component
BNSRV05-4LC
Public Made by Adomby adom
BORN ESD And Surge Protection (TVS/ESD), SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| bnsrv05-4lc-etched.glb | 17d ago |
| bnsrv05-4lc-etched.step | 17d ago |
| bnsrv05-4lc-hero.glb | 17d ago |
| bnsrv05-4lc-hero.overlay.json | 17d ago |
| bnsrv05-4lc.glb | 17d ago |
| bnsrv05-4lc.kicad_mod | 17d ago |
| bnsrv05-4lc.kicad_sym | 17d ago |
| bnsrv05-4lc.lbr | 17d ago |
| bnsrv05-4lc.step | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
BNSRV05-4LC
BORN · ESD And Surge Protection (TVS/ESD) · SOT-23-6
BNSRV05-4LC from BORN, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | passive | ESD-protected data I/O line; I/O-to-I/O capacitance 0.7pF typ (1.0pF max) and I/O-to-GND 1.0pF typ (1.4pF max). |
| 2 | GND | power_in | Ground reference for the TVS array; connect to circuit ground. |
| 3 | I/O | passive | ESD-protected data I/O line; I/O-to-I/O capacitance 0.7pF typ (1.0pF max) and I/O-to-GND 1.0pF typ (1.4pF max). |
| 4 | I/O | passive | ESD-protected data I/O line; I/O-to-I/O capacitance 0.7pF typ (1.0pF max) and I/O-to-GND 1.0pF typ (1.4pF max). |
| 5 | VCC | power_in | Protected supply rail connection for the steering diodes, with reverse stand-off voltage of 5.0V max. |
| 6 | I/O | passive | ESD-protected data I/O line; I/O-to-I/O capacitance 0.7pF typ (1.0pF max) and I/O-to-GND 1.0pF typ (1.4pF max). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOT-23-6 |
| Category | Circuit Protection |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VBR | 6 | 8.8 | 9.5 | V | IT=1mA | 2 |
| Reverse Leakage Current | IR | 0.1 | uA | VRWM=5V,T=25◦C | 2 | ||
| Peak Pulse Current | IPP | 24 | A | tp =8/20us | 2 | ||
| Clamping Voltage | VC | 20 | V | IPP=24A, tp =8/20us | 2 | ||
| Junction Capacitance (IO to IO) | Cj | 0.7 | 1 | pF | VR=0V,f=1MHZ,IO to IO | 2 | |
| Junction Capacitance (IO to GND) | Cj | 1 | 1.4 | pF | VR=0V,f=1MHZ,IO to GND | 2 | |
| Reverse Stand-Off Voltage | VRWM | 5 | V | 2 | |||
| Peak Pulse Power | PPP | 480 | Watts | tp =8/20μs | 2 | ||
| Peak Pulse Current | IPP | 24 | A | tp =8/20μs | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 30 | KV | 2 | |||
| ESD per IEC 61000-4-2 (Contact) | VESD | 30 | KV | 2 | |||
| Lead Soldering Temperature | TL | 260 | ◦C | 10 seconds | 2 | ||
| Junction Temperature | TJ | -55 | 150 | ◦C | 2 | ||
| Storage Temperature | Tstg | -55 | 150 | ◦C | 2 |
CAD (KiCad official)
- Symbol:
BNSRV05-4LC - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
bnsrv05-4lc-etched.step/bnsrv05-4lc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bnsrv05-4lc.step/bnsrv05-4lc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (4 pp, sha256
58d8a260fb064b8f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).