component
BCW66HTA
Public Made by Adomby adom
Diodes Incorporated Bipolar (BJT), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBCW66HTA
Diodes Incorporated · Bipolar (BJT) · SOT-23
BCW66HTA from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Base of the NPN transistor, shown as the lower right pin in the datasheet's top-view pin-out. |
| 2 | E | passive | Emitter of the NPN transistor, shown as the upper right pin in the top-view pin-out; VEBO is rated 7V. |
| 3 | C | passive | Collector of the NPN transistor, the single pin on the opposite side of the package; VCEO is 45V, VCBO is 75V and continuous IC is 800mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Breakdown Voltage | BVCES | 75 | V | IC = 10µA | 3 | ||
| Collector-Emitter Breakdown Voltage (base open) | BVCEO | 45 | V | ICEO = 10mA | 3 | ||
| Emitter-Base Breakdown Voltage | BVEBO | 7 | V | IEBO = 10µA | 3 | ||
| Collector-Emitter Cut-Off Current | ICES | 20 | nA | VCES = 45V | 3 | ||
| Collector-Emitter Cut-Off Current | ICES | 20 | µA | VCES = 45V, TA = +150°C | 3 | ||
| Emitter-Base Cut-Off Current | IEBO | 20 | nA | VEBO = 5.6V | 3 | ||
| Static Forward Current Transfer Ratio | hFE | 80 | IC = 100µA, VCE = 10V | 3 | |||
| Static Forward Current Transfer Ratio | hFE | 180 | IC = 10mA, VCE = 1V | 3 | |||
| Static Forward Current Transfer Ratio | hFE | 250 | IC = 100mA, VCE = 1V | 3 | |||
| Static Forward Current Transfer Ratio | hFE | 100 | IC = 500mA, VCE = 2V | 3 | |||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.3 | mV | IC = 100mA, IB = 10mA | 3 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.7 | mV | IC = 500mA, IB = 50mA | 3 | ||
| Base-Emitter Saturation Voltage | VBE(sat) | 2 | V | IC = 500mA, IB = 50mA | 3 | ||
| Transition Frequency | fT | 100 | MHz | IC = 20mA, VCE = 10V, f = 100MHz | 3 | ||
| Output Capacitance | Cobo | 8 | 12 | pF | VCB = 10V, f = 1MHz | 3 | |
| Input Capacitance | Cibo | 80 | pF | VCB = -0.5V, f = 1MHz | 3 | ||
| Noise Figure | N | 2 | 10 | dB | IC = 0.2mA, VCE = 5V, RG = 1K | 3 | |
| Turn-On Time | ton | 100 | ns | IC = 150mA, IB1 = -IB2 = 15mA | 3 | ||
| Turn-Off Time | toff | 400 | ns | RL = 150 | 3 | ||
| Collector-Base Voltage | VCBO | 75 | V | 2 | |||
| Collector-Emitter Voltage | VCEO | 45 | V | 2 | |||
| Emitter-Base Voltage | VEBO | 7 | V | 2 | |||
| Continuous Collector Current | IC | 800 | mA | 2 | |||
| Peak Pulse Current | ICM | 1000 | mA | 2 | |||
| Base Current | IB | 100 | mA | 2 | |||
| Power Dissipation | PD | 310 | mW | Note 6: minimum recommended pad layout, 1oz copper, single-sided FR4 | 2 | ||
| Power Dissipation | PD | 350 | mW | Note 7: 15mm X 15mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 403 | C/W | Note 6: minimum recommended pad layout, 1oz copper, single-sided FR4 | 2 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 357 | C/W | Note 7: 15mm X 15mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Leads | RθJL | 350 | C/W | Note 8: junction to solder-point (end of leads) | 2 | ||
| Operating and Storage Temperature Range | TJ,TSTG | -55 | 150 | C | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BCW66HTA - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bcw66hta-etched.step/bcw66hta-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bcw66hta.step/bcw66hta.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (5 pp, sha256
56f7fa2de2580595, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).