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BD7F100EFJ-LBE2

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ROHM Semicon DC-DC Converters, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icsbd7f100efj-lbe2factory-2.0.0extractor-text

Verified BD7F100EFJ-LBE2

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 9 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: BD7F100EFJ-LBE2 · SOP-8-EP · 9 pins
  • ✓copper: 9 copper pads, none touching another net
  • ✓datasheet: all 9 pin names found in the 31-page datasheet
  • ✓distributor: lcsc C2071483, digikey BD7F100EFJ-LBE2TR-ND, mouser 755-BD7F100EFJ-LBE2
  • ✓family: SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-cui7hjj2/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 9 pins = 9 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 9 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ bd7f100efj-lbe2.kicad_sym✓ bd7f100efj-lbe2.kicad_mod✓ bd7f100efj-lbe2.step
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Contents

README

markdown

BD7F100EFJ-LBE2

ROHM Semicon · DC-DC Converters · SOP-8-EP

BD7F100EFJ-LBE2 from ROHM Semicon, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AGND power_in Analog system GND.
2 SDX/EN input Shutdown/Enable control; the internal regulator is in shutdown below 0.9V (Typ) and enabled above 2.0V (Typ).
3 COMP passive Load current compensation of the output voltage set up.
4 REF input Output voltage setup; the voltage here, which is the feedback voltage of the SW terminal voltage, is compared with VREF by the comparator.
5 FB input Output voltage setup.
6 PGND power_in Power system GND.
7 SW output Switching output of the built-in N-channel MOSFET, rated 50V (Max) operating voltage and Hi-Z during VIN UVLO.
8 VIN power_in Power supply input, operating range 3V to 40V, UVLO falling at 2.5V (Typ) and recovering at 2.65V (Typ).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOP-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Quiescent Current IST 0 10 µA VSDX/EN = 0V 5
Operating Current ICC 2 4 mA VSDX/EN = 2.5V, VREF = 2V (at PFM operation) 5
UVLO Detection Voltage VUVLO 2.3 2.5 2.7 V VIN falling 5
UVLO Hysteresis Voltage VUVLO_HYS 0.1 0.15 0.2 V 5
Shutdown Voltage VSDX 0.3 0.9 1.5 V 5
Enable Voltage VEN 1.9 2 2.1 V VSDX/EN rising 5
Enable Hysteresis Voltage VEN_HYS 0.15 0.2 0.25 V 5
SDX/EN Input Current ISDX/EN 0 1 µA VSDX/EN=2V 5
Reference Voltage VREF 0.768 0.78 0.792 V 5
Over Current Limit ILIMIT 1 1.25 1.5 A 5
ON-Resistance RON 0.5 Ω Between SW - PGND terminals 5
Switching Frequency fSW 400 kHz At PWM operation (Duty=40%) 5
Minimum ON Time tON_MIN 350 ns 5
Minimum OFF Time tOFF_MIN 300 ns 5
Maximum OFF Time tOFF_MAX 20 µs 5
Soft Start Time tSS 6 ms 0V to (VREF×90%) 5
VIN Input Power Voltage VIN 45 V Ta = 25 °C 4
SW Terminal Voltage VSW 60 V Ta = 25 °C 4
REF Terminal Voltage VREF 7 V Ta = 25 °C 4
COMP Terminal Voltage VCOMP 7 V Ta = 25 °C 4
Power Dissipation Pd 3.75 W Ta = 25 °C; four-layer glass-epoxy board 70mm × 70mm × 1.6mm, reduced by 30.0mW/°C above 25°C 4
Storage Temperature Range Tstg -55 150 °C 4
Maximum Junction Temperature Tjmax 150 °C 4
VIN Input Power Voltage VIN 3 24 40 V 4
SW Terminal Voltage VSW 50 V 4
Junction Temperature Tj -40 125 °C Life time is derated at junction temperature greater than 125°C 4

CAD (KiCad official)

  • Symbol: BD7F100EFJ-LBE2
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: bd7f100efj-lbe2-etched.step / bd7f100efj-lbe2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bd7f100efj-lbe2.step / bd7f100efj-lbe2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (31 pp, sha256 b6320dae678ea33a, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF