component
BCX56TA
Public Made by Adomby adom
Diodes Incorporated Bipolar (BJT), SOT-89. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBCX56TA
Diodes Incorporated · Bipolar (BJT) · SOT-89
BCX56TA from Diodes Incorporated, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Base of the NPN transistor; drive terminal, with IB max 100mA continuous and 200mA peak, VEBO 6V. |
| 2 | C | passive | Collector, also connected to the exposed tab; BCX56 VCEO 80V, VCBO 100V, IC 1A continuous and 2A peak. |
| 3 | E | passive | Emitter of the NPN transistor; VEBO max 6V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-89 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Voltage | VCBO | 100 | V | BCX56 column | 2 | ||
| Collector-Emitter Voltage | VCEO | 80 | V | BCX56 column | 2 | ||
| Emitter-Base Voltage | VEBO | 6 | V | 2 | |||
| Continuous Collector Current | IC | 1 | A | 2 | |||
| Peak Pulse Collector Current | ICM | 2 | A | 2 | |||
| Continuous Base Current | IB | 100 | mA | 2 | |||
| Peak Pulse Base Current | IBM | 200 | mA | 2 | |||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Electrostatic Discharge - Human Body Model | ESD HBM | 4000 | V | JEDEC class 3A; printed as 4,000 V | 2 | ||
| Electrostatic Discharge - Machine Model | ESD MM | 400 | V | JEDEC class C | 2 | ||
| Power Dissipation | PD | 0.55 | W | Note 5: minimum recommended pad layout, 1oz Cu, single-sided 1.6mm FR4, still air | 2 | ||
| Power Dissipation | PD | 1 | W | Note 6: exposed collector pad on 15mm x 15mm 1oz Cu, still air | 2 | ||
| Power Dissipation | PD | 1.5 | W | Note 7: 25mm x 25mm 1oz Cu, still air | 2 | ||
| Power Dissipation | PD | 2 | W | Note 8: 50mm x 50mm 1oz Cu, still air | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 225 | °C/W | Note 5: minimum recommended pad layout, 1oz Cu | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 125 | °C/W | Note 6: 15mm x 15mm 1oz Cu | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 83 | °C/W | Note 7: 25mm x 25mm 1oz Cu | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 60 | °C/W | Note 8: 50mm x 50mm 1oz Cu | 2 | ||
| Thermal Resistance, Junction to Lead | RθJL | 13 | °C/W | Note 9: junction to solder-point on exposed collector pad | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 39 | °C/W | Notes 5 & 10 | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 27 | °C/W | Note 10: junction to top of case | 2 | ||
| Collector-Base Breakdown Voltage | BVCBO | 100 | V | BCX56; IC = 100µA | 4 | ||
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | BCX56; IC = 10mA (Note 12) | 4 | ||
| Emitter-Base Breakdown Voltage | BVEBO | 6 | V | IE = 100µA | 4 | ||
| Collector Cutoff Current | ICBO | 0.1 | µA | VCB = 30V | 4 | ||
| Collector Cutoff Current | ICBO | 20 | µA | VCB = 30V, TA = +150°C | 4 | ||
| Emitter Cutoff Current | IEBO | 20 | nA | VEB = 5V | 4 | ||
| Static Forward Current Transfer Ratio (All versions) | hFE | 25 | IC = 5mA, VCE = 2V (Note 12) | 4 | |||
| Static Forward Current Transfer Ratio (All versions) | hFE | 40 | IC = 150mA, VCE = 2V (Note 12) | 4 | |||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.5 | V | IC = 500mA, IB = 50mA (Note 12) | 4 | ||
| Base-Emitter Turn-On Voltage | VBE(on) | 1 | V | IC = 500mA, VCE = 2V (Note 12) | 4 | ||
| Transition Frequency | fT | 150 | MHz | IC = 50mA, VCE = 10V, f = 100MHz | 4 | ||
| Output Capacitance | Cobo | 25 | pF | VCB = 10V, f = 1MHz | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Terminals: Matte Tin Finish Leads. Solderable per MIL-STD-202 Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BCX56TA - Footprint:
Package_TO_SOT_SMD:SOT-89-3 - 3D model: SOT-89 (KiCad packages3D, STEP)
- 3D model files:
bcx56ta-etched.step/bcx56ta-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bcx56ta.step/bcx56ta.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
f1fb713b16b386bf, retrieved 2026-10-21, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).