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BNSP3004-04XTG

Public Made by Adom

by adom

BORN ESD And Surge Protection (TVS/ESD), SOT-563. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

markdown

BNSP3004-04XTG

BORN · ESD And Surge Protection (TVS/ESD) · SOT-563

BNSP3004-04XTG from BORN, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O bidirectional Protected data/power line I/O of the ESD protection diode array, rated for 5.0 V reverse stand-off (VRWM) with 60 W peak pulse power (tp = 8/20μs).
2 GND power_in Ground reference for the ESD protection diode array; the I/O-to-GND junction capacitance is 0.35 pF typ and 0.5 pF max at VR = 0 V, f = 1 MHz.
3 I/O bidirectional Protected data/power line I/O of the ESD protection diode array, rated for 5.0 V reverse stand-off (VRWM) with 60 W peak pulse power (tp = 8/20μs).
4 I/O bidirectional Protected data/power line I/O of the ESD protection diode array, rated for 5.0 V reverse stand-off (VRWM) with 60 W peak pulse power (tp = 8/20μs).
5 Vcc power_in Supply pin of the ESD protection diode array; the datasheet gives no separate supply voltage range for this pin beyond the 5.0 V reverse stand-off rating.
6 I/O bidirectional Protected data/power line I/O of the ESD protection diode array, rated for 5.0 V reverse stand-off (VRWM) with 60 W peak pulse power (tp = 8/20μs).

Key specifications

Parameter Value
Manufacturer BORN
Package SOT-563
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPP 60 Watts tp =8/20μs 2
Peak Pulse Current Ipp 3.5 A tp =8/20μs (note1) 2
ESD per IEC 61000-4-2 (Air) VESD 20 kV ESD per IEC 61000-4-2 (Air) 2
ESD per IEC 61000-4-2 (Contact) VESD 15 kV ESD per IEC 61000-4-2 (Contact) 2
Lead Soldering Temperature TL 260 ℃ 10 seconds 2
Junction Temperature TJ -55 125 ℃ 2
Storage Temperature Tstg -55 125 ℃ 2
Reverse Stand-Off Voltage VRWM 5 V 2
Reverse Breakdown Voltage VBR 6 V IT=1mA 2
Reverse Leakage Current IR 50 500 nA VRWM=5V,T=25℃ 2
Peak Pulse Current IPP 3 A tp =8/20μs 2
Clamping Voltage VC 15 18 V IPP=3.5A,tp=8/20μs 2
Junction Capacitance IO to IO Cj 0.2 0.25 pF VR = 0V, f = 1MHz; IO to IO 2
Junction Capacitance IO to GND Cj 0.35 0.5 pF VR = 0V, f = 1MHz; IO to GND 2

CAD (KiCad official)

  • Symbol: BNSP3004-04XTG
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: bnsp3004-04xtg-etched.step / bnsp3004-04xtg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bnsp3004-04xtg.step / bnsp3004-04xtg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (4 pp, sha256 79ac4278d6df632a, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF