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Contents

README

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BQ25306RTER

Texas Instruments · Battery Management · WQFN-16(3x3)

BQ25306RTER from Texas Instruments, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBUS power_in Charger input voltage source with 4.1V to 17V operating range and 28V absolute maximum rating
2 REGN power_out Low-side FET driver positive supply output with 4.2V to 5.4V regulated voltage
3 STAT output Charge status indication open-drain output reporting charging (LOW), complete (OPEN), or fault conditions (BLINKING)
4 ICHG input Charge current program input regulated at 993mV to 1003mV where charging current is set as ICHG=KICHG/RICHG
5 POL input EN pin polarity selection input; keep floating for standalone charger operation
6 EN input Device enable/disable input with input thresholds of 0.40V low and 1.3V high
7 TS input Battery temperature voltage input for NTC thermistor connection to enable cold/hot temperature monitoring and charging suspension
8 FB_GND input Battery voltage feedback ground input for resistor divider low-side connection with high impedance when charger disabled
9 FB input Battery voltage feedback input where charging voltage is programmed as VBATREG=1.1(1+R1/R2) with 1.094V to 1.104V reference
10 BAT input Battery voltage sensing input connected to positive terminal of battery pack with 3.4V to 9.0V programmable range
11 GND power_in Ground reference connected directly to thermal pad for electrical and heat dissipation performance
12 GND power_in Ground reference for single-point analog and power ground connection near IC
13 SW passive Switching node connected to output inductor with internal connection to HSFET source and LSFET drain
14 SW passive Switching node connected to output inductor with internal connection to HSFET source and LSFET drain
15 BTST passive High-side FET driver supply internally connected to bootstrap diode cathode with 2.7V to 3.3V refresh threshold
16 PMID passive Intermediate power node connected to RBFET drain and HSFET drain with 10µF capacitor to GND recommended
17 Thermal Pad power_in Ground reference and exposed thermal pad for low thermal-impedance path from die to PCB via vias

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: BQ25306RTER
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: bq25306rter-etched.step / bq25306rter-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq25306rter.step / bq25306rter.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 8009786e6366720f, retrieved 2026-09-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF