component
BL2302
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GME(银河微电) , SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BL2302
GME(银河微电) · IC · SOT-23
BL2302 from GME(银河微电), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±8 V (VGSS), threshold 0.6 to 1.2 V at 250 µA, and electrostatic sensitive. |
| 2 | D | passive | Drain; drain-source voltage 20 V (VDSS), continuous drain current 2.8 A at TA=25℃ and pulsed 10 A. |
| 3 | S | passive | Source; RDS(ON) is at most 45 mΩ at VGS=4.5 V and 59 mΩ at VGS=2.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | SOT-23 |
| Category | |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDSS | 20 | V | VGS=0V, ID=250μA | 2 | ||
| Drain to Source Leakage Current | IDSS | 1 | uA | TA=25℃ VDS=20V, VGS=0V | 2 | ||
| Drain to Source Leakage Current | IDSS | 10 | uA | TJ=55℃ VDS=20V, VGS=0V | 2 | ||
| On-state Drain Current | ID(On) | 6 | A | VGS=4.5V, VDS≥5.0V | 2 | ||
| On-state Drain Current | ID(On) | 4 | A | VGS=2.5V, VDS≥5.0V | 2 | ||
| Gate-body Leakage | IGSS | -100 | 100 | nA | VGS=±8V, VDS=0V | 2 | |
| Gate Threshold Voltage | VGS(TH) | 0.6 | 0.9 | 1.2 | V | VDS= VGS, ID=250uA | 2 |
| Static Drain-Source On-resistance | RDS(ON) | 27 | 45 | mΩ | VGS=4.5V, ID=2.9A | 2 | |
| Static Drain-Source On-resistance | RDS(ON) | 37 | 59 | mΩ | VGS=2.5V, ID=2.5A | 2 | |
| Diode Forward Voltage | VSD | 0.79 | 1.2 | V | IS=1A, VGS=0 V | 2 | |
| Drain-Source Voltage | VDSS | 20 | V | 1 | |||
| Gate-Source Voltage | VGSS | -8 | 8 | V | 1 | ||
| Continuous Drain Current | ID | 2.8 | A | TA=25℃ | 1 | ||
| Continuous Drain Current | ID | 2.2 | A | TA=70℃ | 1 | ||
| Pulsed Drain current | IDM | 10 | A | 1 | |||
| Power Dissipation (SOT-23) | PD | 0.4 | W | SOT-23 package | 1 | ||
| Operating Junction Temperature Range | Tj | -55 | 150 | ℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction to Ambient Air | RθJA | 312 | ℃/W | SOT-23 package | 1 | ||
| Thermal Resistance Junction to Lead | RθJL | 214 | ℃/W | SOT-23 package | 1 | ||
| Thermal Resistance Junction to Case | RθJC | 175 | ℃/W | SOT-23 package | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte Tin Plated Leads, Solderable Per MIL-STD-202, Method 208. | 1 |
CAD (KiCad official)
- Symbol:
BL2302 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bl2302-etched.step/bl2302-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bl2302.step/bl2302.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GME(银河微电) datasheet (5 pp, sha256
ed5e29417425d747, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BL2302
**GME(银河微电)** · IC · SOT-23
BL2302 from GME(银河微电), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±8 V (VGSS), threshold 0.6 to 1.2 V at 250 µA, and electrostatic sensitive. |
| 2 | D | passive | Drain; drain-source voltage 20 V (VDSS), continuous drain current 2.8 A at TA=25℃ and pulsed 10 A. |
| 3 | S | passive | Source; RDS(ON) is at most 45 mΩ at VGS=4.5 V and 59 mΩ at VGS=2.5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GME(银河微电) |
| Package | SOT-23 |
| Category | |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDSS | 20 | | | V | VGS=0V, ID=250μA | 2 |
| Drain to Source Leakage Current | IDSS | | | 1 | uA | TA=25℃ VDS=20V, VGS=0V | 2 |
| Drain to Source Leakage Current | IDSS | | | 10 | uA | TJ=55℃ VDS=20V, VGS=0V | 2 |
| On-state Drain Current | ID(On) | 6 | | | A | VGS=4.5V, VDS≥5.0V | 2 |
| On-state Drain Current | ID(On) | 4 | | | A | VGS=2.5V, VDS≥5.0V | 2 |
| Gate-body Leakage | IGSS | -100 | | 100 | nA | VGS=±8V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(TH) | 0.6 | 0.9 | 1.2 | V | VDS= VGS, ID=250uA | 2 |
| Static Drain-Source On-resistance | RDS(ON) | | 27 | 45 | mΩ | VGS=4.5V, ID=2.9A | 2 |
| Static Drain-Source On-resistance | RDS(ON) | | 37 | 59 | mΩ | VGS=2.5V, ID=2.5A | 2 |
| Diode Forward Voltage | VSD | | 0.79 | 1.2 | V | IS=1A, VGS=0 V | 2 |
| Drain-Source Voltage | VDSS | | | 20 | V | | 1 |
| Gate-Source Voltage | VGSS | -8 | | 8 | V | | 1 |
| Continuous Drain Current | ID | | | 2.8 | A | TA=25℃ | 1 |
| Continuous Drain Current | ID | | | 2.2 | A | TA=70℃ | 1 |
| Pulsed Drain current | IDM | | | 10 | A | | 1 |
| Power Dissipation (SOT-23) | PD | | | 0.4 | W | SOT-23 package | 1 |
| Operating Junction Temperature Range | Tj | -55 | | 150 | ℃ | | 1 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance Junction to Ambient Air | RθJA | | | 312 | ℃/W | SOT-23 package | 1 |
| Thermal Resistance Junction to Lead | RθJL | | | 214 | ℃/W | SOT-23 package | 1 |
| Thermal Resistance Junction to Case | RθJC | | | 175 | ℃/W | SOT-23 package | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: Matte Tin Plated Leads, Solderable Per MIL-STD-202, Method 208. | 1 |
## CAD (KiCad official)
- Symbol: `BL2302`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bl2302-etched.step` / `bl2302-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bl2302.step` / `bl2302.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [GME(银河微电) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603037673695567872) (5 pp, sha256 `ed5e29417425d747`, retrieved 2026-11-04, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bl2302-datasheet.pdf)