# BQ24314DSGT

**Texas Instruments** · Battery Management · WSON-8-EP(2x2)

BQ24314DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input power pin connected to the external DC supply; a minimum 1-µF ceramic capacitor is required from this pin to VSS. |
| 2 | VSS | power_in | Ground terminal that must be connected to ground at all times. |
| 3 | NC | unconnected | Internal test circuit pin; no external connection should be made for normal operation. |
| 4 | FAULT | output | Active-low open-drain status output that is driven Low when the input FET is turned off by input overvoltage, input overcurrent, battery overvoltage, or thermal shutdown. |
| 5 | CE | input | Active-low chip enable input; when CE is High the input FET is off, and the pin is internally pulled down. |
| 6 | VBAT | power_in | Battery voltage sense input, connected to the battery pack positive terminal through a resistor. |
| 7 | ILIM | bidirectional | Input overcurrent threshold programming pin; a resistor to VSS sets the overcurrent threshold. |
| 8 | OUT | power_out | Output terminal to the charging system; a minimum 1-µF ceramic capacitor is required from this pin to VSS. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | 3.3 |  | 26 | V |  | 4 |
| Input current, IN pin | IIN |  |  | 1.5 | A |  | 4 |
| Output current, OUT pin | IOUT |  |  | 1.5 | A |  | 4 |
| OCP programming resistor | RILIM | 15 |  | 90 | kΩ |  | 4 |
| Junction temperature | TJ | 0 |  | 125 | °C |  | 4 |
| Input voltage IN with respect to VSS |  | -0.3 |  | 30 | V |  | 4 |
| Output voltage OUT with respect to VSS |  | -0.3 |  | 12 | V |  | 4 |
| ILIM, FAULT, CE, VBAT with respect to VSS |  | -0.3 |  | 7 | V |  | 4 |
| Input current IN |  |  |  | 2 | A |  | 4 |
| Output current OUT |  |  |  | 2 | A |  | 4 |
| Output sink current FAULT |  |  |  | 15 | mA |  | 4 |
| Junction temperature | TJ | -40 |  | 150 | °C |  | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| Undervoltage lockout, input power detected threshold | UVLO | 2.6 | 2.7 | 2.8 | V | CE = Low, VIN increasing from 0 V to 3 V | 5 |
| Hysteresis on UVLO | VHYS-UVLO | 200 | 260 | 300 | mV | CE = Low, VIN decreasing from 3 V to 0 V | 5 |
| Operating current | IDD |  | 400 | 600 | μA | CE = Low, No load on OUT pin, VIN = 5 V, RILIM = 25 kΩ | 5 |
| Standby current | ISTDBY |  | 65 | 95 | μA | CE = High, VIN = 5 V | 5 |
| Drop-out voltage IN to OUT | VDO |  | 170 | 280 | mV | CE = Low, VIN = 5 V, IOUT = 1 A | 5 |
| Input overvoltage protection threshold (bq24314) | VOVP | 5.71 | 5.85 | 6 | V | CE = Low, VIN increasing from 5 V to 7.5 V | 5 |
| Hysteresis on OVP | VHYS-OVP | 25 | 60 | 110 | mV | CE = Low, VIN decreasing from 7.5 V to 5 V | 5 |
| Input overcurrent protection threshold range | IOCP | 300 |  | 1500 | mA |  | 5 |
| Input overcurrent protection threshold | IOCP | 930 | 1000 | 1070 | mA | CE = Low, RILIM = 25 kΩ | 5 |
| Battery overvoltage protection threshold | BVOVP | 4.3 | 4.35 | 4.4 | V | CE = Low, VIN > 4.4 V | 5 |
| Hysteresis on BVOVP | VHYS-BOVP | 200 | 275 | 320 | mV | CE = Low, VIN > 4.4 V | 5 |
| Input bias current on VBAT pin | IVBAT |  |  | 10 | nA | DSG Package VBAT = 4.4 V, TJ = 25°C | 5 |
| Thermal shutdown temperature | TJ(OFF) | 140 | 150 |  | °C |  | 5 |
| Thermal shutdown hysteresis | TJ(OFF-HYS) |  | 20 |  | °C |  | 5 |
| Low-level input voltage on CE | VIL | 0 |  | 0.4 | V |  | 5 |
| High-level input voltage on CE | VIH | 1.4 |  |  | V |  | 5 |
| Low-level input current on CE | IIL |  |  | 1 | μA | VCE = 0 V | 5 |
| High-level input current on CE | IIH |  |  | 15 | μA | VCE = 1.8 V | 5 |
| Output low voltage on FAULT | VOL |  |  | 0.2 | V | ISINK = 5 mA | 5 |
| Leakage current, FAULT pin HI-Z | IHI-Z |  |  | 10 | μA | VFAULT = 5 V | 5 |
| Deglitch time, input power detected status | TDGL(PGOOD) |  | 8 |  | ms | CE = Low. Time measured from VIN 0 V → 5 V, 1-µs rise-time, to output turning ON | 6 |
| Input OV propagation delay | tPD(OVP) |  | 1 |  | μs | CE = Low | 6 |
| Recovery time from input overvoltage condition | tON(OVP) |  | 8 |  | ms | CE = Low, Time measured from VIN 7.5 V → 5 V, 1-μs fall-time | 6 |
| Blanking time, input overcurrent detected | tBLANK(OCP) |  | 176 |  | μs |  | 6 |
| Recovery time from input overcurrent condition | tREC(OCP) |  | 64 |  | ms |  | 6 |
| Deglitch time, battery overvoltage detected | tDGL(BOVP) |  | 176 |  | μs | CE = Low, VIN > 4.4 V. Time measured from VVBAT rising from 4.1 V to 4.4 V to FAULT going low. | 6 |
| Junction-to-ambient thermal resistance (DSG) | RθJA |  | 58.6 |  | °C/W |  | 4 |
| Junction-to-case (top) thermal resistance (DSG) | RθJC(top) |  | 67.9 |  | °C/W |  | 4 |
| Junction-to-board thermal resistance (DSG) | RθJB |  | 29.7 |  | °C/W |  | 4 |
| Junction-to-top characterization parameter (DSG) | ψJT |  | 1.2 |  | °C/W |  | 4 |
| Junction-to-board characterization parameter (DSG) | ψJB |  | 30.3 |  | °C/W |  | 4 |
| Junction-to-case (bottom) thermal resistance (DSG) | RθJC(bot) |  | 7.6 |  | °C/W |  | 4 |

## CAD (KiCad official)

- Symbol: `BQ24314DSGT`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `bq24314dsgt-etched.step` / `bq24314dsgt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq24314dsgt.step` / `bq24314dsgt.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/bq24314.pdf) (32 pp, sha256 `875afbe6b2cad826`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bq24314dsgt-datasheet.pdf)