component
BD63610AEFV-E2
Public Made by Adomby adom
ROHM Semicon Stepper Motor Driver, HTSSOP-20-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBD63610AEFV-E2
ROHM Semicon · Stepper Motor Driver · HTSSOP-20-EP
BD63610AEFV-E2 from ROHM Semicon, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal; the backside metal is shorted to the chip backside and should be connected to GND. |
| 2 | OUT1B | output | H-bridge output terminal for channel 1 (B side). |
| 3 | RNF1 | passive | Connection terminal of the resistor for output current detection on channel 1; the RNF maximum voltage is 0.7 V. |
| 4 | OUT1A | output | H-bridge output terminal for channel 1 (A side). |
| 5 | VCC1 | power_in | Power supply terminal; supply voltage range is 19 to 28 V recommended (absolute maximum -0.2 to +36.0 V). |
| 6 | CR | passive | Connection terminal for the CR network that sets the PWM oscillation. |
| 7 | GND | power_in | Ground terminal. |
| 8 | VREF | power_in | Output current value setting terminal. |
| 9 | PS | input | Power save terminal. |
| 10 | CLK | input | Clock input terminal for advancing the motor step (description is truncated in the source text). |
| 11 | TEST0 | input | Terminal for testing; must be connected to GND. |
| 12 | CW_CCW | input | Motor rotating direction setting terminal. |
| 13 | MODE | input | Motor excitation mode setting terminal. |
| 14 | TEST1 | input | Motor excitation mode setting terminal. |
| 15 | ENABLE | input | Terminal for enabling the output. |
| 16 | GND | power_in | Grounding terminal. |
| 17 | VCC2 | power_in | Power supply terminal for channel 2 (the printed table lists this row as 'Non connection', which conflicts with the pin name and the application circuit). |
| 18 | OUT2A | output | H-bridge output terminal for channel 2 (A side) (the printed table lists this row as 'Power supply terminal', which conflicts with the pin name). |
| 19 | RNF2 | passive | Connection terminal of the resistor for output current detection on channel 2 (the printed table lists this row as 'Non connection', which conflicts with the pin name and the block diagram). |
| 20 | OUT2B | output | H-bridge output terminal for channel 2 (B side). |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | HTSSOP-20-EP |
| Category | Motor Driver ICs |
| Pins | 21 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Circuit current at standby | ICCST | 0.4 | 1.5 | mA | PS=L | 4 | |
| Circuit current | ICC | 1.3 | 4 | mA | PS=H, VREF=3V | 4 | |
| H-level input voltage (CLK) | VIN1H | 2.8 | V | 4 | |||
| L-level input voltage (CLK) | VIN1L | 0.6 | V | 4 | |||
| H-level input current (CLK) | IIN1H | 35 | 50 | 100 | µA | VIN1=5V | 4 |
| L-level input current (CLK) | IIN1L | -10 | 0 | µA | VIN1=0V | 4 | |
| H-level input voltage (CW_CCW, MODE, ENABLE, PS) | VIN2H | 2 | V | 4 | |||
| L-level input voltage (CW_CCW, MODE, ENABLE, PS) | VIN2L | 0.8 | V | 4 | |||
| H-level input current (CW_CCW, MODE, ENABLE, PS) | IIN2H | 35 | 50 | 100 | µA | VIN2=5V | 4 |
| L-level input current (CW_CCW, MODE, ENABLE, PS) | IIN2L | -10 | 0 | µA | VIN2=0V | 4 | |
| Output ON resistance (sum of upper and lower) | RON | 1.8 | 2.4 | Ω | IOUT=±0.5A (Sum of upper and lower) | 4 | |
| Output leak current | ILEAK | 10 | µA | 4 | |||
| RNFx input current | IRNF | -80 | -40 | µA | RNFx=0V | 4 | |
| VREF input current | IVREF | -2 | -0.1 | µA | VREF=0V | 4 | |
| VREF input voltage range | VVREF | 0 | 3 | V | 4 | ||
| MTH input current | IMTH | -2 | -0.1 | µA | MTH=0V | 4 | |
| MTH input voltage range | VMTH | 0 | 3.5 | V | 4 | ||
| Minimum ON time (blank time) | tONMIN | 0.3 | 0.9 | 1.5 | µs | C=1000pF, R=39kΩ | 4 |
| Comparator threshold | VCTH | 0.57 | 0.6 | 0.63 | V | VREF=3V | 4 |
| Supply voltage | VCC1,2 | 19 | 28 | V | Ta=-25 to +85 ℃ | 3 | |
| Maximum output current (DC) | IOUT | 0.6 | A/Phase | Not exceeding Pd, ASO or Tj=150℃ | 3 | ||
| Supply voltage | VCC1,2 | -0.2 | 36 | V | 3 | ||
| Power dissipation (board 70x70x1.6 mm glass epoxy) | Pd | 1 | W | 70mm×70mm×1.6mm glass epoxy board; derate 8.8 mW/℃ above Ta=25℃ | 3 | ||
| Power dissipation (4-layer recommended board) | Pd | 3.2 | W | 4-layer recommended board; derate 32.0 mW/℃ above Ta=25℃ | 3 | ||
| Input voltage for control pin | VIN | -0.2 | 5.5 | V | 3 | ||
| RNF maximum voltage | VRNF | 0.7 | V | 3 | |||
| Maximum output current (DC) | IOUT | 0.8 | A/Phase | Do not exceed Pd, ASO and Tjmax=150℃ | 3 | ||
| Maximum output current (peak) | IOUT | 1 | A/Phase | pulse width tw≦1ms, duty 20% | 3 | ||
| Operating temperature range | Topr | -25 | 85 | ℃ | 3 | ||
| Storage temperature range | Tstg | -55 | 150 | ℃ | 3 | ||
| Junction temperature | Tj | 150 | ℃ | Must not be exceeded (Tjmax) | 3 | ||
| Thermal resistance junction-to-ambient, board 1 | θj-a | 125 | ℃/W | 1-layer board, copper foil on back 0 mm | 19 | ||
| Thermal resistance junction-to-ambient, board 2 | θj-a | 86.2 | ℃/W | 2-layer board, copper foil on back 15 mm×15 mm | 19 | ||
| Thermal resistance junction-to-ambient, board 3 | θj-a | 54.3 | ℃/W | 2-layer board, copper foil on back 70 mm×70 mm | 19 | ||
| Thermal resistance junction-to-ambient, board 4 | θj-a | 39.1 | ℃/W | 4-layer board, copper foil on back 70 mm×70 mm | 19 |
CAD (KiCad official)
- Symbol:
BD63610AEFV-E2 - Footprint:
Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm - 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
bd63610aefv-e2-etched.step/bd63610aefv-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd63610aefv-e2.step/bd63610aefv-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (25 pp, sha256
18e5d93693b65561, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).