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BQ24192RGER

Public Made by Adom

by adom

Texas Instruments Battery Management, VQFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)bq24192rgerfactory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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BQ24192RGER

Texas Instruments · Battery Management · VQFN-24-EP(4x4)

BQ24192RGER from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBUS power_in Charger input voltage; place 1-µF ceramic capacitor close to IC from VBUS to PGND.
2 PSEL input Power source selection input; High indicates USB host source, Low indicates adapter source.
3 PG output Open-drain active-low power good indicator; LOW when input voltage between UVLO and ACOV above SLEEP threshold and current limit above 30 mA.
4 STAT output Open-drain charge status output; LOW indicates charge in progress, HIGH indicates charge complete or disabled.
5 SCL input I2C interface clock; connect through 10-kΩ pull-up resistor to logic rail.
6 SDA bidirectional I2C interface data line; connect through 10-kΩ pull-up resistor to logic rail.
7 INT output Open-drain interrupt output; sends active-low 256-µs pulse to host to report charger status and faults.
8 OTG input USB current limit selection during buck mode; High sets IIN to 500 mA or enables boost mode, Low sets IIN to 100 mA.
9 CE input Active-low charge enable; battery charging enabled when REG01[5:4] = 01 and CE is Low.
10 ILIM input Input current limit setting; connect resistor to ground to set maximum limit as IINMAX = (1V/RILIM) × 530 with minimum 500 mA.
11 TS1 input Temperature sensor input 1; connect negative temperature coefficient thermistor with resistor divider from REGN to TS1 to ground.
12 TS2 input Temperature sensor input 2; connect negative temperature coefficient thermistor with resistor divider from REGN to TS2 to ground.
13 BAT power_in Battery positive connection point; internal BATFET connected between BAT and SYS; connect 10-µF capacitor closely to pin.
14 BAT power_in Battery positive connection point; internal BATFET connected between BAT and SYS; connect 10-µF capacitor closely to pin.
15 SYS power_out System output connection point; converter maintains SYS above minimum system voltage setting when battery falls below minimum.
16 SYS power_out System output connection point; converter maintains SYS above minimum system voltage setting when battery falls below minimum.
17 PGND power_in Power ground connection for high-current power converter; connect directly to ground of input and output capacitors.
18 PGND power_in Power ground connection for high-current power converter; connect directly to ground of input and output capacitors.
19 SW output Switching node connecting to output inductor; connect 0.047-µF bootstrap capacitor from SW to BTST.
20 SW output Switching node connecting to output inductor; connect 0.047-µF bootstrap capacitor from SW to BTST.
21 BTST power_in PWM high-side driver positive supply; internally connected to boost-strap diode anode; connect 0.047-µF bootstrap capacitor from SW.
22 REGN power_out PWM low-side driver positive supply output; connect 4.7-µF (10V rating) ceramic capacitor from REGN to analog ground close to IC.
23 PMID output Internal node connected to drain of reverse blocking MOSFET and drain of high-side FET; place 1-µF capacitor on VBUS to PGND and remaining on PMID to PGND.
24 VBUS power_in Charger input voltage; place 1-µF ceramic capacitor close to IC from VBUS to PGND.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-24-EP(4x4)
Category Power Management (PMIC)
Pins 25

CAD (KiCad official)

  • Symbol: BQ24192RGER
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: bq24192rger-etched.step / bq24192rger-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq24192rger.step / bq24192rger.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (53 pp, sha256 5ad60e02bb956906, retrieved 2026-09-26, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF