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BFQ19SH6327

Infineon Technologies · Bipolar (BJT) · SOT-89-3

BFQ19SH6327 from Infineon Technologies, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base lead; the datasheet gives a base current limit of IB 12 mA (maximum ratings at TA = 25 °C).
2 C passive Collector lead; the datasheet gives a collector current limit of IC 120 mA and a collector-emitter voltage limit of VCEO 15 V, and TS (for Ptot 1 W at TS ≤ 85 °C) is measured on this lead at the PCB soldering point.
3 E passive Emitter lead; the datasheet gives an emitter-base voltage limit of VEBO 3 V.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-89-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC current gain hFE 70 100 140 - IC = 70 mA, VCE = 8 V, pulse measured 2
Collector-emitter breakdown voltage V(BR)CEO 15 V IC = 1 mA, IB = 0 2
Collector-emitter cutoff current ICES 10 µA VCE = 20 V, VBE = 0 2
Collector-base cutoff current ICBO 100 nA VCB = 10 V, IE = 0 2
Emitter-base cutoff current IEBO 100 µA VEB = 2 V, IC = 0 2
Transition frequency fT 4 5.5 GHz IC = 70 mA, VCE = 8 V, f = 500 MHz 3
Collector-base capacitance Ccb 1.05 1.35 pF VCB = 10 V, f = 1 MHz, VBE = 0, emitter grounded 3
Collector-emitter voltage VCEO 15 V 1
Collector-emitter voltage VCES 20 V 1
Collector-base voltage VCBO 20 V 1
Emitter-base voltage VEBO 3 V 1
Collector current IC 120 mA 1
Base current IB 12 mA 1
Total power dissipation Ptot 1 W TS ≤ 85 °C 1
Junction temperature TJ 150 °C 1
Ambient temperature TA -65 150 °C 1
Storage temperature TStg -65 150 °C 1
Junction - soldering point thermal resistance RthJS 65 K/W TS measured on collector lead at soldering point to PCB 1

CAD (KiCad official)

  • Symbol: BFQ19SH6327
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: bfq19sh6327-etched.step / bfq19sh6327-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bfq19sh6327.step / bfq19sh6327.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (7 pp, sha256 b1489e0c19917741, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF