component
BQ25071DQCT
Public Made by Adomby adom
Texas Instruments Global Sourcing Parts, WSON-10-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ25071DQCT
Texas Instruments · Global Sourcing Parts · WSON-10-EP(2x3)
BQ25071DQCT from Texas Instruments, in a WSON-10-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power supply pin connected to external DC supply (AC adapter or USB port); bypass to GND with 0.1 μF ceramic capacitor; rated 3.75V to 28V maximum. |
| 2 | ISET | output | Input current programming bias pin; connect external resistor (1 kΩ to 10 kΩ) to GND to program input current limit from 100 mA to 1 A when EN is grounded. |
| 3 | GND | power_in | Ground pin connected to thermal pad and ground plane; must connect to PCB ground at all times. |
| 4 | LDO | power_out | LDO output regulated to 4.9V ±10% delivering maximum 50 mA; bypass to GND with 0.1 μF ceramic capacitor; enabled when V(UVLO) < VIN < V(OVP). |
| 5 | TS | input | Battery pack NTC thermistor monitoring input; connect resistor divider from LDO to GND with TS at center tap to set charge temperature window thresholds. |
| 6 | BAT | input | Battery voltage sense input; connect BAT and OUT together to the battery. |
| 7 | EN | input | Enable control input; drive high to disable IC, ground for user programmable mode with ISET, leave floating for USB500 mode. |
| 8 | CHG | tri_state | Charge status indicator open-drain output; pulled low during precharge and fastcharge modes, high impedance when battery fully charged; maximum sink current 5 mA. |
| 9 | GND | power_in | Ground pin connected to thermal pad and ground plane; must connect to PCB ground at all times. |
| 10 | OUT | power_out | System output connection delivering up to 1 A; bypass to GND with 1 μF ceramic capacitor; must be connected to BAT. |
| 11 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-10-EP(2x3) |
| Category | Global Sourcing Parts |
| Pins | 11 |
CAD (KiCad official)
- Symbol:
BQ25071DQCT - Footprint:
Package_SON:WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm - 3D model: WSON-10-EP(2x3) (KiCad packages3D, STEP)
- 3D model files:
bq25071dqct-etched.step/bq25071dqct-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq25071dqct.step/bq25071dqct.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (23 pp, sha256
120d81d3c99c8ac7, retrieved 2026-10-01, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).