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BGA2866

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NXP USA INC. RF Amplifiers, SOT-363-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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BGA2866

NXP USA INC. · RF Amplifiers · SOT-363-6

BGA2866 from NXP USA INC., in a SOT-363-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin, specified at 4.5 V to 5.5 V (5.0 V typical) with absolute maximum of 0.5 V to +7.0 V, and the 22 nF supply decoupling capacitor C1 should sit as close as possible to the MMIC.
2 GND2 power_in Ground connection that must be tied to the PCB top ground plane, placed as close as possible to the MMIC with multiple via holes if vias are used.
3 RF_OUT output RF output, internally matched to 50 Ω, fed through the output DC blocking capacitor C3 which should not exceed 100 pF for operation above 100 MHz.
4 GND1 power_in Ground connection that must be tied to the PCB top ground plane, placed as close as possible to the MMIC with multiple via holes if vias are used.
5 GND2 power_in Ground connection that must be tied to the PCB top ground plane, placed as close as possible to the MMIC with multiple via holes if vias are used.
6 RF_IN input RF input, internally matched to 50 Ω, AC coupled through the input DC blocking capacitor C2 which should not exceed 100 pF above 100 MHz, with maximum drive power of +10 dBm.

Key specifications

Parameter Value
Manufacturer NXP USA INC.
Package SOT-363-6
Category RF And Wireless
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage (RF input AC coupled) VCC -0.5 7 V RF input AC coupled 2
supply current ICC 36 mA 2
total power dissipation Ptot 200 mW Tsp = 90 C 2
storage temperature Tstg -40 125 C 2
junction temperature Tj 125 C 2
drive power Pdrive 10 dBm 2
supply voltage VCC 4.5 5 5.5 V 2
supply current ICC 14.7 17.4 20.1 mA 2
power gain Gp 22.6 23.2 23.8 dB f = 250 MHz 3
power gain Gp 23.2 23.9 24.6 dB f = 950 MHz 3
power gain Gp 22.8 24.3 25.8 dB f = 2150 MHz 3
input return loss RLin 18 20 22 dB f = 250 MHz 3
input return loss RLin 24 26 28 dB f = 950 MHz 3
input return loss RLin 11 18 24 dB f = 2150 MHz 3
output return loss RLout 21 26 30 dB f = 250 MHz 3
output return loss RLout 12 13 14 dB f = 950 MHz 3
output return loss RLout 10 11 14 dB f = 2150 MHz 3
isolation ISL 40 60 81 dB f = 250 MHz 3
isolation ISL 41 43 44 dB f = 950 MHz 3
isolation ISL 32 35 37 dB f = 2150 MHz 3
noise figure NF 3.4 3.9 4.4 dB f = 250 MHz 3
noise figure NF 3.4 3.8 4.2 dB f = 950 MHz 3
noise figure NF 3.5 3.9 4.3 dB f = 2150 MHz 3
3 dB bandwidth B3dB 3.1 3.3 3.4 GHz 3 dB below gain at 1 GHz 3
Rollett stability factor K 33 35 37 f = 250 MHz 3
Rollett stability factor K 3.8 4.1 4.4 f = 950 MHz 3
Rollett stability factor K 1.3 1.6 1.9 f = 2150 MHz 3
saturated output power PL(sat) 5 6 7 dBm f = 250 MHz 3
saturated output power PL(sat) 5 7 8 dBm f = 950 MHz 3
saturated output power PL(sat) 2 4 5 dBm f = 2150 MHz 3
output power at 1 dB gain compression PL(1dB) 3 4 5 dBm f = 250 MHz 3
output power at 1 dB gain compression PL(1dB) 1 3 4 dBm f = 2150 MHz 3
input third-order intercept point IP3I 6 4 2 dBm Pdrive = 36 dBm (for each tone); f1 = 250 MHz; f2 = 251 MHz 3
input third-order intercept point IP3I 9 7 4 dBm Pdrive = 36 dBm (for each tone); f1 = 950 MHz; f2 = 951 MHz 3
input third-order intercept point IP3I 16 12 9 dBm Pdrive = 36 dBm (for each tone); f1 = 2150 MHz; f2 = 2151 MHz 3
output third-order intercept point IP3O 17 19 21 dBm Pdrive = 36 dBm (for each tone); f1 = 250 MHz; f2 = 251 MHz 3
output third-order intercept point IP3O 15 17 20 dBm Pdrive = 36 dBm (for each tone); f1 = 950 MHz; f2 = 951 MHz 3
output third-order intercept point IP3O 9 12 15 dBm Pdrive = 36 dBm (for each tone); f1 = 2150 MHz; f2 = 2151 MHz 3
second harmonic output power PL(2H) 53 51 49 dBm Pdrive = 33 dBm; f1H = 250 MHz; f2H = 500 MHz 3
second harmonic output power PL(2H) 43 41 40 dBm Pdrive = 33 dBm; f1H = 950 MHz; f2H = 1900 MHz 3
second-order intermodulation distance IM2 36 47 58 dBc Pdrive = 36 dBm (for each tone); f1 = 250 MHz; f2 = 251 MHz 3
second-order intermodulation distance IM2 32 43 55 dBc Pdrive = 36 dBm (for each tone); f1 = 950 MHz; f2 = 951 MHz 3
thermal resistance from junction to solder point Rth(j-sp) 300 K/W Ptot = 200 mW; Tsp = 90 C 2

CAD (KiCad official)

  • Symbol: BGA2866
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363-6 (KiCad packages3D, STEP)
  • 3D model files: bga2866-etched.step / bga2866-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bga2866.step / bga2866.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP USA INC. datasheet (18 pp, sha256 e0b1251e7f974ad9, retrieved 2026-11-07, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF