ, BATFET disabled IBAT 17 33 µA VBAT = 4.5 V, HIZ Mode and No VBUS, I2C disabled, BATFET Disabled. TJ < 85°C 8
Battery discharge current, HIZ, BATFET enabled IBAT 58 85 µA VBAT = 4.5 V, HIZ Mode and No VBUS, I2C Disabled, BATFET Enabled. TJ < 85°C 8
Input supply current HIZ 5 V IVBUS_HIZ 37 55 µA VVBUS = 5 V, High-Z Mode, No battery 8
Input supply current HIZ 12 V IVBUS_HIZ 68 93 µA VVBUS = 12 V, High-Z Mode, No battery 8
VBUS operating range VBUS_OP 3.9 13.5 V VVBUS rising 8
VBUS for active I2C, no battery VVAC_UVLOZ 3.3 3.6 V VVAC rising 8
REGN turn-on VAC threshold VVAC_PRESENT 3.65 3.9 V VVAC rising 8
Sleep mode falling threshold VSLEEP 15 60 131 mV VAC falling 8
Sleep mode rising threshold VSLEEPZ 115 220 340 mV VAC rising 8
VAC 6.5-V overvoltage rising threshold VVAC_OV_RISE 6.1 6.4 6.7 V VAC rising; OVP (REG06[7:6]) = '01' 9
VAC 10.5-V overvoltage rising threshold VVAC_OV_RISE 10.35 10.9 11.5 V VAC rising, OVP (REG06[7:6]) = '10' 9
VAC 14-V overvoltage rising threshold VVAC_OV_RISE 13.5 14.2 14.85 V VAC rising, OVP (REG06[7:6]) = '11' 9
Battery depletion threshold falling VBAT_DPL_FALL 2.2 2.6 V VBAT falling 9
Battery depletion threshold rising VBAT_DPL_RISE 2.34 2.86 V VBAT rising 9
Bad adapter detection falling threshold VBUSMIN_FALL 3.75 3.9 4 V VBUS falling 9
System regulation voltage VSYS_MIN 3.5 3.68 V VVBAT < SYS_MIN[2:0] = 101, BATFET Disabled (REG07[5] = 1) 9
Maximum DC system voltage output VSYS_MAX 4.4 4.45 4.48 V ISYS = 0 A, Q4 off, VVBAT≤ 4.400 V, VVBAT > VSYSMIN = 3.5V 9
RBFET on-resistance RON(RBFET) 45 mΩ -40°C≤ TA ≤ 125°C 9
HSFET on-resistance RON(HSFET) 62 mΩ VREGN = 5 V , -40°C≤ TA ≤ 125°C 9
LSFET on-resistance RON(LSFET) 71 mΩ VREGN = 5 V , -40°C≤ TA ≤ 125°C 9
SYS-BAT MOSFET on-resistance RON(BAT-SYS) 19.5 24 mΩ QFN package, BAT to SYS, VBAT = 4.2V, TJ = 25°C 9
SYS-BAT MOSFET on-resistance RON(BAT-SYS) 19.5 30 mΩ QFN package, BAT to SYS, VBAT = 4.2V, TJ = -40 - 125°C 9
Charge voltage program range VBATREG_RANGE 3.847 4.615 V 9
Charge voltage setting 4.20 V VBATREG 4.178 4.2 4.22 V VREG (REG04[7:3]) = 4.20 V (01011), -40 ≤ TJ ≤ 85°C 10
Charge voltage setting 4.343 V VBATREG 4.321 4.343 4.365 V VREG (REG04[7:3]) = 4.343 V (01111), -40 ≤ TJ ≤ 85°C 10
Charge voltage setting 4.391 V VBATREG 4.373 4.391 4.407 V VREG (REG04[7:3]) = 4.391 V (10001), -40 ≤ TJ ≤ 85°C 10
Charge current regulation range ICHG_REG_RANGE 0 3000 mA 10
Charge current regulation 240 mA ICHG_REG 0.216 0.24 0.264 A ICHG = 240 mA, VVBAT = 3.1V or VVBAT = 3.8 V 10
Charge current regulation 720 mA ICHG_REG 0.685 0.72 0.761 A ICHG = 720 mA, VVBAT = 3.1 V or VVBAT = 3.8 V 10
Charge current regulation 1.38 A ICHG_REG 1.311 1.38 1.449 A ICHG = 1.38 A, VVBAT = 3.1 V or VVBAT = 3.8 V 10
Charge current accuracy 720 mA / 1.38 A ICHG_REG_ACC -5 5 % ICHG = 720 mA or ICHG = 1.38 A, VVBAT = 3.1 V or VVBAT = 3.8 V 10
Battery LOWV falling threshold VBATLOWV_FALL 2.7 2.8 2.9 V ICHG = 240 mA 10
Battery LOWV rising threshold VBATLOWV_RISE 3 3.12 3.24 V Pre-charge to fast charge 10
Precharge current regulation IPRECHG 153 171 189 mA IPRECHG[3:0] = '0010' = 180 mA 10
Termination current regulation ITERM 150 180 216 mA ICHG > 780 mA, ITERM[3:0] = '0010' = 180 mA, VVBAT = 4.208 V 10
Termination current regulation ITERM 162 180 192 mA ICHG ≤ 780 mA, ITERM[3:0] = '0010' = 180 mA 10
Battery short voltage falling VSHORT 1.85 2 2.15 V VVBAT falling 10
Battery short voltage rising VSHORTZ 2.15 2.25 2.35 V VVBAT rising 10
Battery short current ISHORT 70 90 110 mA VVBAT < VSHORTZ 10
Recharge threshold below VBAT_REG VRECHG 90 120 150 mV VBAT falling, REG04[0] = 0 10

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 1. Place input capacitor as close as possible to PMID pin and GND pin connections and use shortest copper 54

CAD (KiCad official)

  • Symbol: BQ25601DRTWR
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: WQFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: bq25601drtwr-etched.step / bq25601drtwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq25601drtwr.step / bq25601drtwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (66 pp, sha256 4420f41c6497a003, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF