master
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 3d ago
viewers bmm350: viewers · Ray 3d ago
block-diagram.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
bmm350-etched.glb Publish 0.1.0 · Ray 3d ago
bmm350-etched.step bmm350: factory component page (tier=lcsc) · Ray 3d ago
bmm350-hero.glb bmm350: hero GLB from the etched model (keeps the MPN mark) · Ray 3d ago
bmm350-hero.overlay.json Publish 0.1.0 · Ray 3d ago
bmm350.glb Publish 0.1.0 · Ray 3d ago
bmm350.kicad_mod Publish 0.1.0 · Ray 3d ago
bmm350.kicad_sym Publish 0.1.0 · Ray 3d ago
bmm350.lbr Publish 0.1.0 · Ray 3d ago
bmm350.step Publish 0.1.0 · Ray 3d ago
connection-diagram.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i2c-read-timing.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i2c-timing-diagram.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i2c-write-timing.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i3c-read-multiple.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i3c-read-single.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i3c-timing-control.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i3c-write-multiple.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
i3c-write-single.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
laser-marking.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
package-dimensions.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
package.json Publish 0.1.0 · Ray 3d ago
page.json Set visibility: public · Ray 3d ago
pinout-diagram.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
power-mode-transitions.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
product-photo.png Migrate asset from Helium wiki · Kyle Bergstedt 4mo ago
README.md Publish 0.1.0 · Ray 3d ago

BMM350

Bosch Sensortec · Specialized Sensors · WLCSP-9(1.3x1.3)

BMM350 from Bosch Sensortec, in a WLCSP-9(1.3x1.3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
A1 INT output Interrupt output of the BMM350.
A2 SDA bidirectional I2C / I3C data line.
A3 SCK input I2C / I3C clock line.
B1 GND power_in Analog, digital and IO ground.
B2 ADSEL input Logic status of ADSEL defines the LSB of the I2C legacy address; connect to GND or VDDIO.
B3 VDDIO power_in IO supply; use a decoupling capacitor (100 nF per the connection diagram), with a VDDIO range of 1.72 V to 3.6 V.
C1 VDD power_in Digital and analog supply; use a decoupling capacitor (100 nF per the connection diagram), with a VDD range of 1.72 V to 1.98 V.
C2 CRST passive Connect to an external 2.2 µF low-inductance capacitor (non-magnetic, low-resistance type), which must support 200 mA peak current.
C3 BYPASS passive Connect to ground.

Key specifications

Parameter Value
Manufacturer Bosch Sensortec
Package WLCSP-9(1.3x1.3)
Category Sensors
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, internal domains (VDD) VDD 1.72 1.98 V 8
Supply voltage, I/O domain (VDDIO) VDDIO 1.72 3.6 V 8
Voltage input low level VIL,a 0.3 xVDDIO I2C&I3C 8
Voltage input high level VIH,a 0.7 xVDDIO I2C&I3C 8
Voltage output low level VOL,a 0.23 xVDDIO IOL<= 2mA 8
Voltage output high level VOH 0.8 xVDDIO IOH <= 2mA 8
Operating temperature TA -40 85 °C 8
Current in normal mode (regular power setting) Idd,n,rp 200 uA ODR=100, 25°C, averaging=2 samples 8
Current in normal mode (low noise) Idd,n,ln 350 uA ODR=100, 25°C, averaging=4 samples 8
Current in suspend mode Idd,sus 1.8 uA data retention 8
Peak supply current in active mode (normal or forced mode) IDDpk,m 3.5 mA In measurement phase; TA=25°C, before bit reset 8
Sensor start-up time (suspend to normal mode) Tsus2nm 70 ms Start-up time from suspend mode to normal mode 8
Sensor start-up time (OFF to suspend mode) Tpon2sus 2.5 ms Start-up time from OFF to suspend mode 8
Sensitivity/gain error after soldering, x/y axis Gerr,m -1 1 % After API compensation; TA=25°C; Nominal VDD supplies; x/y axis 10
Sensitivity/gain error after soldering, Z axis Gerr,m -3 3 % After API compensation; TA=25°C; Nominal VDD supplies; Z axis 10
Sensitivity temperature drift TCSm -0.01 0.01 %/K After API compensation; -40°C ≤ TA ≤ +85°C; Nominal VDD supplies; all axis 10
TCO error TCOerr -200 200 nT/K -40°C to 85°C 10
Hysteresis, x/y axis hystxy 0.02 % RT, after FSS, in % of FSS 10
Hysteresis, z axis hystz 0.4 % RT, after FSS, no reset, in % of FSS 10
Integral nonlinearity, x/y axis INLm,FS -10 10 µT Max. deviation to best fit straight line; x/y axis 10
Integral nonlinearity, z axis INLm,FS -20 20 µT Max. deviation to best fit straight line; z axis 10
Output noise rms, x/y channel nrms,xy -190 190 nTrms 3dB BW= ODR/2; x.y channel; ODR=100; averaging=2 samples 10
Output noise rms, z channel nrms,z -450 450 nTrms 3dB BW= ODR/2; z channel; ODR=100; averaging=2 samples 10
Sensitivity drift after magnetic field shock recovery -100 100 µT 250 mT 10
Sensitivity drift after magnetic field shock recovery (relative) -1 1 % 250 mT 10
Voltage at supply pin VDD VDD -0.3 2 V VDD Pin 11
Voltage at supply pin VDDIO VDDIO -0.3 3.6 V VDDIO Pin 11
Voltage at any logic pad -0.3 V Non-supply pin 11
Operating temperature, TA TA -40 85 °C Active operation 11
Passive storage temperature range -50 125 °C ≤ 65% rel. H. 11
Non-volatile memory (OTP) data retention 10 year T = 85°C 11
Mechanical shock (JESD22-B104C) 20000 g Duration ≤ 500µs 11
Drop in reel onto hard surfaces 2 m 11
ESD HBM at any pin -2 2 kV 11
ESD CDM -500 500 V 11
Latch-up LU -100 100 mA 11
Magnetic field, any direction -250 250 mT Any direction 11
CRST external capacitor (nominal value) CRST 2.2 uF 60

CAD (KiCad official)

  • Symbol: BMM350
  • Footprint: Package_CSP:WLCSP-9_1.21x1.22mm_Layout3x3_P0.4mm
  • 3D model: WLCSP-9(1.3x1.3) (KiCad packages3D, STEP)
  • 3D model files: bmm350-etched.step / bmm350-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bmm350.step / bmm350.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Bosch Sensortec datasheet (63 pp, sha256 db26bd71f271fcea, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF