# BD81870EFV-ME2

**ROHM Semicon** · DC-DC Converters · HTSSOP-20-EP

BD81870EFV-ME2 from ROHM Semicon, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDDA | power_in | Analog power supply pin of the controller, to be supplied from the input supply VDD. |
| 2 | STB2 | input | ON/OFF control pin for the step-up DC/DC converter channel 2. |
| 3 | STB1 | input | ON/OFF control pin for the inverted DC/DC converter channel 1. |
| 4 | SEQON | input | Sequence ON/OFF pin; when L the two DC/DC channels are controlled independently, when H the internal sequence controls them. |
| 5 | HSWON | input | ON/OFF control pin for the built-in high-side switch. |
| 6 | N.C. | unconnected | No internal connection. |
| 7 | VREF | power_in | Reference voltage output of the inverted DC/DC converter. |
| 8 | NON1 | input | Feedback pin of the inverted DC/DC converter channel 1. |
| 9 | DIS1 | passive | Discharge pin of the inverted DC/DC converter channel 1. |
| 10 | LX1 | passive | Switching pin of the inverted DC/DC converter channel 1. |
| 11 | VDDP | power_in | Power supply pin for the power stage. |
| 12 | VDDP | power_in | Power supply pin for the power stage. |
| 13 | VDDP | power_in | Power supply pin for the power stage. |
| 14 | HS2L | output | High-side switch output pin. |
| 15 | LX2 | passive | Switching pin of the step-up DC/DC converter channel 2. |
| 16 | GNDP | power_in | Ground pin of the step-up DC/DC converter. |
| 17 | VOUT2 | input | Output voltage sense pin of the step-up DC/DC converter. |
| 18 | DIS2 | passive | Discharge pin of the step-up DC/DC converter. |
| 19 | GNDA | power_in | Analog ground pin. |
| 20 | INV2 | input | Feedback pin of the step-up DC/DC converter. |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | HTSSOP-20-EP |
| Category | Power Management ICs |
| Pins | 21 |

## CAD (KiCad official)

- Symbol: `BD81870EFV-ME2`
- Footprint: `Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm`
- 3D model: HTSSOP-20-EP (KiCad packages3D, STEP)
- 3D model files: `bd81870efv-me2-etched.step` / `bd81870efv-me2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bd81870efv-me2.step` / `bd81870efv-me2.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](docs/bd81870efv-me2-datasheet.pdf) (35 pp, sha256 `40d553648ed38e2b`, retrieved 2026-11-02, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bd81870efv-me2-datasheet.pdf)