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BDR6622T

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by adom

Bardeen Micro Stepper Motor Driver, HTSSOP-16-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BDR6622T

Bardeen Micro · Stepper Motor Driver · HTSSOP-16-EP

BDR6622T from Bardeen Micro, in a HTSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 nSLEEP input Sleep mode input: logic high enables the device and logic low enters low-power sleep and resets all internal logic; it has a 200 kΩ internal pull-down to GND.
2 AOUT1 output Connect to motor winding A (H-bridge A output 1).
3 ASEN bidirectional Channel A current sense: connect to the current sense resistor for Channel A; tie directly to GND if current control is not needed.
4 AOUT2 output Connect to motor winding A (H-bridge A output 2).
5 BOUT2 output Connect to motor winding B (H-bridge B output 2).
6 BSEN bidirectional Channel B current sense: connect to the current sense resistor for Channel B; tie directly to GND if current control is not needed.
7 BOUT1 output Connect to motor winding B (H-bridge B output 1).
8 FAULT output Fault output (open-drain): driven logic low during an over-temperature fault condition.
9 BIN1 input Bridge B input 1 controlling BOUT1; has a 200 kΩ internal pull-down to GND.
10 BIN2 input Bridge B input 2 controlling BOUT2; has a 200 kΩ internal pull-down to GND.
11 BST bidirectional Charge pump output: connect a 10 nF to 100 nF ceramic capacitor between BST and VIN.
12 VIN power_in Motor/power device supply, 2.7 V to 15 V; a 10 µF ceramic bypass capacitor to GND is recommended.
13 GND power_in Device ground; both this pin and the exposed power pad must be connected to ground.
14 VDD power_out Internal control and logic supply: connect a 2.2 µF capacitor from VDD to GND; for internal use only, no external load may be connected.
15 AIN2 input Bridge A input 2 controlling AOUT2; has a 200 kΩ internal pull-down to GND.
16 AIN1 input Bridge A input 1 controlling AOUT1; has a 200 kΩ internal pull-down to GND.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Bardeen Micro
Package HTSSOP-16-EP
Category Motor Driver ICs
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Voltage VIN -0.3 18 V 10
AOUTx Voltage VAOUTx -0.3 V 10
BOUTx Voltage VBOUTx -0.3 V 10
BST Voltage VBST -0.3 V 10
Sense Voltage VSENx -0.3 0.5 V 10
All Other Pins -0.3 6.5 V 10
Junction Temperature TJ 150 ℃ 10
Lead Temperature TL 260 ℃ 10
Operating Temperature TOPR -40 85 ℃ 10
Storage Temperature TSTG -40 150 ℃ 10
Supply Voltage VIN 2.7 15 V 10
Operating Junction Temperature TJ -40 50 125 ℃ 10
Output Current IA/BOUT 700 mA 10
Input Supply Voltage VIN 2.7 15 V 11
Quiescent Current IIN 1.1 mA nSLEEP=1, IOUT=0, Output disable 11
Sleep Quiescent Current IIN_SLEEP 1 μA nSLEEP=0, VIN=5V 11
Body-Diode Forward Voltage VF 1 V IOUT=500mA 11
UVLO Threshold (Rising) VIN_RISE 2.7 V 11
Input Logic 'Low' Threshold VIL 0.6 V 11
Input Logic 'High' Threshold VIH 2 V 11
nSLEEP Logic, Low VSLEEP_L 0.4 V 11
nSLEEP Logic, High VSLEEP_H 2 V 11
Fault Output Logic, Low VFAULT_L 200 mV Flag triggered by OTP, 1mA Current 11
Fault Output Leakage Current ILEAK_FAULT 1 μA VFAULT=5V 11
Cross Over Delay TCROSS 200 300 650 ns HS off to LS on or LS off to HS on for one bridge arm 11
Sleep Mode Wakeup Time TWAKE 1 1.5 ms Sleep inactive high to full bridge turn on (VBST=100nF) 11
Blanking Time TBLANK 2.1 2.7 3.3 μs 12
Thermal Resistance Junction-to-Ambient (HTSSOP16, 5.0x6.4mm) θJA 45 ℃/W Measured on JESD51-7, 4-layer PCB 10
Thermal Resistance Junction-to-Case (HTSSOP16, 5.0x6.4mm) θJC 10 ℃/W Measured on JESD51-7, 4-layer PCB 10

CAD (KiCad official)

  • Symbol: BDR6622T
  • Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-16-EP (KiCad packages3D, STEP)
  • 3D model files: bdr6622t-etched.step / bdr6622t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bdr6622t.step / bdr6622t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Bardeen Micro datasheet (16 pp, sha256 fae3d0468d787005, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF