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BQ24168RGER

Public Made by Adom

by adom

Texas Instruments Battery Management, VQFN-24(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BQ24168RGER

Texas Instruments · Battery Management · VQFN-24(4x4)

BQ24168RGER from Texas Instruments, in a VQFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected Shown as N.C. in the RGE top view for the BQ24161/BQ24168 pinout, and Table 6-1 gives no function for this pin.
2 PSEL input USB source-detection input: high starts the USB input at a 100 mA limit and low at 1.5 A, it has no effect on IN, and it must not be left unconnected.
3 SCL input I2C interface clock; connect to the logic rail through a 10-kΩ resistor.
4 SDA bidirectional I2C interface data; connect to the logic rail through a 10-kΩ resistor.
5 PGND power_in Ground terminal; connect to the thermal pad and the circuit ground plane, and keep it connected to ground at all times.
6 DRV power_out Gate-drive bias supply for the internal MOSFETs; bypass to PGND with a 1-µF ceramic capacitor, and it may drive external loads up to 10 mA.
7 INT output Open-drain status and interrupt output that pulls low during charging and sends a 128-µs fault pulse; connect through 100 kΩ to a logic rail, with 1 mA maximum sink current.
8 STAT output Open-drain charge-status and interrupt output that pulls low during charging; pull up through an LED or 10 kΩ, with 10 mA maximum sink current.
9 TS input Battery NTC monitor input; connect to the center tap of a resistor divider from DRV to GND with the NTC from TS to GND, or tie to DRV to disable the TS function.
10 BGATE output Gate drive for an external P-channel discharge MOSFET; it is low in high-impedance mode and when no input is connected.
11 BAT bidirectional Battery connection to the positive battery terminal; bypass BAT to GND with at least 1 µF.
12 BAT bidirectional Battery connection to the positive battery terminal; bypass BAT to GND with at least 1 µF.
13 SYS power_out System voltage sense and charger FET connection; connect at the output bulk capacitors, bypass with at least 10 µF, and 47 µF is recommended for optimal transient response.
14 SYS power_out System voltage sense and charger FET connection; connect at the output bulk capacitors, bypass with at least 10 µF, and 47 µF is recommended for optimal transient response.
15 PGND power_in Ground terminal; connect to the thermal pad and the circuit ground plane, and keep it connected to ground at all times.
16 PGND power_in Ground terminal; connect to the thermal pad and the circuit ground plane, and keep it connected to ground at all times.
17 PGND power_in Ground terminal; connect to the thermal pad and the circuit ground plane, and keep it connected to ground at all times.
18 SW output Inductor connection to the switched side of the external inductor; absolute maximum pin range is -0.7 V to 12 V and continuous output current is 4.5 A.
19 BOOT input High-side MOSFET gate-driver supply; connect a 0.01-µF ceramic capacitor rated above 10 V from BOOT to SW, with BOOT-to-SW maximum 7 V.
20 PMIDI output Reverse-blocking and high-side MOSFET connection point for the high-power input; bypass with at least 4.7 µF, and it is not current limited so any short will damage the IC.
21 IN power_in Input supply from the AC adapter or alternate source; BQ24168 IN operating range is 4.2 V to 6 V, and bypass to PGND with at least 1 µF.
22 USB power_in USB input supply from the USB port or adapter; BQ24168 USB operating range is 4.2 V to 6 V, and bypass to PGND with at least 1 µF.
23 PMIDU output Reverse-blocking and high-side MOSFET connection point for the USB input; bypass with at least 4.7 µF, and it is not current limited so any short will damage the IC.
24 CD input IC hardware chip disable; drive high for high-impedance mode and low for normal operation, and do not leave it unconnected.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-24(4x4)
Category Power Management (PMIC)
Pins 25

CAD (KiCad official)

  • Symbol: BQ24168RGER
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: VQFN-24(4x4) (KiCad packages3D, STEP)
  • 3D model files: bq24168rger-etched.step / bq24168rger-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq24168rger.step / bq24168rger.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (55 pp, sha256 701c8b87e51cde27, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF