# BQ24380DSGR

**Texas Instruments** · Battery Management ICs · WSON-8-EP(2x2)

BQ24380DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power connected to the external DC supply; bypass IN to VSS with a ceramic capacitor (1 µF minimum). |
| 2 | VSS | power_in | Ground terminal; connect to the thermal pad and to the ground rail of the circuit, and it must be connected to ground at all times. |
| 3 | NC | unconnected | Do not connect to any external circuits; these pins may have internal connections used for test purposes. |
| 4 | FAULT | output | Open-drain device status output pulled to VSS internally when the pass FET is turned off due to input overvoltage, output short-circuit, overtemperature, or battery voltage outside safe limits; high impedance during normal operation. |
| 5 | CE | input | Active-low chip enable input; CE high turns the input pass FET off, CE low turns it on, and it is internally pulled down by approximately 200 kΩ. |
| 6 | VBAT | power_in | Battery voltage sense input, connected to the pack positive terminal through a 100-kΩ resistor. |
| 7 | NC | unconnected | Do not connect to any external circuits; these pins may have internal connections used for test purposes. |
| 8 | OUT | output | Output terminal to the charging system; bypass OUT to VSS with a ceramic capacitor (1 µF minimum). |
| 9 | PAD | power_in | Exposed thermal pad internally connected to VSS; it must be connected to the same potential as VSS on the PCB and not used as the primary ground input. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Supply Chip |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage IN (wrt VSS) | VI | -0.3 |  | 30 | V | IN with respect to VSS | 4 |
| Input voltage OUT (wrt VSS) | VI | -0.3 |  | 12 | V | OUT with respect to VSS | 4 |
| Input voltage FAULT, CE, VBAT | VI | -0.3 |  | 7 | V | with respect to VSS | 4 |
| Output source current OUT | IOUTmax |  |  | 2 | A |  | 4 |
| Output sink current FAULT |  |  |  | 15 | mA |  | 4 |
| Junction temperature | TJ | -40 |  | 150 | °C |  | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| ESD HBM | V(ESD) | -2000 |  | 2000 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 4 |
| ESD CDM | V(ESD) | -500 |  | 500 | V | Charged-device model, JESD22-C101 | 4 |
| IN voltage range | VI | 3.3 |  | 30 | V |  | 4 |
| Output current, OUT pin | IO |  |  | 1.7 | A |  | 4 |
| Junction temperature | TJ | -40 |  | 125 | °C |  | 4 |
| Junction-to-ambient thermal resistance | RθJA |  | 64 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Junction-to-case (top) thermal resistance | RθJC(top) |  | 84.1 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Junction-to-board thermal resistance | RθJB |  | 33.9 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Junction-to-top characterization parameter | ψJT |  | 1.9 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Junction-to-board characterization parameter | ψJB |  | 34.3 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) |  | 5.8 |  | °C/W | DSG (WSON) 8 pins | 4 |
| Undervoltage lock-out, input power detected threshold | UVLO | 2.5 |  | 2.8 | V | CE = LO or HI, VIN: 0 V → 3 V | 5 |
| Hysteresis on UVLO | Vhys(UVLO) | 200 |  | 300 | mV | CE = LO or HI, VIN: 3 V → 0 V | 5 |
| Operating current (bq24380) | IDD |  |  | 250 | μA | CE = LO, no load on OUT pin, VIN = 5 V | 5 |
| Standby current | ISTDBY |  |  | 100 | μA | CE = HI, VIN = 5.5 V | 5 |
| Dropout voltage IN to OUT | VDO |  |  | 280 | mV | CE = LO, VIN = 5 V, I(OUT) = 1 A | 5 |
| Q1 off-state leakage current | IOFF |  |  | 10 | μA | CE = HI, VIN = 5.5 V | 5 |
| Output voltage (bq24380) | VO(REG) | 5.3 | 5.5 | 5.7 | V | CE = LO, VIN = 6 V | 5 |
| Input overvoltage protection threshold (bq24380) | VOVP | 6.1 | 6.3 | 6.5 | V | CE = LO, VIN: 5 V → 8 V | 5 |
| Hysteresis on OVP (bq24380) | Vhys(OVP) | 25 |  | 110 | mV | CE = LO or HI, VIN: 7 V → 5 V | 5 |
| Short-circuit detection threshold | IO(SC) | 1.3 | 1.5 | 1.7 | A | 3 V < VIN < VOVP - Vhys(OVP) | 5 |
| Retry interval if short-circuit detected | tREC(SC) |  | 64 |  | ms |  | 5 |
| Battery overvoltage protection threshold | BVOVP | 4.3 | 4.35 | 4.4 | V | VIN > 4.5 V, CE = LO | 5 |
| Hysteresis on BV(OVP) | Vhys(BVovp) | 200 |  | 320 | mV | VIN > 4.5 V, CE = LO | 5 |
| Input bias current on VBAT pin | I(VBAT) |  |  | 10 | nA | TJ = 25°C | 5 |
| Thermal shutdown temperature | TJ(OFF) | 140 |  | 150 | °C |  | 5 |
| Thermal shutdown hysteresis | TJ(OFF-HYS) |  | 20 |  | °C |  | 5 |
| CE logic LOW input voltage | VIL | 0 |  | 0.4 | V |  | 5 |
| CE logic HIGH input voltage | VIH | 1.4 |  |  | V |  | 5 |
| CE input current low | IIL |  |  | 1 | μA |  | 5 |
| CE input current high | IIH |  |  | 15 | μA | V CE = 1.8 V | 5 |
| FAULT output LOW voltage | VOL |  |  | 0.2 | V | ISINK = 5 mA | 5 |
| FAULT off-state leakage current, HI-Z | Ilkg |  |  | 10 | μA | V FAULT = 5 V | 5 |
| Deglitch time, input power detected | tDGL(PGOOD) |  | 8 |  | ms | CE = LO or HI, VIN 0 V → 5 V, 1-μs rise-time | 6 |
| Input OV propagation delay | tPD(OVP) |  |  | 200 | ns | VIN: 5 V → 10 V | 6 |
| Recovery time from input overvoltage condition | tREC(OVP) |  | 8 |  | ms | CE = LO, VIN: 7 V → 5 V, 1-μs fall-time | 6 |
| Deglitch time, battery overvoltage detected | tDGL(BVovp) |  | 176 |  | μs | VIN > 4.5 V, CE = LO, VBAT rising from 4.1 V to 4.4 V to FAULT going low | 6 |

## CAD (KiCad official)

- Symbol: `BQ24380DSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `bq24380dsgr-etched.step` / `bq24380dsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq24380dsgr.step` / `bq24380dsgr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/bq24380) (25 pp, sha256 `68b98db1e60807c1`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bq24380dsgr-datasheet.pdf)