JST BM03B-GHS-TBT top-entry SMT header

JST GH 1.25 mm top-entry SMT header, with portable native KiCad documentation and explicitly provisional nominal geometry.

Manufacturer GH drawing · JST handling precautions

The keyed GH family uses SSHL-002T-P0.2 contacts. SSHL-003 variants are not compatible. Applicable wire range is AWG30–26 with insulation diameter0.76–1.00mm. Series rating is1A with AWG26,50V; −40 to105°C including current-related heating. These ratings are not a guarantee for every harness wire or application.

This top-entry3-position header has1.25mm contact pitch and7.00mm overall width. The nominal KiCad STEP is7.00×4.9504×4.20mm including terminals. Manufacturer mounting pattern gives0.60mm-wide signal pads on1.25mm pitch,1.70mm signal-pad length and two1.00×2.80mm retention pads. The two MP pads are mechanical solder tabs, not additional signal contacts. Pin1 is the negative-X signal pad in the supplied footprint; the manufacturer drawing is the same mounting-face pattern rotated180°. Verify orientation before connecting.

The footprint and STEP come from KiCad libraries under their own license, not manufacturer CAD. The original symbol has three passive electrical pins. No Altium/Fusion native parity is claimed.

Use JST's specified tooling and establish the contact-specific conductor/insulation crimp settings with the actual wire. General handling guidance calls for stranded tin-plated annealed copper wire; solder-dipped end preparation requires separate review. Physical retention, pull test, mating orientation, installed cable bend and service-life qualification remain open. Native asset validation and live wiki review are recorded separately; publication is not hardware approval.

Reusable assets

Native symbol · Interactive symbol · Native footprint · Interactive footprint · STEP

Local top, underside and oblique renders have been reviewed. Live wiki rendering remains pending; see provenance.json.