component

BD9A600MUV-E2

Public Made by Adom

by adom

ROHM Semicon DC-DC Converters, VQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower supply chipbd9a600muv-e2factory-2.0.0extractor-text

Verified BD9A600MUV-E2

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 17 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BD9A600MUV-E2 · VQFN-16-EP(3x3) · 17 pins
  • ✓copper: 17 copper pads, none touching another net
  • ✓datasheet: all 17 pin names found in the 35-page datasheet
  • ✓distributor: lcsc C509834, digikey BD9A600MUV-E2TR-ND, mouser 755-BD9A600MUV-E2
  • ✓family: QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-4ebnkcrm/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 17 pins = 17 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 17 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ bd9a600muv-e2.kicad_sym✓ bd9a600muv-e2.kicad_mod✓ bd9a600muv-e2.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 8d ago
viewers bd9a600muv-e2: viewers · Ray 8d ago
bd9a600muv-e2-etched.glb Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2-etched.step bd9a600muv-e2: factory component page (tier=mfr) · Ray 8d ago
bd9a600muv-e2-hero.glb bd9a600muv-e2: hero GLB from the etched model (keeps the MPN mark) · Ray 8d ago
bd9a600muv-e2-hero.overlay.json Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2.glb Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2.kicad_mod Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2.kicad_sym Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2.lbr Publish 0.1.0 · Ray 8d ago
bd9a600muv-e2.step Publish 0.1.0 · Ray 8d ago
package.json Publish 0.1.0 · Ray 8d ago
page.json Set visibility: public · Ray 8d ago
README.md Publish 0.1.0 · Ray 8d ago
verification.json Verified: Published by the parts factory: tier mfr, 17 pins · Ray 8d ago

BD9A600MUV-E2

ROHM Semicon · DC-DC Converters · VQFN-16-EP(3x3)

BD9A600MUV-E2 from ROHM Semicon, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PVIN power_in Power supply terminal for the switching regulator output stage; a 10µF ceramic capacitor is recommended.
2 PVIN power_in Power supply terminal for the switching regulator output stage; a 10µF ceramic capacitor is recommended.
3 PGND power_in Ground terminal for the output stage of the switching regulator.
4 PGND power_in Ground terminal for the output stage of the switching regulator.
5 AGND power_in Ground terminal for the control circuit.
6 FB input Inverting input of the gm error amplifier; output voltage is set by a resistor divider (reference 0.8V typ).
7 ITH passive Gm error amplifier output and output switch current comparator input; connect a phase compensation resistor and capacitor here.
8 MODE input Low (0.2V or lower) forces fixed frequency PWM mode; High (0.8V or higher) enables SLLM control with automatic switching between SLLM and PWM.
9 SS passive Soft start time setting terminal; output voltage rise time is set by a capacitor connected to this pin.
10 SW power_out Switch node connected to the high-side MOSFET source and low-side MOSFET drain; connect the inductor and a 0.47µF bootstrap capacitor to BOOT.
11 SW power_out Switch node connected to the high-side MOSFET source and low-side MOSFET drain; connect the inductor and a 0.47µF bootstrap capacitor to BOOT.
12 SW power_out Switch node connected to the high-side MOSFET source and low-side MOSFET drain; connect the inductor and a 0.47µF bootstrap capacitor to BOOT.
13 BOOT passive Connect a 0.47µF bootstrap capacitor between this pin and SW; its voltage is the high-side MOSFET gate drive voltage.
14 PGD output Open-drain Power Good output requiring a pull-up resistor; output goes High when FB is within ±7% of 0.8V (typ).
15 EN input Low (0.8V or lower) forces shutdown, High (2.0V or higher) enables the device; this pin must be terminated.
16 AVIN power_in Power supply for the control circuit; a 0.1µF ceramic capacitor is recommended.
17 E-PAD passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package VQFN-16-EP(3x3)
Category Power Supply Chip
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VPVIN, VAVIN -0.3 7 V Ta = 25°C 5
EN Voltage VEN -0.3 7 V Ta = 25°C 5
MODE Voltage VMODE -0.3 7 V Ta = 25°C 5
PGD Voltage VPGD -0.3 7 V Ta = 25°C 5
Voltage from GND to BOOT VBOOT -0.3 14 V Ta = 25°C 5
Voltage from SW to BOOT ΔVBOOT -0.3 7 V Ta = 25°C 5
FB Voltage VFB -0.3 7 V Ta = 25°C 5
ITH Voltage VITH -0.3 7 V Ta = 25°C 5
SW Voltage VSW -0.3 V max is VPVIN + 0.3 V 5
Allowable Power Dissipation Pd 2.66 W 70mm x 70mm x 1.6mm 4-layer board, derate 21.3mW above 25°C 5
Operating Temperature Range Topr -40 85 °C 5
Storage Temperature Range Tstg -55 150 °C 5
Supply Voltage VPVIN, VAVIN 2.7 5.5 V Ta = -40°C to +85°C 5
Output Current IOUT 6 A Pd, ASO should not be exceeded 5
Output Voltage Range VRANGE 0.8 V max is VPVIN × 0.7 V 5
Standby Supply Current ISTB 0 10 µA EN= GND 6
Operating Supply Current ICC 400 600 µA IOUT= 0mA, Non-switching 6
UVLO Detection Voltage VUVLO1 2.35 2.45 2.55 V VIN Falling 6
UVLO Release Voltage VUVLO2 2.425 2.55 2.7 V VIN Rising 6
EN Input High Level Voltage VENH 2 V max is VAVIN 6
EN Input Low Level Voltage VENL 0.8 V min is AGND 6
EN Input Current IEN 5 10 µA EN= 5V 6
MODE Input High Level Voltage VMODEH 0.2 0.4 0.8 V 6
MODE Input Current IMODE 10 20 µA MODE= 5V 6
FB Terminal Voltage VFB 0.792 0.8 0.808 V 6
FB Input Current IFB 0 1 µA FB= 0.8V 6
ITH Sink Current ITHSI 10 20 40 µA FB= 0.9V 6
ITH Source Current ITHSO 10 20 40 µA FB= 0.7V 6
Soft Start Time TSS 0.5 1 2 ms With internal constant 6
Soft Start Current ISS 0.9 1.8 3.6 µA 6
Switching Frequency FOSC 800 1000 1200 kHz 6
Power Good Falling (Fault) Voltage VPGDFF 87 90 93 % OUTPUT voltage falling 6
Power Good Rising (Good) Voltage VPGDRG 90 93 96 % OUTPUT voltage rising 6
Power Good Rising (Fault) Voltage VPGDRF 107 110 113 % OUTPUT voltage rising 6
Power Good Falling (Good) Voltage VPGDFG 104 107 110 % OUTPUT voltage falling 6
PGD Output Leakage Current ILKPGD 0 5 µA PGD= 5V 6
Power Good ON Resistance RPGD 50 100 Ω 6
Power Good Low Level Voltage PGDVL 0.05 0.1 V IPGD= 1mA 6
High Side FET ON Resistance RONH 25 50 mΩ BOOT, SW= 5V 6
Low Side FET ON Resistance RONL 25 50 mΩ 6
High Side Output Leakage Current RILH 0 10 µA Non-switching 6
Low Side Output Leakage Current RILL 0 10 µA Non-switching 6
Short Circuit Protection Detection Voltage VSCP 0.28 0.4 0.52 V 6
Thermal Resistance, 4-layer board (5505mm2 copper) θJA 47 °C/W 4-layer board, surface copper foil 5505mm2 26
Thermal Resistance, 4-layer board (6.28mm2 copper) θJA 70.62 °C/W 4-layer board, surface copper foil 6.28mm2 26
Thermal Resistance, 1-layer board θJA 201.6 °C/W 1-layer board, surface copper foil 6.28mm2 26
Thermal Resistance, IC only θJA 462.9 °C/W IC only 26

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper  Connect an input capacitor as close as possible to the IC PVIN terminal on the same plane as the IC.  If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist 25

CAD (KiCad official)

  • Symbol: BD9A600MUV-E2
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: bd9a600muv-e2-etched.step / bd9a600muv-e2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bd9a600muv-e2.step / bd9a600muv-e2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (35 pp, sha256 70799585b93019b8, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF