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BIN1051S-C

BORN · CAN Transceivers · SOIC-8

BIN1051S-C from BORN, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmitter data input: driving TXD low makes CANH/CANL dominant and high makes them recessive, with a dominant state held longer than tDOM (2 to 8 ms) released by the timeout and an internal weak pull-up to VCC or VIO.
2 GND power_in Ground reference for the device.
3 VCC power_in 5 V supply input (4.5 V to 5.5 V recommended); place a bypass capacitor of at least 0.1 µF between VCC and GND, located close to the pin.
4 RXD output Receiver data output that is high when the bus is recessive or open and low when the bus is dominant, with recommended output current limits of -2 mA (IOH) and 2 mA (IOL).
5 NC unconnected No internal connection; leave floating and do not connect externally.
6 CANL bidirectional Low-level CAN bus line for the differential CAN bus I/O, with ±58 V fault protection and a common-mode input range of ±30 V.
7 CANH bidirectional High-level CAN bus line for the differential CAN bus I/O, with ±58 V fault protection and a common-mode input range of ±30 V.
8 S input Silent mode control: high places the transmitter in silent mode (receiver stays active), while low or open selects normal mode; the pin has an internal pull-down.

Key specifications

Parameter Value
Manufacturer BORN
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC 5V supply voltage (absolute max) VCC -0.3 7 V 3
CAN bus I/O voltage (CANH, CANL) VBUS -58 58 V 3
Maximum differential voltage CANH to CANL V(DIFF) -58 58 V 3
Logic-side input voltage (TXD, S) V(Logic_Input) -0.3 7 V 3
Logic-side output voltage (RXD) V(Logic_Output) -0.3 7 V 3
RXD receiver output current IO(RXD) -8 8 mA 3
Junction temperature TJ -55 150 °C 3
Storage temperature TSTG -65 150 °C 3
VCC 5V supply voltage (recommended) VCC 4.5 5.5 V 3
RXD port output current @ high level IOH(RXD) -2 mA 3
RXD port output current @ low level IOL(RXD) 2 mA 3
5V supply current, dominant ICC 40 70 mA TXD = 0V , RL = 60 Ω(显性), 图 14 4
5V supply current, dominant ICC 45 80 mA TXD = 0V , RL = 50 Ω(显性), 图 14 4
5V supply current, dominant with bus short ICC 180 mA TXD = 0V , CANH = -12V(显性), 图 14 4
5V supply current, recessive ICC 0.7 2.5 mA TXD = VCC , RL = 50 Ω(隐性), 图 14 4
5V supply current, silent mode ICC 0.6 2.5 mA S = VCC(静音模式) , 图 14 4
VCC UVLO voltage, rising VUV_VCC 4.2 4.4 V 上升 4
VCC UVLO voltage, falling VUV_VCC 3.8 4 4.25 V 下降 4
S mode-select input high level VIH 2 V 4
S mode-select input low level VIL 0.8 V 4
S input high-level leakage current IIH 30 uA S = VCC or VIO = 5.5V 4
S input low-level leakage current IIL -2 2 uA S = 0V ,VCC = VIO = 5.5V 4
S input leakage current, unpowered Ilek(off) -1 1 uA S = 5.5V ,VCC = VIO = 0V 4
TXD input high level VIH 2 V 4
TXD input low level VIL 0.8 V 4
TXD input high-level leakage current IIH -2.5 0 1 uA TXD = VCC = VIO = 5.5V 4
TXD input low-level leakage current IIL -100 -47 -7 uA TXD = 0V ,VCC = VIO = 5.5V 4
TXD input leakage current, unpowered Ilek(off) -1 0 1 uA TXD = 5.5V ,VCC = VIO = 0V 4
RXD output high level VOH 4 4.6 V 4
RXD output low level VOL 0.2 0.4 V 4
RXD output leakage current, unpowered Ilek(off) -1 0 1 uA RXD = 5.5V ,VCC = VIO = 0V 4
Bus single-ended output voltage, dominant, CANH VO(DOM) 2.75 4.5 V TXD = 低电平, S = 0V , RL = 50-65Ω , CANH 端口, 如图 14 5
Bus single-ended output voltage, dominant, CANL VO(DOM) 0.5 2.25 V TXD = 低电平, S = 0V , RL = 50-65Ω , CANL 端口, 如图 14 5
Bus differential output voltage, dominant VOD(DOM) 1.5 3 V TXD = 低电平, RL = 60Ω , RCM = 165Ω , -5V ≤ VCM ≤ +10V 5
Bus differential output voltage, dominant VOD(DOM) 1.4 3 V TXD = 低电平, RL = 45-50Ω , RCM open , 如图 14 5
Bus differential output voltage, dominant VOD(DOM) 1.5 5 V TXD = 低电平, RL = 2240Ω , RCM open , 如图 14 5
Bus single-ended output voltage, recessive, CANH VO(REC) 2 3 V TXD = 高电平, 空载, CANH 端口, 如图 14 5
Bus single-ended output voltage, recessive, CANL VO(REC) 2 3 V TXD = 高电平, 空载, CANL 端口, 如图 14 5
Bus differential output voltage, recessive VOD(REC) -120 12 mV TXD = 高电平, S = 0V , RL = 60 Ω , 如图 14 5
Bus differential output voltage, recessive, no load VOD(REC) -50 50 mV TXD = 高电平, S = 0V , 空载, 如图 14 5
Short-circuit current, dominant (CANL open) IOS(SS_DOM) -100 mA TXD = 低电平, CANL 开路, CANH = -15V to 40V, 如图 20 5
Short-circuit current, dominant (CANH open) IOS(SS_DOM) 100 mA TXD = 低电平, CANH 开路, CANL = -15V to 40V 5
Short-circuit current, recessive IOS(SS_rec) -5 5 mA TXD = 高电平, VBUS = -27 to 32V, 如图 20 5
Transient symmetry (dominant and recessive) Vsys 0.9 1.1 V/V RL = 60 Ω , RCM open , TXD = 250kHz or 1MHz, 如图 14 5
DC symmetry (dominant and recessive) Vsys_dc -0.4 0.4 V RL = 60 Ω , RCM open , 如图 14 5
Common-mode input range, CANH or CANL to GND VCM -30 30 V CANH 或 CANL 到地, RXD 输出有效, 如图 15 5
Differential input threshold, recessive VDIFF_R 0.5 V TXD = 高电平, VCM = -20V to 20V , 如图 15 5
Differential input threshold, dominant VDIFF_D 0.9 V TXD = 高电平, VCM = -20V to 20V , 如图 15 5
Differential input threshold, recessive VDIFF_R 0.4 V TXD = 高电平, VCM = -30V to 30V , 如图 15 5
Differential input threshold, dominant VDIFF_D 1 V TXD = 高电平, VCM = -30V to 30V , 如图 15 5
Differential input hysteresis VDIFF_(HYST) 120 mV 5
CANH/CANL input resistance RIN 15 40 kΩ TXD = 高电平, VCM = -30V to 30V 5
Differential input resistance RDIFF 30 80 kΩ TXD = 高电平, VCM = -30V to 30V 5
Input resistance matching RDIFF(M) -2 2 % CANH = CANL=5V 5
Input leakage current ILKG 4.8 uA VCC = 0V , VCAN = 5V 5
Single-ended input capacitance (CANH or CANL to GND) CIN 24 30 pF CANH 或者 CANL 到地 5
Differential input capacitance (CANH to CANL) CIN_DIFF 12 15 pF CANH 到 CANL 5
TXD dominant timeout tDOM 2 5 8 ms RL=60Ω, CL open, 如图 14 6
Thermal resistance, junction to ambient, SOIC8 RθJA 125 °C/W 3

CAD (KiCad official)

  • Symbol: BIN1051S-C
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: bin1051s-c-etched.step / bin1051s-c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bin1051s-c.step / bin1051s-c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (19 pp, sha256 612d8c5446177e1b, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF