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BQ24075QRGTRQ1

Texas Instruments · Battery Management ICs · VQFN-16-EP(3x3)

BQ24075QRGTRQ1 from Texas Instruments, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TS input TS monitors a 10kΩ NTC thermistor in the battery pack, and a 10kΩ fixed resistor from TS to VSS is required when the TS function is unused to hold a valid voltage level.
2 BAT bidirectional BAT is the charger power stage output and battery voltage sense input, and must be bypassed to VSS with a 4.7 μF to 47 μF ceramic capacitor.
3 BAT bidirectional BAT is the charger power stage output and battery voltage sense input, and must be bypassed to VSS with a 4.7 μF to 47 μF ceramic capacitor.
4 CE input CE is an active-low charge enable input that must be tied to a defined logic level, since leaving it unconnected is not allowed and it is internally pulled down with about 285 kΩ.
5 EN2 input EN2 together with EN1 sets the maximum input current and enables USB compliance, and must not be left unconnected because it is internally pulled down with about 285 kΩ.
6 EN1 input EN1 together with EN2 sets the maximum input current and enables USB compliance, and must not be left unconnected because it is internally pulled down with about 285 kΩ.
7 PGOOD output PGOOD is an open-drain power good output that pulls to VSS when a valid input source is detected and is connected to a logic rail through a 1kΩ-100kΩ resistor.
8 VSS power_in VSS is the ground pin that must be connected to the thermal pad and to the ground rail of the circuit, and it must be connected to ground at all times.
9 CHG output CHG is an open-drain charging status output that pulls to VSS while the battery is charging and is connected to a logic rail through a 1kΩ-100kΩ resistor.
10 OUT output OUT is the regulated system supply output that must be bypassed to VSS with a 4.7 μF to 47 μF ceramic capacitor.
11 OUT output OUT is the regulated system supply output that must be bypassed to VSS with a 4.7 μF to 47 μF ceramic capacitor.
12 ILIM input ILIM programs the maximum input current through a 1100 Ω to 8 kΩ resistor to VSS when EN2=1 and EN1=0, and leaving it unconnected disables all charging.
13 IN power_in IN is the input power connection with an operating range of 4.35V to 6.6V, accepts up to 26V without damage but suspends operation, and requires a 1 μF to 10 μF bypass capacitor to VSS.
14 TMR input TMR programs the pre-charge and fast-charge safety timers with an 18 kΩ to 72 kΩ resistor to VSS, disables all safety timers when connected to VSS, and sets default values when left unconnected.
15 SYSOFF input SYSOFF high turns off the FET connecting the battery to the system output and disables charging when an adapter is connected, and it must not be left unconnected because it is internally pulled up to VBAT through about 5 MΩ.
16 ISET bidirectional ISET programs the fast charge current through a 590 Ω to 3 kΩ resistor to VSS, is disabled if left unconnected, and its voltage reflects the actual charging current while charging.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-16-EP(3x3)
Category Power Supply Chip
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
IN voltage range VI 4.35 26 V 3
IN operating voltage range VI 4.35 6.4 V 3
Input current, IN pin IIN 1.5 A 3
Current, OUT pin IOUT 4.5 A 3
Current, BAT pin (Discharging) IBAT 4.5 A 3
Current, BAT pin (Charging) ICHG 1.5 A Footnote 1: charge life reduced at 1.5A and 125°C 3
Maximum input current programming resistor RILIM 1100 8000 Ω 3
Fast-charge current programming resistor RISET 590 3000 Ω Use 1% tolerance resistor 3
Termination current programming resistor RITERM 0 15 kΩ 3
Timer programming resistor RTMR 18 72 kΩ 3
IN voltage (with respect to VSS) VI -0.3 28 V with respect to VSS 2
BAT voltage (with respect to VSS) VI -0.3 5 V with respect to VSS 2
Input voltage OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, TMR, SYSOFF VI -0.3 7 V 2
Input current IN II 1.6 A 2
Output current OUT IO 5 A Continuous 2
Output current BAT (discharge mode) IO 5 A Continuous 2
Output current BAT (charging mode) IO 1.5 A Continuous 2
Output sink current CHG, PGOOD 15 mA 2
Junction temperature TJ -40 150 °C 2
Storage temperature Tstg -65 150 °C 2
Electrostatic discharge HBM (QSS 009-105) 1.5 kV JESD22-A114A 2
ESD Human Body Model (AEC-Q100 H2) 2 kV AEC-Q100 Classification Level H2 2
ESD Charged Device Model (AEC-Q100 C3B) 750 V AEC-Q100 Classification Level C3B 2
Junction-to-ambient thermal resistance θJA 45.8 °C/W RGT 16-pin 3
Junction-to-case (top) thermal resistance θJCtop 53.6 °C/W RGT 16-pin 3
Junction-to-board thermal resistance θJB 18.1 °C/W RGT 16-pin 3
Junction-to-case (bottom) thermal resistance θJCbot 5.2 °C/W RGT 16-pin 3
Junction-to-top characterization parameter ψJT 1.1 °C/W RGT 16-pin 3
Junction-to-board characterization parameter ψJB 18 °C/W RGT 16-pin 3
Undervoltage lock-out UVLO 3.2 3.3 3.4 V VIN: 0 V → 4 V 4
Hysteresis on UVLO Vhys 200 300 mV VIN: 4 V → 0 V 4
Input power detection threshold VIN(DT) 50 80 135 mV VBAT = 3.6 V, VIN: 3.5 V → 4 V 4
Input overvoltage protection threshold VOVP 6.4 6.6 6.8 V VIN: 5 V → 7 V 4
Output voltage regulation (OUT pin) VO(REG) 5.4 5.5 5.65 V VIN > VOUT + VDO(IN-OUT) 4
Dropout voltage VIN, VOUT VDO(IN-OUT) 300 475 mV VIN = 4.3 V, IIN = 1A, VBAT = 4.2V 4
Dropout voltage VBAT, VOUT VDO(BAT-OUT) 50 100 mV IOUT = 1 A, VIN = 0 V, VBAT > 3 V 4
Maximum input current (EN1 = LO, EN2 = LO) IINmax 85 95 100 mA EN1 = LO, EN2 = LO 4
Maximum input current (EN1 = HI, EN2 = LO) IINmax 440 475 500 mA EN1 = HI, EN2 = LO 4
Maximum input current factor (ILIM = 500 mA to 1.5 A) KILIM 1500 1610 1720 AΩ ILIM = 500mA to 1.5A 4
Maximum input current factor (ILIM = 200 mA to 500 mA) KILIM 1300 1525 1770 AΩ ILIM = 200mA to 500mA 4
Input voltage threshold when input current is reduced VIN-DPM 4.35 4.5 4.63 V EN2 = LO, EN1 = X 4
Output voltage threshold when charging current is reduced VDPPM 4.2 4.3 4.4 V 4
Output short-circuit detection threshold, power-on VO(SC1) 0.8 0.9 1 V VIN > VUVLO and VIN > VBAT + VIN(DT) 4
Output short-circuit detection threshold, supplement mode VO(SC2) 200 250 300 mV VIN > VUVLO and VIN > VBAT + VIN(DT); VBAT, VOUT > VO(SC2) indicates short-circuit 4
Source current for BAT pin short-circuit detection IBAT 4 7.5 11 mA VBAT = 1.5V 5
BAT pin short-circuit detection threshold (VBAT rising) VBAT(SC) 1.6 1.8 2 V VBAT rising 5
Battery charge voltage VBAT(REG) 4.15 4.2 4.23 V 5
Pre-charge to fast-charge transition threshold VLOWV 2.9 3 3.1 V VIN > VUVLO and VIN > VBAT + VIN(DT) 5
Battery fast charge current range ICHG 300 1500 mA VBAT > VLOWV, VIN = 5 V, CE = LO, EN1 = LO, EN2 = HI 5
Fast charge current factor KISET 797 890 975 AΩ 5
Pre-charge current factor KPRECHG 55 88 110 AΩ 5
Termination comparator detection threshold (internally set) ITERM 0.09 0.1 0.11 ×ICHG CE = LO, (EN1, EN2) ≠ (LO, LO), VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM and thermal loop not active 5
Termination comparator detection threshold (EN1, EN2 = LO, LO) ITERM 0.027 0.033 0.04 ×ICHG CE = LO, (EN1, EN2) = (LO, LO), VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM and thermal loop not active 5
Recharge detection threshold VRCH -140 -100 -55 mV Relative to VBAT(REG); VIN > VUVLO and VIN > VBAT + VIN(DT) 5
Sink current for battery detection IBAT(DET) 5 7.5 10 mA VBAT = 2.5V 5
Pre-charge safety timer value tPRECHG 1440 1800 2160 s TMR = floating 5
Charge safety timer value tMAXCHG 14400 18000 21600 s TMR = floating 5
Timer factor KTMR 36 48 60 s/kΩ 5
NTC bias current INTC 72 75 80 μA VIN > UVLO and VIN > VBAT + VIN(DT) 5
High temperature trip point VHOT 270 300 330 mV Battery charging, VTS falling 5
Low temperature trip point VCOLD 2000 2100 2200 mV Battery charging, VTS rising 5
Logic LOW input voltage (EN1, EN2, CE, SYSOFF) VIL 0 0.4 V 6
Logic HIGH input voltage (EN1, EN2, CE, SYSOFF) VIH 1.4 6 V 6
Input sink current IIL 1 μA VIL = 0V 6
Input source current IIH 10 μA VIH = 1.4V 6
Output LOW voltage (PGOOD, CHG) VOL 0.4 V ISINK = 5 mA 6
Active supply current, IN pin ICC 1.5 mA CE = LO, VIN = 6 V, no load on OUT pin, VBAT > VBAT(REG), (EN1, EN2) ≠ (HI, HI) 4
Sleep current into BAT pin IBAT(PDWN) 12 μA CE = LO or HI, input power not detected, no load on OUT pin, Ta = 125°C 4
Internal pull-down resistance on CE RCE 285 kΩ CE internally pulled down 6
Internal pull-up resistance on SYSOFF to VBAT RSYSOFF 5 MΩ SYSOFF internally pulled up to VBAT 6

CAD (KiCad official)

  • Symbol: BQ24075QRGTRQ1
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: bq24075qrgtrq1-etched.step / bq24075qrgtrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bq24075qrgtrq1.step / bq24075qrgtrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 e194cdc076180d34, retrieved 2026-10-28, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF