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Contents

README

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BIS48510HW

BORN · Isolated RS-485/422 Transceivers · SOIC-16-300mil

BIS48510HW from BORN, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDA power_in Logic side power supply input; connect 0.1μF and 1μF bypass capacitors between VDDA and GNDA pins, placed as close as possible to the device.
2 GNDA power_in Logic side ground reference for digital signals.
3 RO output Receiver data output; when RE is low (enabled), outputs high if (VA-VB)>-50mV or low if (VA-VB)<-200mV, high-impedance when RE is high.
4 RE input Receiver enable control input, active low.
5 DE input Driver enable control input, active high; disables data transmission and sets driver output to high-impedance when low; enables driver when high.
6 DI input Driver data input; when DE is high, non-inverting output (A) follows DI logic level and inverting output (B) inverts DI level.
7 GNDA power_in Logic side ground reference for digital signals.
8 GNDA power_in Logic side ground reference for digital signals.
9 GNDB power_in Bus side ground reference for RS-485 bus signals.
10 GNDB power_in Bus side ground reference for RS-485 bus signals.
11 NC unconnected No internal connection.
12 A bidirectional RS-485 bus driver non-inverting output and receiver non-inverting input for half-duplex operation.
13 B bidirectional RS-485 bus driver inverting output and receiver inverting input for half-duplex operation.
14 NC unconnected No internal connection.
15 GNDB power_in Bus side ground reference for RS-485 bus signals.
16 VDDB power_in Bus side power supply input; connect 0.1μF and 1μF bypass capacitors between VDDB and GNDB pins, placed as close as possible to the device.

Key specifications

Parameter Value
Manufacturer BORN
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: BIS48510HW
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: bis48510hw-etched.step / bis48510hw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bis48510hw.step / bis48510hw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (21 pp, sha256 2e1d7c5b5622e338, retrieved 2026-09-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF