component
BGC08C
Public Made by Adomby adom
BORN ESD Protection Devices, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 11d ago |
| viewers | 11d ago |
| bgc08c-etched.glb | 11d ago |
| bgc08c-etched.step | 11d ago |
| bgc08c-hero.glb | 11d ago |
| bgc08c-hero.overlay.json | 11d ago |
| bgc08c.glb | 11d ago |
| bgc08c.kicad_mod | 11d ago |
| bgc08c.kicad_sym | 11d ago |
| bgc08c.lbr | 11d ago |
| bgc08c.step | 11d ago |
| package.json | 11d ago |
| page.json | 11d ago |
| README.md | 11d ago |
BGC08C
BORN · ESD Protection Devices · SOD-323
BGC08C from BORN, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM | 8 | V | 2 | |||
| Reverse Breakdown Voltage | VBR | 9 | 10.5 | 12 | V | IT=1mA | 2 |
| Reverse Leakage Current | IR | 0.2 | uA | VRWM=8.0V,T=25◦C | 2 | ||
| Peak Pulse Current | IPP | 16 | A | tp =8/20us | 2 | ||
| Clamping Voltage | VC | 24 | 30 | V | IPP=16A, tp =8/20us | 2 | |
| Junction Capacitance | Cj | 1 | 1.5 | pF | VR=0V,T=25◦C,f=1MHZ | 2 | |
| Peak Pulse Power | PPP | 400 | Watts | tp =8/20μs | 2 | ||
| Peak Pulse Current | IPP | 16 | A | tp =8/20μs | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | 30 | KV | ESD per IEC 61000-4-2 (Air) | 2 | ||
| ESD per IEC 61000-4-2 (Contact) | VESD | 30 | KV | ESD per IEC 61000-4-2 (Contact) | 2 | ||
| Lead Soldering Temperature | TL | 260 | ◦C | 10 seconds | 2 | ||
| Junction Temperature | TJ | -55 | 150 | ◦C | 2 | ||
| Storage Temperature | Tstg | -55 | 150 | ◦C | 2 |
CAD (KiCad official)
- Symbol:
BGC08C - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bgc08c-etched.step/bgc08c-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bgc08c.step/bgc08c.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (4 pp, sha256
1e3e24a5f092662e, retrieved 2026-10-28, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).