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BD7682FJ-LBE2

Public Made by Adom

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ROHM Semicon AC-DC Controllers & Regulators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BD7682FJ-LBE2

ROHM Semicon · AC-DC Controllers & Regulators · SOIC-8

BD7682FJ-LBE2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ZT input Zero current detect pin with a ZT pin maximum current of 3.0 mA and ZT overvoltage detection at VZTL typ 3.5V latched after tLATCH typ 150us.
2 FB input Feedback signal input pin with an absolute maximum applied voltage of -0.3 to +6.5V, where overload protection is triggered when FB stays above VFOLP1 typ 2.8V and the timer times out.
3 CS input Current sense pin with an absolute maximum applied voltage of -0.3 to +6.5V.
4 GND power_in Ground reference pin for the IC.
5 OUT output MOSFET gate drive pin with an absolute maximum applied voltage of -0.3 to +25.0V.
6 MASK output Open-drain output that drives an external transistor to hold VCC constant, with an absolute maximum applied voltage of -0.3 to +32.0V and left open when unused.
7 VCC power_in Power supply pin with a recommended operating range of 15.0 to 27.5V and an absolute maximum applied voltage of -0.3 to +32.0V.
8 BO bidirectional Brown-out monitor pin with a B.O. detection voltage of 1.000V typ and an absolute maximum applied voltage of -0.3 to +6.5V.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package SOIC-8
Category Power Management
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Applied Voltage 1 Vmax1 -0.3 32 V OUT, VCC, MASK 3
Maximum Applied Voltage 2 Vmax2 -0.3 6.5 V ZT, CS, FB, BO 3
Maximum Applied Voltage 3 Vmax3 -0.3 25 V OUT 3
ZT Pin Maximum Current1 ISZT1 -3 mA 3
ZT Pin Maximum Current2 ISZT2 3 mA 3
Power Dissipation Pd 0.67 W SOP-J8 mounted on 70 mm x 70 mm, 1.6 mm glass epoxy single-layer substrate; de-rated 5.4mW/°C above Ta=25°C 3
Operating Temperature Range Topr -40 105 °C 3
MAX Junction Temperature Tjmax 150 °C 3
Storage Temperature Range Tstr -55 150 °C 3
Power Supply Voltage Range VCC 15 27.5 V VCC pin voltage 3
Circuit Current (OFF) IOFF 10 19 30 µA VCC=18.0V (VCC UVLO=Disable) 3
Circuit Current (ON) 1 ION1 300 800 1500 µA FB=1.0V (at pulse operation) 3
Circuit Current (ON) 2 ION2 150 500 1000 µA FB=0.0V (at burst operation) 3
Circuit Current (Protect circuit is on) Iprotect 800 1600 2200 µA FBOLP,VCCOVP,ZTOVP 3
B.O. Detection Voltage VBO 0.92 1 1.08 V 3
B.O. Detection Hysteresis Current IBO 10 15 20 µA 3
VCC UVLO Voltage 1 VUVLO1 19 19.5 20 V VCC rise 3
VCC UVLO Voltage 2 VUVLO2 13 14 15 V VCC fall 3
VCC OVP Voltage 1 VOVP1 27.5 29.5 31.5 V VCC rise 3
VCC OVP Voltage 2 VOVP2 21 23 25 V VCC fall 3
Latch Mask Time tLATCH 50 150 250 µs 3
FB Pin pull-up Resistance RFB 15 20 25 kΩ 4
CS Over-Current Sensor Voltage 1A VLIM1A 0.95 1 1.05 V FB=2.2V (IZT>-1mA) 4
CS Over-Current Sensor Voltage 1B VLIM1B 0.62 0.7 0.78 V FB=2.2V (IZT<-1mA) 4
CS Over-Current Sensor Voltage 2A VLIM2A 0.2 0.3 0.4 V FB=0.6V (IZT>-1mA) 4
CS Over-Current Sensor Voltage 2B VLIM2B 0.14 0.21 0.28 V FB=0.6V (IZT<-1mA) 4
CS Switching ZT Current IZT 0.9 1 1.1 mA 4
Maximum Operating Frequency 1 fSW1 106 120 134 kHz FB=2.0V 4
Maximum Operating Frequency 2 fSW2 20 30 40 kHz FB=0.5V 4
Frequency Reduction Start FB Voltage VFBSW1 1.1 1.25 1.4 V 4
Frequency Reduction End FB Voltage 1 VFBSW2 0.4 0.5 0.6 V 4
Voltage Gain AVCS 1.7 2 2.3 V/V ΔVFB/ΔVCS 4
ZT Comparator Voltage 1 VZT1 60 100 140 mV ZT fall 4
ZT Comparator Voltage 2 VZT2 120 200 280 mV ZT rise 4
ZT Trigger Mask Time tZTMASK 0.25 0.6 0.95 µs For noise prevention after OUT H⇒L 4
ZT Trigger Timeout Period 1 tZTOUT 8 15 24 µs Count from final ZT trigger (1-stage) 4
ZT Trigger Timeout Period 2 tZTOUT2 2 5 8 µs Count from final ZT trigger (2-stage) 4
Maximum ON Time tZTON 27 45 62 µs 4
Soft Start Time 1 tSS1 0.6 1 1.4 ms 4
Soft Start Time 2 tSS2 2.4 4 5.6 ms 4
FB OLP Voltage 1 VFOLP1 2.5 2.8 3.1 V FB rise 4
FB OLP Voltage 2 VFOLP2 2.3 2.6 2.9 V FB fall 4
FB OLP Timer tFOLP 90 128 166 ms 4
ZT OVP Voltage VZTL 3.25 3.5 3.75 V 4
OUT Pin Clamp Voltage VOUT 16 18 20 V 4
OUT pin Nch MOS Ron RNOUT 2 4.5 9 Ω 4
MASK Pin Delay Time tMASK 0.25 0.6 0.95 µs 4
MASK Pin Ron RMASK 20 50 80 Ω 4

CAD (KiCad official)

  • Symbol: BD7682FJ-LBE2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: bd7682fj-lbe2-etched.step / bd7682fj-lbe2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bd7682fj-lbe2.step / bd7682fj-lbe2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (30 pp, sha256 890e4fec2b1d7c71, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF