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Initial commit: component/bcs65s04d3

Ray ·c4d9a9b2aa ·2mo ago
2 files changed +84
README.mdadded+50
@@ -0,0 +1,50 @@+# BCS65S04D3++**Bestirpower** · SiC Diodes · DFN-8(5x6)++BCS65S04D3 from Bestirpower, in a DFN-8(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | A | passive | Anode. Connected internally to the SiC Schottky die anode. Multiple anode pads (pins 1-3) are electrically common and should be tied together on the PCB for current sharing. |+| 2 | A | passive | Anode. Electrically common with pins 1 and 3; tie all anode pads together on the PCB. |+| 3 | A | passive | Anode. Electrically common with pins 1 and 2; tie all anode pads together on the PCB. |+| 4 | NC | unconnected | No internal connection. Leave floating or tie to anode potential. |+| 5 | K | passive | Cathode. Connected to the SiC Schottky die cathode and to the exposed thermal pad on the package underside. Pins 5-8 are electrically common with the thermal pad and must all be tied together for current handling and heat dissipation. |+| 6 | K | passive | Cathode. Electrically common with pins 5, 7, 8, and the exposed thermal pad. |+| 7 | K | passive | Cathode. Electrically common with pins 5, 6, 8, and the exposed thermal pad. |+| 8 | K | passive | Cathode. Electrically common with pins 5, 6, 7, and the exposed thermal pad on the package underside; used as the primary heat-conduction path to the PCB. |+| 9 | K (Thermal Pad) | passive | Exposed thermal pad on package bottom, internally connected to the cathode. Must be soldered to the cathode copper plane for proper thermal (RθJC = 2.17 °C/W) and electrical performance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Bestirpower |+| Package | DFN-8(5x6) |+| Category | Silicon Carbide (SiC) Devices |+| Pins | 9 |++## Ordering variants++Same part, different packaging or reel option.++- `BCS65S04D3`++## CAD (KiCad official)++- Symbol: `BCS65S04D3`+- Footprint: `Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm`+- 3D model: DFN-8(5x6) (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Bestirpower datasheet](docs/bcs65s04d3-datasheet.pdf) (6 pp, sha256 `0b0acda3b1c3e052`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/bcs65s04d3-datasheet.pdf)
page.jsonadded+34
@@ -0,0 +1,34 @@+{+  "slug": "bcs65s04d3",+  "version": "0.1.0",+  "type": "component",+  "description": "Bestirpower SiC Diodes, DFN-8(5x6). Datasheet-verified pinout, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "silicon carbide (sic) devices",+    "bcs65s04d3"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "bcs65s04d3.kicad_sym",+    "bcs65s04d3.kicad_mod",+    "bcs65s04d3.glb",+    "bcs65s04d3.step",+    "bcs65s04d3.lbr",+    "docs/hero.png",+    "docs/bcs65s04d3-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html"+  ],+  "visibility": "public",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file