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BQ24300DSGR

Texas Instruments · Battery Management · WSON-8-EP(2x2)

BQ24300DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input power from external DC supply with absolute maximum −0.3V to 30V and recommended operating range 3.3V to 26V with respect to VSS.
2 VSS power_in Ground terminal serving as reference potential and internally connected to exposed thermal pad.
3 PGATE output Gate drive output for optional external P-channel MOSFET with gate driver clamp voltage 13V to 17V and absolute maximum −0.3V to 12V with respect to VSS.
4 NC unconnected Not connected; do not connect to any external circuit and may have internal connections used for test purposes.
5 CE input Chip enable input, active low (device enabled when CE = Low, FET off when CE = High) with internal pull-down and logic input levels VIL 0V to 0.4V, VIH ≥ 1.4V.
6 VBAT power_in Battery voltage sense input connected through series resistor to battery pack positive terminal with battery overvoltage protection threshold 4.30V to 4.40V and absolute maximum −0.3V to 7V with respect to VSS.
7 NC unconnected Not connected; do not connect to any external circuit and may have internal connections used for test purposes.
8 OUT output Output terminal to charging circuit with regulated output voltage 5.30V to 5.70V for bq24300, absolute maximum −0.3V to 12V with respect to VSS.
9 Thermal PAD power_in Exposed thermal pad with internal connection to VSS that must be soldered to PCB copper pad connected to ground plane for thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: BQ24300DSGR
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: bq24300dsgr-etched.step / bq24300dsgr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq24300dsgr.step / bq24300dsgr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 617a2ded66d22106, retrieved 2026-09-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF