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BQ25040DQCR

Texas Instruments · Battery Management · WSON-10-EP(2x3)

BQ25040DQCR from Texas Instruments, in a WSON-10-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input power supply (4.35V to 26V) with overvoltage protection at 6.9V; bypass to VSS with at least 1µF ceramic capacitor.
2 ISET input Current programming input; connect resistor from 475Ω to 5.36kΩ to VSS to program fast-charge current from 100mA to 1.1A.
3 VSS power_in Ground terminal; connect to thermal pad and ground plane of the circuit.
4 LDO power_out LDO output regulated to 4.9V with up to 50mA output current; bypass to VSS with at least 1µF ceramic capacitor.
5 IFULL input Charge done current programming input; connect resistor to VSS to program charge done threshold from 5% to 50% of fast-charge current.
6 EN/SET input One-wire interface input with internal ~260kΩ pulldown to VSS for device enable/disable and mode selection.
7 VSS power_in Ground terminal; connect to thermal pad and ground plane of the circuit.
8 CHG tri_state Charge done indicator open-drain output; pulled low during charging, high impedance when battery fully charged or during fault conditions.
9 PG tri_state Power good open-drain output; pulled low when input power above battery voltage by 80mV and below 6.9V overvoltage protection threshold.
10 BAT power_out Battery connection output; supplies up to 2.3A in production test mode at 4.2V or up to 1.1A charge current in normal mode; bypass to VSS with at least 1µF ceramic capacitor.
11 PAD passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-10-EP(2x3)
Category Power Management (PMIC)
Pins 11

CAD (KiCad official)

  • Symbol: BQ25040DQCR
  • Footprint: Package_SON:WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
  • 3D model: WSON-10-EP(2x3) (KiCad packages3D, STEP)
  • 3D model files: bq25040dqcr-etched.step / bq25040dqcr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq25040dqcr.step / bq25040dqcr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (29 pp, sha256 186049e80d00120e, retrieved 2026-10-01, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF