component
BL3H7B
Public Made by Adomby adom
GME(银河微电) , SSOP-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BL3H7B
GME(银河微电) · IC · SSOP-4
BL3H7B from GME(银河微电), in a SSOP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | input | LED anode of the input side; forward current IF max 50 mA (IF = 5 mA for CTR test), VF 1.2 V typ / 1.4 V max at IF = 20 mA. |
| 2 | Cathode | input | LED cathode of the input side; reverse voltage VR max 6 V. |
| 3 | Emitter | passive | Phototransistor emitter; emitter-collector voltage VECO max 7 V. |
| 4 | Collector | passive | Phototransistor collector; VCEO max 80 V and collector current IC max 50 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | SSOP-4 |
| Category | |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Current Transfer Ratio (rank B, per rank table) | CTR | 130 | 260 | % | IF = 5 mA, VCE = 5V | 4 | |
| Collector Current | IC | 2.5 | 30 | mA | IF = 5mA, VCE = 5V | 3 | |
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC = 0.1mA, IF = 0 | 3 | ||
| Emitter-Collector Breakdown Voltage | BVECO | 7 | V | IE = 10μA, IF = 0 | 3 | ||
| Forward Voltage | VF | 1.2 | 1.4 | V | IF = 20mA | 3 | |
| Peak Forward Voltage | VFM | 3 | V | IFM = 0.5A | 3 | ||
| Reverse Current | IR | 10 | μA | VR = 4V | 3 | ||
| Input Capacitance | Cin | 30 | 250 | pF | VR = 0V, f = 1kHz | 3 | |
| Collector-Emitter Dark Current | ICEO | 100 | nA | VCE = 20V, IF = 0 | 3 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 | 0.2 | V | IF = 20mA, IC = 1mA | 3 | |
| Isolation Current | Risc | 2 | μA | DC6000V, 40~60% R.H. | 3 | ||
| Floating Capacitance | CIO | 0.6 | 1 | pF | VIO = 0, f = 1MHz | 3 | |
| Turn On Time | Ton | 4 | 18 | μs | VCE=2V, RL= 100Ω, IC=2mA | 4 | |
| Turn Off Time | Toff | 3 | 18 | μs | 4 | ||
| Cut-off Frequency | fC | 80 | kHz | VCE = 5V, IC = 2mA, RL=100Ω, -3dB | 4 | ||
| Forward Current | IF | 50 | mA | 2 | |||
| Peak Forward Current | IFM | 1 | A | Pulse width ≤1μs, duty ratio 0.001 | 2 | ||
| Reverse Voltage | VR | 6 | V | 2 | |||
| Input Power Dissipation | PD | 70 | mW | 2 | |||
| Collector Power Dissipation | PC | 150 | mW | 2 | |||
| Collector Current | IC | 50 | mA | 2 | |||
| Collector-Emitter Voltage | VCEO | 80 | V | 2 | |||
| Emitter-Collector Voltage | VECO | 7 | V | 2 | |||
| Total Power Dissipation | PTOT | 200 | mW | 3 | |||
| Isolation Voltage | VISO | 3750 | Vrms | AC for 1 minute, 40 to 60% RH | 3 | ||
| Rated Impulse Isolation Voltage | VIOTM | 5000 | V | 3 | |||
| Rated Repetitive Peak Isolation Voltage | VIORM | 600 | V | 3 | |||
| Operating Temperature | TOPR | -55 | 110 | °C | 3 | ||
| Storage Temperature Range | TSTG | -55 | 125 | °C | 3 | ||
| Soldering Temperature | TSOL | 260 | °C | For 10 seconds | 3 | ||
| Thermal Resistance Junction-to-Air | RθJA | 430 | °C/W | 3 | |||
| Thermal Resistance Junction-to-Case | RθJC | 350 | °C/W | 3 | |||
| Thermal Resistance Junction-to-Lead | RθJL | 368 | °C/W | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin-plated leads; solderability-per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BL3H7B - Footprint:
Package_SO:SSOP-4_4.4x2.6mm_P1.27mm - 3D model: SSOP-4, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.75 mm nominal SSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
bl3h7b-etched.step/bl3h7b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bl3h7b.step/bl3h7b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GME(银河微电) datasheet (9 pp, sha256
bb544b4d57ab17be, retrieved 2026-11-03, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BL3H7B
**GME(银河微电)** · IC · SSOP-4
BL3H7B from GME(银河微电), in a SSOP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | input | LED anode of the input side; forward current IF max 50 mA (IF = 5 mA for CTR test), VF 1.2 V typ / 1.4 V max at IF = 20 mA. |
| 2 | Cathode | input | LED cathode of the input side; reverse voltage VR max 6 V. |
| 3 | Emitter | passive | Phototransistor emitter; emitter-collector voltage VECO max 7 V. |
| 4 | Collector | passive | Phototransistor collector; VCEO max 80 V and collector current IC max 50 mA. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | SSOP-4 |
| Category | |
| Pins | 4 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Current Transfer Ratio (rank B, per rank table) | CTR | 130 | | 260 | % | IF = 5 mA, VCE = 5V | 4 |
| Collector Current | IC | 2.5 | | 30 | mA | IF = 5mA, VCE = 5V | 3 |
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | | | V | IC = 0.1mA, IF = 0 | 3 |
| Emitter-Collector Breakdown Voltage | BVECO | 7 | | | V | IE = 10μA, IF = 0 | 3 |
| Forward Voltage | VF | | 1.2 | 1.4 | V | IF = 20mA | 3 |
| Peak Forward Voltage | VFM | | | 3 | V | IFM = 0.5A | 3 |
| Reverse Current | IR | | | 10 | μA | VR = 4V | 3 |
| Input Capacitance | Cin | | 30 | 250 | pF | VR = 0V, f = 1kHz | 3 |
| Collector-Emitter Dark Current | ICEO | | | 100 | nA | VCE = 20V, IF = 0 | 3 |
| Collector-Emitter Saturation Voltage | VCE(sat) | | 0.1 | 0.2 | V | IF = 20mA, IC = 1mA | 3 |
| Isolation Current | Risc | | | 2 | μA | DC6000V, 40~60% R.H. | 3 |
| Floating Capacitance | CIO | | 0.6 | 1 | pF | VIO = 0, f = 1MHz | 3 |
| Turn On Time | Ton | | 4 | 18 | μs | VCE=2V, RL= 100Ω, IC=2mA | 4 |
| Turn Off Time | Toff | | 3 | 18 | μs | | 4 |
| Cut-off Frequency | fC | | 80 | | kHz | VCE = 5V, IC = 2mA, RL=100Ω, -3dB | 4 |
| Forward Current | IF | | | 50 | mA | | 2 |
| Peak Forward Current | IFM | | | 1 | A | Pulse width ≤1μs, duty ratio 0.001 | 2 |
| Reverse Voltage | VR | | | 6 | V | | 2 |
| Input Power Dissipation | PD | | | 70 | mW | | 2 |
| Collector Power Dissipation | PC | | | 150 | mW | | 2 |
| Collector Current | IC | | | 50 | mA | | 2 |
| Collector-Emitter Voltage | VCEO | | | 80 | V | | 2 |
| Emitter-Collector Voltage | VECO | | | 7 | V | | 2 |
| Total Power Dissipation | PTOT | | | 200 | mW | | 3 |
| Isolation Voltage | VISO | | | 3750 | Vrms | AC for 1 minute, 40 to 60% RH | 3 |
| Rated Impulse Isolation Voltage | VIOTM | | | 5000 | V | | 3 |
| Rated Repetitive Peak Isolation Voltage | VIORM | | | 600 | V | | 3 |
| Operating Temperature | TOPR | -55 | | 110 | °C | | 3 |
| Storage Temperature Range | TSTG | -55 | | 125 | °C | | 3 |
| Soldering Temperature | TSOL | | | 260 | °C | For 10 seconds | 3 |
| Thermal Resistance Junction-to-Air | RθJA | | | 430 | °C/W | | 3 |
| Thermal Resistance Junction-to-Case | RθJC | | | 350 | °C/W | | 3 |
| Thermal Resistance Junction-to-Lead | RθJL | | | 368 | °C/W | | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: Matte tin-plated leads; solderability-per MIL-STD-202, Method 208 | 1 |
## CAD (KiCad official)
- Symbol: `BL3H7B`
- Footprint: `Package_SO:SSOP-4_4.4x2.6mm_P1.27mm`
- 3D model: SSOP-4, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.75 mm nominal SSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `bl3h7b-etched.step` / `bl3h7b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bl3h7b.step` / `bl3h7b.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [GME(银河微电) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604432695560982528) (9 pp, sha256 `bb544b4d57ab17be`, retrieved 2026-11-03, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bl3h7b-datasheet.pdf)