component
BD9G401EFJ-ME2
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ROHM DC-DC Converters, HTSOP-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+48@@ -0,0 +1,48 @@+# BD9G401EFJ-ME2++**ROHM** · DC-DC Converters · HTSOP-8-EP++BD9G401EFJ-ME2 from ROHM, in a HTSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | LX | output | Switching node. Drain of the internal high-side N-channel power MOSFET (RonH = 140 mΩ typ); connect the external inductor and catch diode here. Absolute max LX-GND = 45 V. |+| 2 | GND | power_in | Device ground return for the power stage and control logic. Also serves as the reference for all pin voltage limits. |+| 3 | VC | output | Error amplifier output / compensation node. Connect an external RC network to GND to set the loop compensation. Absolute max VC-GND = 7 V. |+| 4 | FB | input | Feedback input to the error amplifier. Internal reference is 0.8 V (typ); connect a resistor divider from VOUT to set the output voltage. Absolute max FB-GND = 7 V. |+| 5 | SYNC | input | External clock synchronization input, 250 kHz to 500 kHz. VIH ≥ 2.0 V, VIL ≤ 0.8 V; internally pulled down. Tie to GND when the synchronization function is not used. Absolute max SYNC-GND = 7 V. |+| 6 | EN | input | Enable / on-off input. VEN < 0.3 V = IC off; 0.3-1.4 V turns internal REG on; > 1.8 V (typ) enables the IC with 10 µA (typ) source current hysteresis. May be driven from a resistor divider off VCC for arbitrary UVLO. Absolute max EN-GND = 45 V. |+| 7 | BST | passive | Bootstrap capacitor terminal for the high-side FET gate drive. Connect a 0.1 µF capacitor from BST to LX. Absolute max BST-GND = 50 V, BST-LX = 7 V. |+| 8 | VCC | power_in | Input supply pin, 4.5 V to 42 V operating (4.65 V required for start-up). Bypass with a 10 µF / 50 V ceramic close to the pin. Absolute max VCC-GND = 45 V. |+| 9 | THERMAL_PAD | passive | Exposed thermal pad on the package underside. Must always be connected to GND and to a copper heat-spreading area/thermal vias for heat dissipation. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | ROHM |+| Package | HTSOP-8-EP |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++- `BD9G401EFJ-ME2`++## CAD (KiCad official)++- Symbol: `BD9G401EFJ-ME2`+- Footprint: `Package_SO:HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm`+- 3D model: HTSOP-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [ROHM datasheet](docs/bd9g401efj-me2-datasheet.pdf) (31 pp, sha256 `2dfe5ab3693fd35c`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/bd9g401efj-me2-datasheet.pdf)
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