component
BQ25176MDSGR
Public Made by Adomby adom
Texas Instruments Battery Management, WSON-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ25176MDSGR
Texas Instruments · Battery Management · WSON-8
BQ25176MDSGR from Texas Instruments, in a WSON-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power connected to external DC supply; bypass with at least 1-μF capacitor to GND placed close to IC. |
| 2 | ISET | input | Programs device fast-charge current via external resistor to GND with range 30 kΩ (10 mA) to 375 Ω (800 mA) per ICHG = KISET/RISET. |
| 3 | BIAS | input | Bias sense pin; connect external 10-kΩ resistor to GND or use as charging disable pin by pulling to GND via external NMOS. |
| 4 | GND | power_in | Ground pin. |
| 5 | STAT | output | Open-drain charger status output; pulls LOW for charge in progress, HIGH for charge complete or disabled, blinks at 1 Hz for fault. |
| 6 | /PG | output | Open-drain power good output; pulls LOW when VIN > VIN_LOWV and VOUT + VSLEEPZ < VIN < VIN_OV via 10-kΩ pull-up resistor. |
| 7 | VSET | input | Programs regulation voltage for OUT pin via pull-down resistor with valid range 18.2 kΩ to 100 kΩ; ±1% tolerance with <200 ppm/°C temperature coefficient recommended. |
| 8 | OUT | power_out | Battery connection pin; system load may be connected in parallel to battery; bypass with at least 1-μF capacitor to GND placed close to IC. |
| 9 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
BQ25176MDSGR - Footprint:
Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm - 3D model: WSON-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
bq25176mdsgr-etched.step/bq25176mdsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq25176mdsgr.step/bq25176mdsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (30 pp, sha256
fa9d702b1a3a1e62, retrieved 2026-10-01, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).