# BQ24350DSGR

**Texas Instruments** · Battery Management · WSON-8-EP(2x2)

BQ24350DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ACIN | power_in | Power supply input connected to an external DC supply, with at least a 1 µF ceramic capacitor to GND; recommended ACIN range is 4.4 V to 15 V and the absolute maximum is 30 V. |
| 2 | ACIN | power_in | Second power supply input pin, to be connected in parallel with pin 1 to the external DC supply, with the same 1 µF minimum ceramic capacitor to GND and the same 4.4 V to 15 V recommended range. |
| 3 | GND | power_in | Ground terminal; the GND pin must be connected to ground at all times. |
| 4 | VBAT | power_in | Battery voltage sense input connected to the pack positive terminal through a resistor (100 kΩ to 470 kΩ recommended), tied to GND if battery OVP is not used; absolute maximum is -0.3 V to 7 V. |
| 5 | GATDRV | input | P-FET gate drive input connected to the gate drive pin of the host charger controller; absolute maximum is -0.3 V to 7 V. |
| 6 | CHGIN | power_out | Output power pin supplying the host charger controller input, requiring a ceramic bypass capacitor of at least 1.0 µF to GND; absolute maximum is -0.3 V to 7 V. |
| 7 | OUT | power_out | Output terminal to the charging system; absolute maximum is -0.3 V to 7 V with respect to GND. |
| 8 | OUT | power_out | Second output terminal to the charging system, connected in parallel with pin 7; absolute maximum is -0.3 V to 7 V with respect to GND. |
| 9 | PAD (thermal pad) | power_in | Exposed thermal pad is internally connected to the GND pin and must be tied to the same PCB ground potential, but must not be used as the primary ground input. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `BQ24350DSGR`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `bq24350dsgr-etched.step` / `bq24350dsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq24350dsgr.step` / `bq24350dsgr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/bq24352) (19 pp, sha256 `e4ab6b9c5cf06aee`, retrieved 2026-10-11, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bq24350dsgr-datasheet.pdf)