component
BD9G500EFJ-LAE2
Public Made by Adomby adom
ROHM Semicon DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| README.md | 12d ago |
BD9G500EFJ-LAE2
ROHM Semicon · DC-DC Converters · SOIC-8
BD9G500EFJ-LAE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | output | Switch pin connected to the source of the High-Side MOSFET; a Schottky barrier diode must be connected between this pin and the GND pin. |
| 2 | GND | power_in | Ground pin for the IC; the external catch diode connects between SW and this pin. |
| 3 | COMP | passive | Output of the gm error amplifier and input to the PWM comparator; phase compensation components connect to this pin. |
| 4 | FB | input | Output voltage feedback pin with an FB threshold voltage of 1.00 V (Typ, 0.99 V to 1.01 V). |
| 5 | RT | passive | Sets the internal oscillator frequency through a single resistor to GND, with a switching frequency range of 100 kHz to 650 kHz. |
| 6 | EN | input | Enable input: 0.4 V or lower forces shutdown mode and 2.5 V or higher enables the device; this pin must be terminated. |
| 7 | BOOT | passive | Bootstrap pin; a 1 µF bootstrap capacitor connects between this pin and SW and sets the High-Side MOSFET gate drive voltage. |
| 8 | VIN | power_in | Power supply pin for the switching regulator and control circuit, with an input voltage range of 7 V to 76 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOIC-8 |
| Category | Power Supply Chip |
| Pins | 8 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | ·Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC. ·If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist | 30 |
CAD (KiCad official)
- Symbol:
BD9G500EFJ-LAE2 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
bd9g500efj-lae2-etched.step/bd9g500efj-lae2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd9g500efj-lae2.step/bd9g500efj-lae2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (39 pp, sha256
60764fae453b65e1, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).