component
BQ25060DQCR
Public Made by Adomby adom
Texas Instruments Battery Management, WSON-10-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBQ25060DQCR
Texas Instruments · Battery Management · WSON-10-EP(2x3)
BQ25060DQCR from Texas Instruments, in a WSON-10-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power supply from USB or AC adapter, 4.4V to 10.2V operating range, 1.2A continuous maximum input current, with 10.5V over-voltage protection. |
| 2 | ISET | input | Current programming input, connect external 1kΩ to 10kΩ resistor to VSS to program input current limit between 100mA and 1A. |
| 3 | VSS | power_in | Ground terminal connected to thermal pad and ground plane. |
| 4 | LDO | power_out | Low dropout regulator output regulated to 4.9V (4.7V to 5.1V range), drives up to 50mA continuous output current. |
| 5 | TS | input | Battery NTC thermistor monitoring input for temperature sensing, default operating range 0°C to 45°C with hysteresis protection. |
| 6 | BAT | power_out | Battery connection output and sense input, sources 28-45mA precharge current when VBAT < 2.9V, up to 1.2A maximum continuous output. |
| 7 | EN | input | Enable control input selecting charger mode, drive high for disable/suspend, low for programmable current mode via ISET, float for USB500 mode. |
| 8 | CHG | tri_state | Charge status open-drain output pulled low during charging phases, high impedance when battery fully charged, maximum sink current 5mA. |
| 9 | BGATE | bidirectional | Battery FET gate driver output sourcing typical 50µA to drive external P-channel FET gate, connect to VSS to disable external power path control feature. |
| 10 | OUT | power_out | System output regulated to minimum 3.4V when input source present, supplies system load up to 1.2A maximum output current. |
| 11 | ThermalPad | power_in | Exposed thermal pad electrically connected to VSS, provides thermal dissipation path to PCB for heat management, must be soldered for proper thermal and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-10-EP(2x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
CAD (KiCad official)
- Symbol:
BQ25060DQCR - Footprint:
Package_SON:WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm - 3D model: WSON-10-EP(2x3) (KiCad packages3D, STEP)
- 3D model files:
bq25060dqcr-etched.step/bq25060dqcr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bq25060dqcr.step/bq25060dqcr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
29e6b6f949240583, retrieved 2026-09-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).