# BD00IC0MEFJ-ME2

**ROHM Semicon** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOP-8-EP

BD00IC0MEFJ-ME2 from ROHM Semicon, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VO | power_out | Regulated output pin; requires a ceramic output capacitor of 1.0μF or more to GND, output current up to 1.0A. |
| 2 | FB | input | Feedback pin (FB/Vo_s) for the variable type, regulated to 0.800V typ. with external divider R1, R2 (R1+R2 = 1k to 90kΩ recommended) to set VO from 0.8V to 4.5V. |
| 3 | GND | power_in | Ground pin. |
| 4 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 5 | EN | input | Enable pin; low 0 to 0.8V shuts down the device, high 2.4V to 5.5V enables it (absolute maximum 7.0V). |
| 6 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 7 | N.C. | unconnected | Non connection pin; can be connected to GND or left open. |
| 8 | VCC | power_in | Input supply pin, recommended operating range 2.4V to 5.5V (absolute maximum 7.0V), with a ceramic input capacitor of 1.0μF or more. |
| 9 | FIN | passive | Reverse-side exposed fin (substrate), to be connected to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Circuit current at shutdown | ISD |  | 0 | 5 | µA | EN=0V, OFF mode, 25℃ | 4 |
| Circuit current at shutdown | ISD |  |  | 5 | µA | EN=0V, OFF mode, -40~105℃ | 4 |
| Bias current | ICC |  | 250 | 500 | µA | 25℃ | 4 |
| Bias current | ICC |  |  | 700 | µA | -40~105℃ | 4 |
| Line regulation | Reg.I |  | 25 | 50 | mV | VCC=(Vo+0.6V)→5.5V, 25℃ | 4 |
| Line regulation | Reg.I |  |  | 50 | mV | VCC=(Vo+0.6V)→5.5V, -40~105℃ | 4 |
| Load regulation | Reg IO |  | 25 | 75 | mV | IO=0→1.0A, 25℃ | 4 |
| Load regulation | Reg IO |  |  | 75 | mV | IO=0→1.0A, -40~105℃ | 4 |
| Minimum dropout voltage | VCO |  | 0.4 | 0.6 | V | VCC=3.3V, IO=1.0A, 25℃ | 4 |
| Minimum dropout voltage | VCO |  |  | 0.9 | V | VCC=3.3V, IO=1.0A, -40~105℃ | 4 |
| Output reference voltage (variable type) | VFB | 0.792 | 0.8 | 0.808 | V | IO=0mA, 25℃ | 4 |
| Output reference voltage (variable type) | VFB | 0.776 |  | 0.824 | V | IO=0mA, -40~105℃ | 4 |
| EN Low voltage | VEN(Low) | 0 |  | 0.8 | V | 25℃ and -40~105℃ | 4 |
| EN High voltage | VEN(High) | 2.4 |  | 5.5 | V | 25℃ and -40~105℃ | 4 |
| EN Bias current | IEN | 1 | 3 | 9 | µA | 25℃ | 4 |
| EN Bias current | IEN |  |  | 9 | µA | -40~105℃ | 4 |
| Power supply voltage | VCC |  |  | 7 | V | Ta=25℃; not to exceed Pd | 4 |
| EN voltage | VEN |  |  | 7 | V | Ta=25℃ | 4 |
| Power dissipation HTSOP-J8 | Pd |  |  | 2110 | mW | Reduced by 16.9mW/℃ above Ta 25℃; 70mm×70mm×1.6mm glass-epoxy two layer board | 4 |
| Operating temperature range | Topr | -40 |  | 105 | ℃ |  | 4 |
| Storage temperature range | Tstg | -55 |  | 150 | ℃ |  | 4 |
| Junction temperature | Tjmax |  |  | 150 | ℃ |  | 4 |
| Input power supply voltage | VCC | 2.4 |  | 5.5 | V | Ta=25℃ | 4 |
| EN voltage | VEN | 0 |  | 5.5 | V | Ta=25℃ | 4 |
| Output voltage setting range | VO | 0.8 |  | 4.5 | V | Ta=25℃ | 4 |
| Output current | IO | 0 |  | 1 | A | Ta=25℃ | 4 |
| Thermal resistance junction-ambient | θj-a |  | 249.5 |  | ℃/W | IC only | 14 |
| Thermal resistance junction-ambient | θj-a |  | 153.2 |  | ℃/W | 1-layer (copper foil 0mm×0mm), 70mm×70mm×1.6mm board | 14 |
| Thermal resistance junction-ambient | θj-a |  | 113.6 |  | ℃/W | 2-layer (copper foil 15mm×15mm), 70mm×70mm×1.6mm board | 14 |
| Thermal resistance junction-ambient | θj-a |  | 59.2 |  | ℃/W | 2-layer (copper foil 70mm×70mm), 70mm×70mm×1.6mm board | 14 |
| Thermal resistance junction-ambient | θj-a |  | 33.3 |  | ℃/W | 4-layer (copper foil 70mm×70mm), 70mm×70mm×1.6mm board | 14 |
| TSD ON temperature |  |  | 175 |  | ℃ | typ. | 18 |
| TSD hysteresis temperature |  |  | 15 |  | ℃ | typ. | 18 |

## CAD (KiCad official)

- Symbol: `BD00IC0MEFJ-ME2`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`
- 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `bd00ic0mefj-me2-etched.step` / `bd00ic0mefj-me2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bd00ic0mefj-me2.step` / `bd00ic0mefj-me2.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](docs/bd00ic0mefj-me2-datasheet.pdf) (24 pp, sha256 `3bb765f22c0d6388`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bd00ic0mefj-me2-datasheet.pdf)