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Contents

README

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BQ24735RGRT

Texas Instruments · Battery Management · VQFN-20(3.5x3.5)

BQ24735RGRT from Texas Instruments, in a VQFN-20(3.5x3.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ACN input Input current sense resistor negative input; place optional 0.1µF ceramic from ACN to GND for common-mode filtering and 0.1µF from ACN to ACP for differential filtering.
2 ACP input Input current sense resistor positive input; place 0.1µF ceramic from ACP to GND for common-mode filtering and 0.1µF from ACN to ACP for differential filtering.
3 CMSRC passive ACDRV charge pump source input; a 4kΩ resistor to the common source of ACFET (Q1) and RBFET (Q2) limits in-rush current on the pin.
4 ACDRV output Charge pump output driving ACFET and RBFET gates, 6V above CMSRC when ACDET is between 2.4V and 3.15V, VCC is above UVLO and VCC is 275mV above SRN; use a 4kΩ series resistor to the gates.
5 ACOK output AC adapter detection open-drain output, pulled high by an external 10kΩ pull-up when ACDET is between 2.4V and 3.15V, VCC is above UVLO and 275mV above SRN, otherwise pulled low by the internal MOSFET.
6 ACDET input Adapter detection input programmed by a resistor divider from the adapter input to GND; above 0.6V with VCC above UVLO enables the REGN LDO, ACOK comparator and IOUT.
7 IOUT output Buffered adapter or charge current output selectable by SMBus ChargeOption(), at 20 times the sense resistor differential voltage; use 100pF or less decoupling capacitor to GND.
8 SDA bidirectional SMBus open-drain data I/O connected to the host or smart battery data line with a 10kΩ pull-up.
9 SCL input SMBus open-drain clock input connected to the host or smart battery clock line with a 10kΩ pull-up.
10 ILIM input Charge current limit input set by a divider from the 3.3V rail; the lower of ILIM or DAC limit sets the regulation limit, above 1.6V disables ILIM control, below 75mV disables charge/discharge and above 105mV enables it.
11 BATDRV output Charge pump output driving the battery-to-system BATFET, 6V above SRN to turn it on and equal to SRN to turn it off; use a 4kΩ resistor to the gate.
12 SRN input Charge current sense resistor negative input and battery voltage sense; connect through a 7.5Ω resistor with 0.1µF to GND for filtering.
13 SRP input Charge current sense resistor positive input; connect through a 10Ω resistor to the sense resistor with 0.1µF differential filtering capacitor.
14 GND power_in IC ground; connect to the analog ground plane and only to the power ground plane through the PowerPAD underneath the IC.
15 LODRV output Low side power MOSFET driver output connected to the low side n-channel MOSFET gate.
16 REGN power_out 6V linear regulator output supplied from VCC, active when ACDET is above 0.6V and VCC is above UVLO; connect a 1µF ceramic capacitor to GND.
17 BTST power_in High side MOSFET driver power supply; connect a 0.047µF capacitor from BTST to PHASE and a bootstrap Schottky diode from REGN to BTST.
18 HIDRV output High side power MOSFET driver output connected to the high side n-channel MOSFET gate.
19 PHASE passive High side power MOSFET driver source, connected to the source of the high side n-channel MOSFET.
20 VCC power_in Input supply, diode-ORed from adapter or battery voltage; use a 10Ω resistor and 1µF capacitor to ground as a low pass filter to limit inrush current.
21 PowerPAD power_in Exposed pad beneath the IC joining analog and power ground at a single star point; always solder to the board with vias to the ground planes, also serves as thermal pad.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-20(3.5x3.5)
Category Power Management (PMIC)
Pins 21

CAD (KiCad official)

  • Symbol: BQ24735RGRT
  • Footprint: Package_DFN_QFN:QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm
  • 3D model: VQFN-20(3.5x3.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: bq24735rgrt-etched.step / bq24735rgrt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq24735rgrt.step / bq24735rgrt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 49d4e7a43dd79779, retrieved 2026-10-06, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF