component
BGA7024
Public Made by Adomby adom
NXP Semicon RF Amplifiers, SOT-89-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 11d ago |
| viewers | 11d ago |
| bga7024-etched.glb | 11d ago |
| bga7024-etched.step | 11d ago |
| bga7024-hero.glb | 11d ago |
| bga7024-hero.overlay.json | 11d ago |
| bga7024.glb | 11d ago |
| bga7024.kicad_mod | 11d ago |
| bga7024.kicad_sym | 11d ago |
| bga7024.lbr | 11d ago |
| bga7024.step | 11d ago |
| package.json | 11d ago |
| page.json | 11d ago |
| README.md | 11d ago |
BGA7024
NXP Semicon · RF Amplifiers · SOT-89-3
BGA7024 from NXP Semicon, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC(RF) | power_in | RF supply voltage pin, DC-coupled, so it requires an external DC-blocking capacitor; the RF supply voltage limit is 5.7 V maximum. |
| 2 | GND | power_in | Ground pin; the center metal base of the SOT89 package also functions as the heatsink for the power amplifier. |
| 3 | RF_IN | input | RF input pin, DC-coupled, so it requires an external DC-blocking capacitor; the RF input power limit is 25 dBm maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | NXP Semicon |
| Package | SOT-89-3 |
| Category | RF & Radio |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RF supply voltage | VCC(RF) | 5.7 | V | 3 | |||
| RF input power | Pi(RF) | 25 | dBm | 3 | |||
| case temperature | Tcase | -40 | 85 | °C | 3 | ||
| junction temperature | Tj | 150 | °C | 3 | |||
| electrostatic discharge voltage | VESD | 2000 | V | Human Body Model (HBM); according to JEDEC standard 22-A114E | 3 | ||
| electrostatic discharge voltage | VESD | 500 | V | Charged Device Model (CDM); according to JEDEC standard 22-C101B | 3 | ||
| frequency | f | 400 | 2700 | MHz | Operation outside this range is possible but not guaranteed | 3 | |
| supply current | ICC | 95 | 110 | 125 | mA | Typical values at VCC = 5 V; Tcase = 25 °C | 3 |
| power gain | Gp | 13.5 | 15 | 16.5 | dB | f = 2140 MHz | 3 |
| output power at 1 dB gain compression | PL(1dB) | 24 | 25.5 | dBm | f = 2140 MHz | 4 | |
| output third-order intercept point | IP3O | 35 | 38 | dBm | f = 2140 MHz; PL = 11 dBm per tone; spacing = 1 MHz | 4 | |
| thermal resistance from junction to case | Rth(j-c) | 25 | K/W | Case is ground solder pad; IR measurement, device mounted on application board, still air | 3 |
CAD (KiCad official)
- Symbol:
BGA7024 - Footprint:
Package_TO_SOT_SMD:SOT-89-3 - 3D model: SOT-89-3 (KiCad packages3D, STEP)
- 3D model files:
bga7024-etched.step/bga7024-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bga7024.step/bga7024.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: NXP Semicon datasheet (23 pp, sha256
2662538bb7a18c3c, retrieved 2026-10-29, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).